Product : IC Substrate PCB
Material : DS-7409HG
Apa: 2Rarangi
Copper Thickness : 12um
Oti Matotoru: 0.24mm
Surface : Soft Gold
Hole Min: 0.15mm
Te matotoru koura 3U
Hoko Min / Mokowā: 0.35um / 0.35um
Application : IC Substrate PCB