1 Ukusetyenziswa kwe-laser beam

Ukuxinana okuphezulu Ibhodi PCB Isakhiwo se-multi-layer, esahlulwe nge-resin e-insulating exutywe kunye nezixhobo zefiber zeglasi, kunye ne-conductive layer ye-copper foil ifakwe phakathi kwabo. Emva koko i-laminated kwaye iboshwe. Umzobo 1 ubonisa icandelo lebhodi ye-4-layer. Umgaqo wokusetyenzwa kwelaser kukusebenzisa imiqadi yelaser ukugxila kumphezulu wePCB ukunyibilika ngoko nangoko kwaye umphunga izinto zenze imingxunya emincinci. Ekubeni ubhedu kunye ne-resin zizinto ezimbini ezahlukeneyo, iqondo lokushisa lokunyibilika kwe-foil yobhedu yi-1084 ° C, ngelixa iqondo lokushisa elinyibilikayo le-resin ekhuselayo liyi-200-300 ° C kuphela. Ke ngoko, kuyafuneka ukuba ukhethe ngokufanelekileyo kwaye ulawule ngokuchanekileyo iiparamitha ezinje ngobude be-beam, imo, ububanzi, kunye ne-pulse xa kusenziwa i-laser.

1.1 Impembelelo ye-beam wavelength kunye nemowudi yokucubungula

Zeziphi izicelo zokusetyenzwa kwelaser kwimveliso yePCB enoxinano oluphezulu

Umzobo 1 Umbono we-Cross-sectional we-PCB ye-4-layer

Inokubonwa kwi-Figure 1 ukuba i-laser iqala ukucubungula i-foil yobhedu xa i-perforating, kwaye isantya sokuxutywa kobhedu kwi-laser sanda ngokunyuka kwe-wavelength. Izinga lokufunxa kwelaser ye-YAG/UV ye-351 ukuya kuma-355 m liphezulu ukuya kuma-70%. I-YAG/UV laser okanye indlela yemaski emiselweyo ingasetyenziselwa ukugqobhoza iibhodi eziqhelekileyo eziprintiweyo. Ukuze kwandiswe ukuhlanganiswa kwe-PCB enoxinano oluphezulu, umaleko ngamnye wefoyile yobhedu yi-18μm kuphela, kwaye i-resin substrate phantsi kwefoyile yobhedu inezinga eliphezulu lokufunxa kwe-carbon dioxide laser (malunga ne-82%), ebonelela ngeemeko zesicelo. i-carbon dioxide laser perforation. Ngenxa yokuba izinga lokuguqulwa kwe-photoelectric kunye nokusebenza kakuhle kwe-carbon dioxide laser iphezulu kakhulu kune-YAG / UV laser, okoko nje kukho amandla okwaneleyo ombane kunye ne-foil yobhedu icutshungulwa ukwandisa izinga lokuxutywa kwe-laser, i-carbon dioxide laser. ingasetyenziselwa ukuvula ngqo iPCB .

Imowudi yemowudi ye-laser beam inefuthe elikhulu kwi-divergence angle kunye nokuphuma kwamandla e-laser. Ukuze ufumane amandla aneleyo e-beam, kuyafuneka ukuba ube nemowudi efanelekileyo yokuphuma kwe-beam. Umbuso ofanelekileyo kukwenza i-low-order Gaussian mode output njengoko kuboniswe kuMzobo 2. Ngale ndlela, ubuninzi bamandla obuphezulu bunokufumaneka, okubonelela ngemfuneko yokuba i-beam igxininise kakuhle kwi-lens.

Zeziphi izicelo zokusetyenzwa kwelaser kwimveliso yePCB enoxinano oluphezulu

Umzobo 2 Imowudi yeGaussian enexabiso eliphantsi yokuhanjiswa kwamandla

Imodi ye-low-order ingafumaneka ngokuguqula iiparameters ze-resonator okanye ukufaka i-diaphragm. Nangona ukufakwa kwe-diaphragm kunciphisa ukukhutshwa kwamandla ombane, kunokunciphisa i-laser yemowudi ephezulu yokuthatha inxaxheba kwi-perforation kunye nokunceda ukuphucula ukujikeleza komngxuma omncinci. .

