The HDI PCB moralo o ka patisana haholo, empa melao e nepahetseng ea meralo e tla u thusa ho rala ka katleho.

PCBS e tsoetseng pele haholo e paka tšebetso e eketsehileng libakeng tse nyane, hangata e sebelisa ics / soCs tse ikhethileng, likarolo tse phahameng le lits’oants’o tse nyane. Ho theha moralo oa meralo ena ka nepo ho hloka lisebelisoa tse matla tse tsamaisoang ke melao tse ka lekolang wiring le moralo khahlanong le melao ea moralo ha o theha PCB. Haeba u sebelisa sebopeho sa hau sa HDI sa pele, ho kanna ha ba thata ho bona hore na ke melao efe ea meralo e lokelang ho beoa ha u qala sebopeho sa PCB.

Seta sebopeho sa HDI PCB

Ka HDI PCBS, ho na le ho honyenyane ho khetholla lihlahisoa tsena ho tsoa ho PCBS e tloaelehileng ntle le motsoako le bongata ba wiring. Ke bone baqapi ba supa hore boto ea HDI ke eng kapa eng e nang le masoba a limilione tse 10 kapa tse ka tlase, likhoele tse limilione tse 6 kapa ka tlase, kapa 0.5 mm kapa sebaka se tlase sa pini. Moetsi oa hau o tla u joetsa hore HDI PCBS e sebelisa masoba a foufetseng a ka bang mil tse 8 kapa ka tlase, mme masoba a manyane a foufetseng a chekiloe ka lasers.

In some ways, they are both true, because there is no specific threshold for the composition of an HDI PCB layout. Motho e mong le e mong a ka lumela hore hang ha moralo o kenyelletsa li-microholes, ke boto ea HDI. Ka lehlakoreng la moralo, o hloka ho beha melao ea moralo pele o ka ama sebopeho. O lokela ho bokella bokhoni ba moetsi pele o theha melao ea moralo. Hang ha u se u entse sena, u hloka ho theha melao ea moralo le ts’ebetso ea sebopeho

Boholo ba likhoele le litekanyo tsa lesoba. The width of a trace with its impedance and line width will determine when you enter the HDI system. Hang ha bophara ba wiring bo ba nyane ka ho lekana, masoba a koaloang a tla ba manyane haholo hoo a tlamehang ho etsoa joalo ka li-microholes.

Liphetoho tsa lera. Likoti tse kenang ka hare li hloka ho raloa ka hloko ho latela boholo ba likarolo, bo ipapisitseng le botenya ba lera bo hlokahalang. Layer transformations should be defined early so that they can be quickly placed during routing.

Tloso. Mehlala e tlameha ho arohanngoa le lintho tse ling (lipads, likopano, lifofane, jj.) Tseo e seng karolo ea marang-rang. Morero mona ke ho netefatsa ho latela melao ea HDI DFM le ho thibela crosstalk e fetelletseng.

Other wiring restrictions, such as cable length adjustment, maximum cable length, and allowable impedance deviation during wiring are also important, but they will apply outside the HDI board. The two most important points here are through-hole size and line width. Lits’oants’o li ka etsoa ka mekhoa e fapaneng (mohlala, ketsiso) kapa ka ho latela melaoana e tloaelehileng ea motona. E-ba hlokolosi ka tsa morao-rao, hobane sena se ka lebisa maemong a moo ho nang le crosstalk e ngata haholo ea kahare kapa ho se lekane ha wiring.

Lamination le pherekano

Sesebelisoa sa HDI se ka tloha ho tse ‘maloa ho isa ho tse ngata ho arola palo e batlang e le teng. Liboto tse nang le phini e phahameng ea palo e phahameng ea BGA li ka ba le likhokahano tse makholo ka kotara e le ‘ngoe, kahoo li-perforations li hloka ho hlophisoa ha ho etsoa mekotla ea mekato ea HDI PCB.

Haeba u sheba molaoli oa mokotla oa lera ho software ea moralo oa PCB, u kanna oa se khone ho hlalosa ka ho hlaka liphetoho tse itseng tsa lera joaloka li-microholes. It doesn’t matter; O ntse o ka hlophisa liphetoho tsa lera ebe o beha meeli ea boholo ba masoba melaong ea moralo.

Bokhoni bona ba ho bitsa microchannel microhole bo bohlokoa haholo ha o se o ipehetse melao ea ho seta le ho theha template. Ho beha melao ea moralo oa likhoele ka masoba, o ka hlalosa melao ea moralo hore e sebetse ho li-microholes feela. Sena se o nolofalletsa ho ipehela meeli e tobileng ka boholo ba pad le bophara ba lesoba.

Pele o qala ho beha melao ea moralo, o lokela ho buisana le moetsi ka tšebetso ea eona. Joale o hloka ho beha bophara ba wiring molaong oa moralo ho etsa bonnete ba hore impedance ea wiring e laoloa ka boleng bo batlang. Maemong a mang, taolo ea impedance ha e hlokehe, ‘me u ntse u ka batla ho fokotsa bophara ba wiring ho board ea HDI ho boloka bophahamo ba wiring e phahameng.

Tsamaea ka bophara ba mohala

O ka tseba bophara ba wiring bo batlang ka litsela tse ‘maloa. Taba ea mantlha, bakeng sa taolo e laoloang ea impedance, o hloka e ‘ngoe ea lisebelisoa tse latelang:

Fumana boholo ba mesaletsa e hlokahalang ka pene le pampiri (tsela e thata)

Calculator ea inthanete (Tsela e potlakileng)

Li-solver tsa masimong li kopantsoe le lisebelisoa tsa hau tsa meralo le moralo (mokhoa o nepahetseng ka ho fetesisa)

Litšitiso tsa li-calculator tsa mohala bakeng sa lipalo tsa impedance ea wiring, ‘me mohopolo o ts’oanang oa sebetsa ha o lokisa boholo ba wiring bakeng sa meralo ea HDI PCB.

Ho beha bophara ba mola, o ka bo hlalosa e le tšitiso ho mohlophisi oa melao ea moralo, joalo ka ha o entse ka boholo ba lesoba. Haeba o sa ts’oenyeha ka taolo ea impedance, o ka beha bophara bofe kapa bofe. Ho seng joalo, o lokela ho tseba hore na impedance mothinya oa PCB lamination le kena bophara ena e itseng e le molao-motheo moralo.

Ho leka-lekanya ka hloko hoa hlokahala hobane bophara ba terata ha boa lokela ho ba kholo haholo bakeng sa boholo ba pad. Haeba bophara ba mola oa taolo ea impedance bo le boholo haholo, botenya ba laminate bo lokela ho fokotsoa, ​​kaha sena se tla qobella bophara ba mola hore bo fokotsehe, kapa boholo ba pad bo ka eketsoa. Hafeela boholo ba sethala bo feta litekanyetso tse thathamisitsoeng ho maemo a IPC, ho lokile ho latela pono e tšepahalang.

rengwa

Kamora ho phethela mesebetsi e ‘meli ea bohlokoahali e bontšitsoeng kaholimo, o hloka ho tseba lekhalo le loketseng la mesaletsa. Ka bomalimabe, karohano lipakeng tsa lits’oants’o ha ea lokela ho fetoha melaoana ea leoto la 3W kapa 3H, kaha melao ena e sebelisoa hampe ho liboto tse tsoetseng pele tse nang le matšoao a lebelo le phahameng. Sebakeng seo, ke mohopolo o motle ho etsisa crosstalk bophahamong ba mola o reriloeng mme o shebe hore na crosstalk e fetelletseng e entsoe.