Hais txog txoj kev loj hlob tam sim no ntawm PCB technology, Kuv muaj cov kev xav hauv qab no:

1. Kev loj hlob raws txoj kev ntawm high-density interconnection technology (HDI)

Raws li HDI embodies cov thev naus laus zis tshaj plaws ntawm PCB tam sim no, nws nqa cov hlau zoo thiab me me aperture rau PCB. Ntawm cov HDI multi-layer board daim ntawv thov davhlau ya nyob twg cov khoom siv hluav taws xob-cov xov tooj ntawm tes (cov xov tooj ntawm tes) yog ib qho qauv ntawm HDI txoj kev loj hlob technology. Hauv cov xov tooj ntawm tes, PCB motherboard micro-wires (50μm ~ 75μm / 50μm ~ 75μm, hlau dav / qhov sib nrug) tau dhau los ua lub ntsiab. Tsis tas li ntawd, cov txheej txheem conductive thiab board thickness yog nyias; tus qauv conductive yog refined, uas coj high-density thiab high-kev ua tau zoo cov khoom siv hluav taws xob.

Ob xyoos dhau los, HDI tau txhawb nqa kev txhim kho ntawm cov xov tooj ntawm tes, coj mus rau kev txhim kho cov ntaub ntawv ua haujlwm thiab kev tswj hwm zaus ntawm LSI thiab CSP chips (pob khoom), thiab cov qauv substrates rau ntim. Nws kuj txhawb kev txhim kho ntawm PCBs. Yog li ntawd, nws yuav tsum txhim kho raws txoj kev HDI.

2. Cheebtsam embedding technology muaj zog vitality

Tsim cov khoom siv semiconductor (hu ua active Cheebtsam), cov khoom siv hluav taws xob (hu ua passive components) lossis passive Cheebtsam ntawm txheej txheej ntawm PCB. “Component embedded PCB” tau pib ntau lawm. Cov khoom siv embedded thev naus laus zis yog PCB kev ua haujlwm sib xyaw ua ke. Cov kev hloov pauv loj, tab sis simulation tsim qauv yuav tsum tau daws kom thiaj li tsim tau. Kev tsim khoom siv tshuab, kev tshuaj xyuas zoo, thiab kev ruaj ntseg kev ntseeg siab yog qhov tseem ceeb tshaj plaws.

Peb yuav tsum nce peev peev peev hauv cov tshuab suav nrog kev tsim, khoom siv, kev sim, thiab simulation txhawm rau kom muaj lub zog muaj zog.

Thib peb, kev tsim cov khoom siv hauv PCB yuav tsum tau txhim kho

Txawm hais tias nws yog PCB nruj lossis cov ntaub ntawv hloov pauv PCB, nrog rau kev lag luam thoob ntiaj teb ntawm cov khoom siv hluav taws xob tsis muaj hlau lead, cov ntaub ntawv no yuav tsum tau ua kom muaj cua sov ntau dua, yog li hom tshiab ntawm Tg siab, me me thermal expansion coefficient, me me dielectric tas li, thiab zoo heev dielectric. poob tangent kom tshwm.

Plaub, qhov kev cia siab rau optoelectronic PCBs yog dav

Nws siv cov txheej txheem kho qhov muag thiab txheej txheej hauv Circuit Court kom xa cov teeb liab. Tus yuam sij rau lub tshuab tshiab no yog tsim cov txheej txheem kho qhov muag (optical waveguide layer). Nws yog cov organic polymer uas yog tsim los ntawm txoj kev xws li lithography, laser ablation, thiab reactive ion etching. Tam sim no, cov thev naus laus zis no tau ua haujlwm hauv Nyiv thiab Tebchaws Meskas.

5. Cov txheej txheem tsim khoom yuav tsum tau hloov kho tshiab thiab cov cuab yeej siv siab heev yuav tsum tau qhia

1. Cov txheej txheem tsim khoom

HDI kev tsim khoom tau loj hlob tuaj thiab zoo li zoo meej. Nrog rau kev txhim kho ntawm PCB thev naus laus zis, txawm hais tias feem ntau siv cov txheej txheem kev tsim khoom lag luam yav dhau los tseem tseem ua tus thawj coj, cov txheej txheem nqi qis xws li cov txheej txheem ntxiv thiab ib nrab ntxiv tau pib tshwm sim.

Siv nanotechnology los ua qhov metallized thiab ib txhij tsim PCB conductive qauv, ib tug tshiab tsim txheej txheem txheej txheem rau saj zawg zog boards.

Kev ntseeg siab, kev luam ntawv zoo, txheej txheem inkjet PCB.

2. Cov cuab yeej siv siab heev

Kev tsim cov xov hlau zoo, cov duab thaij duab siab tshiab thiab cov khoom siv raug, thiab cov khoom siv laser ncaj qha raug.

Uniform plating khoom.

Cov khoom siv sib xyaw ua ke (passive active tivthaiv) kev tsim khoom thiab kev tsim khoom thiab cov chaw.