1.2 Ukufumana ii-micropores

Emva kokuba i-wavelength kunye nemo ye-beam ikhethiwe, ukuze ufumane umngxuma ofanelekileyo kwi-PCB, ububanzi bendawo kufuneka ilawulwe. Kuphela ukuba i-diameter yendawo incinci ngokwaneleyo, amandla anokugxila ekukhupheni ipleyiti. Zininzi iindlela zokunyenyisa idayamitha yendawo, ngakumbi ngokujolisa kwilensi engqukuva. Xa umqa wemowudi yeGaussian ingena kwilensi, idayamitha yendawo ekwindawo engasemva yelensi ingabalwa ngokumalunga nale fomyula ilandelayo:

D≈λF/(πd)

Kwifomula: F bubude obugxininisiweyo; d yindawo yeradiyasi ye-Gaussian beam evezwe ngumntu kumphezulu welensi; λ yilaser wavelength.

Inokubonwa kwifomula ukuba ubukhulu bedayamitha yesiganeko, incinci indawo ekugxilwe kuyo. Xa ezinye iimeko ziqinisekisiwe, ukucutha ubude bogxininiso kulungele ukunciphisa i-diameter ye-beam. Nangona kunjalo, emva kokuba u-F efinyeziwe, umgama phakathi kwe-lens kunye ne-workpiece uyancitshiswa. I-slag inokutshiza phezu kwe-lens ngexesha lokugaya, okuya kuchaphazela umphumo wokugaya kunye nobomi be-lens. Kule meko, isixhobo esincedisayo sinokufakwa kwicala le-lens kunye negesi isetyenziswe. Yenza ukucoca.

1.3 Iimpembelelo ze-beam pulse

I-laser ye-multi-pulse isetyenziselwa ukomba, kwaye ukuxinwa kwamandla e-laser pulsed kufuneka ubuncinane kufikelele kwiqondo lokushisa lokunyuka kwe-foil yobhedu. Ngenxa yokuba amandla e-laser ye-single-pulse ayancipha emva kokutshisa nge-foil yobhedu, i-substrate engaphantsi ayinakuchithwa ngokufanelekileyo, kwaye imeko eboniswe kwi-Fig. Nangona kunjalo, amandla e-beam akufanele abe phezulu kakhulu xa ubetha, kwaye amandla aphezulu kakhulu. Emva kokuba i-foil yobhedu ingene, ukuchithwa kwe-substrate kuya kuba kukhulu kakhulu, okubangelwa yimeko eboniswe kuMzobo 3b, ongekho ukulungelelaniswa kwe-post-processing yebhodi yesiphaluka. Okona kulungileyo ukwenza imingxunya emincinci enepateni yomngxuma othe chu njengoko kubonisiwe kumfanekiso 3c. Le pateni yomngxuma inokubonelela ngokulula kwinkqubo elandelayo yokufakwa kobhedu.

Zeziphi izicelo zokusetyenzwa kwelaser kwimveliso yePCB enoxinano oluphezulu

Umzobo 3 Iintlobo zemingxunya ezicutshungulwa ziilaser zamandla ezahlukeneyo

Ukuze ufezekise iphethini yomngxuma eboniswe kuMzobo 3c, i-pulsed laser waveform ene-front peak ingasetyenziswa (Umfanekiso 4). Amandla e-pulse ephezulu kwisiphelo sangaphambili angakwazi ukucima i-foil yobhedu, kwaye ii-pulses ezininzi ezinamandla aphantsi kwi-back end zinokutshisa i-substrate ekhuselayo kwaye Yenza umngxuma ube nzulu kuze kube yilapho i-foil yobhedu esezantsi.

Zeziphi izicelo zokusetyenzwa kwelaser kwimveliso yePCB enoxinano oluphezulu

Umzobo 4 Pulse laser waveform

2 Isiphumo se-Laser beam

Ngenxa yokuba izinto eziphathekayo zefoyile yobhedu kunye ne-substrate zihluke kakhulu, i-laser beam kunye nebhodi yesekethe idibanisa ukuvelisa iziphumo ezahlukeneyo, ezinempembelelo ebalulekileyo kwi-aperture, ubunzulu, kunye nohlobo lomngxuma we-micropores.

2.1 Ukubonakaliswa kunye nokufunxwa kwelaser

Ukusebenzisana phakathi kwe-laser kunye ne-PCB kuqala kuqala kwi-laser yesiganeko ebonakaliswe kwaye ifunnwe yi-foil yobhedu phezu komhlaba. Ngenxa yokuba ifoyile yobhedu inesantya esiphantsi kakhulu sokufunxa se-infrared wavelength carbon dioxide laser, kunzima ukusetyenzwa kwaye ukusebenza kakuhle kuphantsi kakhulu. Inxalenye efunxayo yamandla okukhanya iya kwandisa amandla e-electron kinetic yasimahla yento yobhedu, kwaye uninzi lwayo luya kuguqulwa lube ngamandla obushushu befoyile yobhedu ngokusebenzisana kwee-electron kunye ne-crystal lattices okanye i-ion. Oku kubonisa ukuba ngelixa uphucula umgangatho we-beam, kuyimfuneko ukuqhuba unyango lwangaphambili ebusweni be-foil yobhedu. Umphezulu wefoyile yobhedu unokugqunywa ngezinto ezinyusa ukufunxwa kokukhanya ukunyusa izinga lokufunxa kokukhanya kwelaser.

