The I-HDI yePCI ubeko lunokuxinana kakhulu, kodwa iseti elungileyo yemigaqo yoyilo iya kukunceda uyile ngempumelelo.

Ukupakisha okungaphezulu kwePCBS ukusebenza ngakumbi kwiiNdawo ezincinci, zihlala zisebenzisa ii-ics / ii-soCs zesiko, iileya eziphezulu, kunye neendlela ezincinci. Ukuseta ubeko loyilo ngokuchanekileyo kufuna iseti enamandla yezixhobo zoyilo eziqhutywa ngumgaqo ezinokujonga intambo kunye noyilo ngokuchasene nemithetho yoyilo xa kusenziwa i-PCB. Ukuba usebenzisa uyilo lokuqala lwe-HDI, kunokuba nzima ukubona ukuba yeyiphi na imigaqo yoyilo ekufuneka isetwe xa uqala ubeko lwakho lwePCB.

Cwangcisa ubeko lwe-HDI ye-PCB

Nge-PCI ze-HDI, kuncinci ukwahlula ezi mveliso kwi-PCBS esemgangathweni ngaphandle kwecandelo kunye nokuxinana kweentambo. Ndibonile abaqulunqi besithi ibhodi ye-HDI yiyo nayiphi na into enemingxunya ezizigidi ezili-10 okanye ngaphantsi, i-6 yezigidi okanye ngaphantsi kweentambo, okanye i-0.5 mm okanye isithuba esingaphantsi kwepini. Umvelisi wakho uza kukuxelela ukuba ii-HDI PCBS zisebenzisa imingxunya engaboniyo emalunga ne-8 mil okanye ngaphantsi, kwaye imingxunya emincinci engaboniyo igrunjwe nge-lasers.

In some ways, they are both true, because there is no specific threshold for the composition of an HDI PCB layout. Wonke umntu angavuma ukuba xa uyilo lubandakanya ii-microholes, yibhodi ye-HDI. Kwicala loyilo, kuya kufuneka usete imigaqo yoyilo ngaphambi kokuba uchukumise ubeko. Kuya kufuneka uqokelele ubuchule bemveliso ngaphambi kokuseka imigaqo yoyilo. Nje ukuba wenze oku, kuya kufuneka usete imigaqo yoyilo kunye nokusebenza kokuma

Ububanzi beekheyibhile kunye nobukhulu bomngxunya. The width of a trace with its impedance and line width will determine when you enter the HDI system. Nje ukuba ububanzi be-wiring buba buncinci ngokwaneleyo, imingxunya yokungena iya kuba nincinci kangangokuba kufuneka yenziwe njengemicroholes.

Utshintsho lobeko. Imingxunya evulekileyo kufuneka yenziwe ngononophelo ngokwenqanaba lomlinganiso, elixhomekeke kubukhulu bendawo efunekayo. Layer transformations should be defined early so that they can be quickly placed during routing.

Ukucoca. Imizila kufuneka yahlulwe omnye komnye nakwezinye izinto (iiphedi, iindibano, iinqwelomoya, njl.) Ezingeyonxalenye yenethiwekhi. Injongo apha kukuqinisekisa ukuthotyelwa kwemithetho ye-HDI DFM kunye nokuthintela i-crosstalk egqithisileyo.

Other wiring restrictions, such as cable length adjustment, maximum cable length, and allowable impedance deviation during wiring are also important, but they will apply outside the HDI board. The two most important points here are through-hole size and line width. Ukucaciswa kunokugqitywa ngeendlela ezahlukeneyo (umzekelo, ukulinganisa) okanye ngokulandela imigaqo esemgangathweni yesithupha. Lumka okokugqibela, kuba oku kungakhokelela kwiimeko apho kukho i-crosstalk yangaphakathi kakhulu okanye ukungoneliseki kwe-wiring.

Yokulaminetha kunye perforation

Isitaki se-HDI singaqala ukusuka kumbalwa ukuya kuthi ga kwimigangatho yamanqanaba ukulungiselela uxinano lomzila olifunayo. Iibhodi ezinesikhonkwane sokubala okuphezulu kwe-BGA zinokuba namakhulu oqhagamshelo nge-quadrant nganye, ngenxa yoko i-perforations kufuneka isetelwe xa kusenziwa istaki somaleko we-HDI PCB.

