The Farashin PCB shimfidawa na iya ƙuntatawa, amma madaidaicin saitin ƙa’idodin ƙira zai taimaka muku ƙira cikin nasara.

Ƙarin PCBS masu ci gaba suna ɗaukar ƙarin ayyuka a cikin ƙananan Spaces, galibi suna amfani da ics/soCs na al’ada, manyan yadudduka, da ƙaramin burbushi. Kafa shimfidar waɗannan ƙirar daidai yana buƙatar saiti mai ƙarfi na kayan aikin ƙirar da ke jagorantar doka wanda zai iya duba wayoyi da shimfidawa akan ƙa’idodin ƙira lokacin ƙirƙirar PCB. Idan kuna amfani da shimfidar HDI na farko, yana iya zama da wahala a ga waɗanne ƙa’idodin ƙira da ake buƙatar saitawa lokacin da kuka fara shimfidar PCB ɗin ku.

Saita tsarin PCB na HDI

Tare da HDI PCBS, akwai kaɗan da za a rarrabe waɗannan samfuran daga daidaitattun PCBS ban da bangaren da yawa na wayoyi. Na ga masu zanen kaya suna nuna cewa hukumar HDI wani abu ne da ke da ramukan miliyan 10 ko ƙasa da haka, miliyan 6 ko ƙasa da wayoyi, ko 0.5 mm ko ƙarancin tazara. Mai ƙera ku zai gaya muku cewa HDI PCBS tana amfani da ramukan makafi kusan mil 8 ko ƙasa da haka, kuma ƙananan ramukan makafi ana haƙa su da lasers.

In some ways, they are both true, because there is no specific threshold for the composition of an HDI PCB layout. Kowa zai iya yarda cewa da zarar ƙirar ta haɗa da microholes, allon HDI ne. A gefen ƙira, kuna buƙatar saita wasu ƙa’idodin ƙira kafin ku taɓa shimfidar. Yakamata ku tattara ƙarfin masana’anta kafin ku kafa ƙa’idodin ƙira. Da zarar kun yi wannan, kuna buƙatar saita ƙa’idodin ƙira da wasu ayyukan shimfidawa

Faɗin kebul da girman rami. The width of a trace with its impedance and line width will determine when you enter the HDI system. Da zarar faɗin wayoyin ya zama ƙaramin isa, ramukan za su yi ƙanƙantar da cewa dole ne a ƙera su kamar microholes.

Canje -canje na Layer. Ana buƙatar tsara ramukan ta hankali gwargwadon rabo, wanda kuma ya dogara da kaurin da ake buƙata. Layer transformations should be defined early so that they can be quickly placed during routing.

Sharewa. Dole ne a ware alamomi daga juna da sauran abubuwa (gammaye, majalisu, jirage, da sauransu) waɗanda ba na cibiyar sadarwa ba. Makasudin anan shine tabbatar da bin ƙa’idodin HDI DFM da hana wuce gona da iri.

Other wiring restrictions, such as cable length adjustment, maximum cable length, and allowable impedance deviation during wiring are also important, but they will apply outside the HDI board. The two most important points here are through-hole size and line width. Ana iya ƙaddara sharewa ta hanyoyi da yawa (alal misali, kwaikwayo) ko ta bin ƙa’idodin ƙa’idodin yatsa. Yi hankali da na ƙarshen, saboda wannan na iya haifar da yanayi inda akwai ƙyalli na ciki da yawa ko ƙarancin isasshen wayoyi.

Lamination da perforation

Rikicin HDI na iya kewayawa daga ‘yan kaɗan zuwa ɗimbin yadudduka don karɓar ƙimar da ake so. Boards with high-pin count fine-pitch BGA can have hundreds of connections per quadrant, so perforations need to be set up when creating layer stacks for HDI PCB layouts.

Idan kuka kalli mai sarrafa jakar Layer a cikin software na ƙirar PCB, maiyuwa ba za ku iya bayyana bayyanannun canje -canjen Layer azaman microholes ba. It doesn’t matter; Har yanzu kuna iya saita juzu’in Layer sannan saita iyakokin girman rami a cikin ƙa’idodin ƙira.

Wannan ikon kiran microchannel microhole yana da amfani sosai da zarar kun saita ƙa’idodin saiti kuma kun ƙirƙiri samfuri. Don saita ƙa’idodin ƙira don wayoyi ta cikin ramuka, zaku iya ayyana ƙa’idodin ƙira don amfani da microholes kawai. Wannan yana ba ku damar saita takamaiman iyakokin izini ta girman kushin da diamita rami.

Kafin fara saita ƙa’idodin ƙira, yakamata ku tuntuɓi masana’anta game da aikinsa. Sannan kuna buƙatar saita faɗin wayoyi a cikin ƙa’idar ƙira don tabbatar da cewa ana sarrafa ikon hana wayoyin a ƙimar da ake so. A wasu lokuta, ba a buƙatar sarrafa rashin ƙarfi, kuma har yanzu kuna iya iyakance faɗin wayoyi a kan allon HDI don kula da girman wayoyi mafi girma.

Faɗin layin tafiya

Kuna iya ƙayyade faɗin wayoyin da ake so ta hanyoyi da yawa. Na farko, don hanyoyin da ba a iya sarrafawa, kuna buƙatar ɗayan kayan aikin masu zuwa:

Yi lissafin girman alamar da ake buƙata tare da alkalami da takarda (hanya mai wuya)

Kalkaleta na kan layi (Hanyar sauri)

Magungunan filayen sun haɗa cikin ƙirar ku da kayan aikin shimfidawa (mafi daidaitaccen tsarin)

Abubuwa masu lahani na masu lissafin layi don lissafin abubuwan hanawa, kuma wannan ra’ayin ya shafi lokacin daidaita girman wayoyi don shimfidar HDI PCB.

Don saita faɗin layin, zaku iya ayyana shi azaman ƙuntatawa a cikin editan mulkin ƙira, kamar yadda kuka yi da girman rami. If you are not worried about impedance control, you can set any width. In ba haka ba, kuna buƙatar ƙayyade ƙimar impedance na lamination na PCB kuma shigar da wannan takamaiman nisa azaman tsarin ƙira.

Ana buƙatar daidaita hankali saboda faɗin waya bai kamata ya yi yawa ba don girman kushin. Idan faɗin layin kulawar rashin ƙarfi ya yi yawa, ya kamata a rage kaurin laminate, saboda wannan zai tilasta rage girman layin, ko kuma a iya ƙara girman kushin. Muddin girman dandamali ya wuce ƙimar da aka lissafa a cikin ma’aunin IPC, yana da kyau daga ra’ayi na dogaro.

sharewa

Bayan kammala manyan ayyuka biyu masu mahimmanci da aka nuna a sama, kuna buƙatar tantance rata alamar daidai. Abin takaici, tazara tsakanin burbushi bai kamata ya zama ƙa’idar 3W ko 3H na babban yatsa ba, saboda ba a yi amfani da waɗannan ƙa’idodin ba bisa ƙa’ida ga manyan allon da ke da siginar sauri. Maimakon haka, yana da kyau a kwaikwayi crosstalk a faɗin layin da aka gabatar kuma a duba idan an samar da ƙaramar hanya.