2.2 Indima ye-beam effect

Ngexesha lokucutshungulwa kwelaser, isibane sokukhanya sisasaza izinto zefoyile yobhedu, kwaye ifoyile yobhedu iyafudunyezwa ukuba ibe ngumphunga, kwaye iqondo lobushushu lomphunga liphezulu, ekulula ukulidiliza kunye ne-ionize, oko kukuthi, iplasma eyenziwe ngefoto yenziwa kukuvutha kokukhanya. . Iplasma eyenziwe ngefoto idla ngokuba yiplasma yomphunga wezinto ezibonakalayo. Ukuba amandla athunyelwe kwi-workpiece yi-plasma inkulu kunokulahlekelwa kwamandla okukhanya afunyenwe yi-workpiece ebangelwa ukufunxa kweplasma. Iplasma endaweni yoko yongeza ukufunxwa kwamandla e-laser ngumsebenzi. Ngaphandle koko, iplasma ivimba i-laser kwaye yenza buthathaka ukufunxwa kwelaser ngumsebenzi. Kwi-carbon dioxide lasers, iplasma eyenziwe ngefoto inokunyusa izinga lokufunxa kwefoyile yobhedu. Nangona kunjalo, i-plasma eninzi kakhulu iya kubangela ukuba umqadi uhlanjululwe xa udlula, nto leyo eya kuchaphazela ukuchaneka kokumiswa komngxuma. Ngokuqhelekileyo, ukuxinana kwamandla e-laser kulawulwa kwixabiso elifanelekileyo elingaphantsi kwe-107 W / cm2, enokulawula ngcono i-plasma.

Isiphumo sombhobho sidlala indima ebaluleke kakhulu ekwandiseni ukufunxwa kwamandla okukhanya kwinkqubo yokomba yelaser. I-laser iyaqhubeka nokutshisa i-substrate emva kokutshisa nge-foil yobhedu. I-substrate inokuthatha umthamo omkhulu wamandla okukhanya, i-vaporize ngobundlobongela kwaye yandise, kwaye uxinzelelo oluveliswayo lunokuba yinto etyhidiweyo iphonswa ngaphandle ukuze yenze imingxuma encinci. Umngxuma omncinci uphinde ugcwaliswe nge-plasma eyenziwe ngefoto, kwaye amandla e-laser angena kumngxuma omncinci anokuthi afunwe ngokupheleleyo ngokubonakaliswa kodonga lomngxuma kunye nesenzo seplasma (Umfanekiso 5). Ngenxa yokufunxwa kweplasma, ukuxinana kwamandla e-laser adlula kumngxuma omncinci ukuya ezantsi komngxuma omncinci kuya kuncipha, kwaye ukuxinana kwamandla e-laser ezantsi komngxuma omncinci kubalulekile ukuvelisa uxinzelelo oluthile lomoya ukugcina ubunzulu obuthile. umngxuma omncinci, omisela Ubunzulu bokungena kwenkqubo yomatshini.

Zeziphi izicelo zokusetyenzwa kwelaser kwimveliso yePCB enoxinano oluphezulu

Umzobo 5 I-laser refraction emngxunyeni

Isiphelo se-3

Ukusetyenziswa kobugcisa bokusetyenzwa kwelaser kunokuphucula kakhulu ukusebenza kakuhle kokomba kwemingxuma emincinci yePCB enoxinaniso. Iimvavanyo zibonisa ukuba: ① Ngokudityaniswa neteknoloji yolawulo lwamanani, ngaphezu kwe-30,000 micro-holes inokucutshungulwa ngomzuzu kwibhodi eprintiweyo, kwaye i-aperture iphakathi kwe-75 kunye ne-100; ② Ukusetyenziswa kwe-laser ye-UV kungenza ngakumbi ukuvuleka ngaphantsi kwe-50μm okanye encinci, eyenza iimeko zokwandisa ngakumbi indawo yokusetyenziswa kweebhodi zePCB.