Mabapi le mokhoa oa hajoale oa ntlafatso ea PCB theknoloji, ke na le maikutlo a latelang:

1. Nts’etsopele tseleng ea theknoloji ea khokahanyo e phahameng haholo (HDI)

Ha HDI e kenyelletsa theknoloji e tsoetseng pele ka ho fetesisa ea PCB ea sejoale-joale, e tlisa terata e ntle le lesoba le lenyenyane ho PCB. Har’a lisebelisoa tsa HDI tse nang le likarolo tse ngata tsa lisebelisoa tsa elektroniki-liselefounu (liselefounu) ke mohlala oa theknoloji ea HDI e tsoetseng pele ea ntlafatso. Mehalang ea mehala, li-micro-wireboard tsa PCB (50μm～75μm/50μm～75μm, bophara ba terata / sebaka) li fetohile tse ka sehloohong. Ho phaella moo, lera conductive le boto botenya ba thinner; mokhoa oa conductive o hloekisitsoe, o tlisang lisebelisoa tsa elektronike tse phahameng haholo le tse sebetsang hantle.

Lilemong tse mashome a mabeli tse fetileng, HDI e khothalelitse nts’etsopele ea mehala ea thelefono, e lebisitseng ho nts’etsopele ea ts’ebetso ea tlhahisoleseling le taolo ea mantlha ea maqhubu a LSI le CSP chips (liphutheloana), le li-substrates tsa template bakeng sa ho paka. E boetse e khothalletsa ntshetsopele ya PCBs. Ka hona, e tlameha ho ntshetsa pele tseleng ea HDI.

2. Theknoloji ea ho kenya likarolo e na le matla a matla

Ho etsa lisebelisoa tsa semiconductor (tse bitsoang likarolo tse sebetsang), likarolo tsa elektronike (tse bitsoang li-passive components) kapa likaroloana tse sa sebetseng karolong e ka hare ea PCB. “Component embedded PCB” e qalile tlhahiso ea bongata. Theknoloji e kenyellelitsoeng ka karolo ke PCB e sebetsang ea potoloho e kopaneng. Liphetoho tse kholo, empa mekhoa ea moralo oa papiso e tlameha ho rarolloa e le hore e ntlafatse. Theknoloji ea tlhahiso, boleng ba tlhahlobo, le tiisetso ea ho tšepahala ke tsona tse tlang pele.

Re tlameha ho eketsa matsete a lisebelisoa lits’ebetsong tse kenyelletsang moralo, lisebelisoa, liteko le ketsiso molemong oa ho boloka matla a matla.

Taba ea boraro, nts’etsopele ea lisebelisoa ho PCB e lokela ho ntlafatsoa

Ebang ke PCB e thata kapa lisebelisoa tsa PCB tse feto-fetohang, ka ho ikopanya ha lichaba tsa lefatše tsa lihlahisoa tsa elektronike tse se nang loto, lisebelisoa tsena li tlameha ho etsoa ho thibela mocheso haholoanyane, kahoo mofuta o mocha oa Tg e phahameng, coefficient e nyenyane ea ho atolosa mocheso, dielectric constant e nyenyane, le dielectric tse ntle haholo. tahlehelo tangent dula e hlaha.

Ea bone, litebello tsa li-PCB tsa optoelectronic li pharaletseng

E sebelisa lera la tsela ea optical le lera la potoloho ho fetisa matšoao. Senotlolo sa theknoloji ena e ncha ke ho etsa lera la optical path (optical waveguide layer). Ke polymer ea tlhaho e entsoeng ka mekhoa e kang lithography, laser ablation, le reactive ion etching. Hona joale, theknoloji ena e entsoe ka indasteri Japane le United States.

5. Ts’ebetso ea tlhahiso e hloka ho nchafatsoa le lisebelisoa tse tsoetseng pele li hloka ho hlahisoa

1. Mokhoa oa Tlhahiso

Tlhahiso ea HDI e se e hōlile ‘me e atisa ho ba e phethahetseng. Ka nts’etsopele ea theknoloji ea PCB, le hoja mekhoa e tloaelehileng ea ho etsa lintho tse fokolang nakong e fetileng e ntse e laola, mekhoa e theko e tlaase e kang mekhoa ea ho eketsa le ea semi-additive e qalile ho hlaha.

Ho sebelisa nanotechnology ho etsa masoba metallized me ka nako e le ‘ngoe ho etsa lipaterone tsa conductive tsa PCB, mokhoa o mocha oa ts’ebetso ea ho etsa liboto tse tenyetsehang.

Mokhoa o phahameng oa ho ts’epahala, oa boleng bo holimo oa khatiso, ts’ebetso ea inkjet PCB.

2. Lisebelisoa tse tsoetseng pele

Ho hlahisa lithapo tse ntle, li-photomasks tse ncha tse nang le qeto e phahameng le lisebelisoa tsa ho pepeseha, le lisebelisoa tsa laser tse tobileng.

Lisebelisoa tsa ho pola ka mokhoa o tšoanang.

Karolo ea tlhahiso e kentsoeng (karolo e sebetsang e sa sebetseng) lisebelisoa tsa ho etsa le ho kenya lisebelisoa le lisebelisoa.