Ukuba ujonga umphathi we-layer stack kwisoftware yoyilo lwe-PCB, usenokungakwazi ukuchaza ngokucacileyo uguquko oluthile lokwahlulahlula njengama-microholes. It doesn’t matter; Usenokuseta utshintsho lwomaleko kwaye emva koko usete umda wobungakanani bomngxunya kwimigaqo yoyilo.

Obu buchule bokubiza i-microchannel i-microhole iluncedo kakhulu xa usete imigaqo yokuseta kwaye wenza itemplate. Ukuseta imigaqo yoyilo lokufaka iintambo kwimingxunya, unokuchaza imigaqo yoyilo yokwenza isicelo kwimicroholes kuphela. Oku kukuvumela ukuba usete imida ethile yokukhutshwa ngobukhulu bepad kunye nobubanzi bemingxunya.

Ngaphambi kokuqala ukuseta imigaqo yoyilo, kuya kufuneka ubonisane nomenzi malunga nokusebenza kwayo. Kuya kufuneka ukuba usete ububanzi bocingo kumgaqo woyilo ukuze uqiniseke ukuba i-impedance ye-wiring ilawulwa kwixabiso olifunayo. Kwezinye iimeko, ulawulo lwe-impedance aludingeki, kwaye usenokufuna ukunciphisa ububanzi be-wiring kwibhodi ye-HDI ukugcina uxinano oluphezulu lwe-wiring.

Ububanzi bomgca wokuhamba

Unokumisela ububanzi be-wiring obunqwenelekayo ngeendlela ezininzi. Okokuqala, kulungelelwaniso olulawulwa yimpedance, ufuna esinye sezixhobo zilandelayo:

Bala ubungakanani bomkhondo obufunekayo ngepeni nephepha (indlela enzima)

I-Calculator ekwi-Intanethi (indlela ekhawulezayo)

Izixazululi zentsimi zidityaniswe kuyilo kunye nezixhobo zoyilo (eyona ndlela ichanekileyo)

Iingxaki zokubala kwemigca yokubala i-impedance ye-wiring, kunye nembono efanayo iyasebenza xa uhlengahlengisa ubungakanani beentambo ze-HDI PCB.

Ukuseta ububanzi bomgca, ungabuchaza njengesithintelo kumhleli womgaqo woyilo, njengoko wenzile ngobungakanani bomngxunya ongaphakathi. Ukuba awukhathazeki ngolawulo lwe-impedance, unokuseta nabuphi na ububanzi. Ngaphandle koko, kuya kufuneka ugqibe i-impedance curve ye-lamination ye-PCB kwaye ungene kububanzi obuthile njengomgaqo woyilo.

Ukulinganisa ngononophelo kuyafuneka kuba ububanzi bocingo akufuneki bube bukhulu kakhulu kubungakanani bephedi. Ukuba ububanzi bomgca wolawulo lwe-impedance bukhulu kakhulu, ubukhulu be-laminate kufuneka buncitshiswe, njengoko oku kuya kunyanzela ububanzi bomgca ukuba buncitshiswe, okanye ubungakanani bephedi bunokunyuswa. Logama ubungakanani beqonga budlula amaxabiso adweliswe kumgangatho we-IPC, kulungile ngokwendawo yokujonga ethembekileyo.

imvume

Emva kokugqiba le misebenzi ibalulekileyo iboniswe apha ngasentla, kuya kufuneka uchonge umsantsa wokulandela umkhondo. Ngelishwa, ukushiyana phakathi komkhondo akufuneki kungagqibeki kwimigaqo ye-3W okanye ye-3H yesithupha, njengoko le mithetho isetyenziswe ngokungachanekanga kwiibhodi eziphambili ezinemiqondiso yesantya esiphezulu. Endaweni yoko, ngumbono olungileyo ukulinganisa i-crosstalk kububanzi bomgca ocetywayo kwaye ujonge ukuba ngaba i-crosstalk egqithisileyo yenziwe.