Regarding the current development trend of PCB technology, I have the following views:

1. Development along the path of high-density interconnection technology (HDI)

As HDI embodies the most advanced technology of contemporary PCB, it brings fine wire and tiny aperture to PCB. Among the HDI multi-layer board application terminal electronic products-mobile phones (cell phones) are a model of HDI’s cutting-edge development technology. In mobile phones, the PCB motherboard micro-wires (50μm～75μm/50μm～75μm, wire width/spacing) have become the mainstream. In addition, the conductive layer and board thickness are thinner; the conductive pattern is refined, which brings high-density and high-performance electronic equipment .

Over the past two decades, HDI has promoted the development of mobile phones, led to the development of information processing and basic frequency control LSI and CSP chips (packages), and template substrates for packaging. It also promotes the development of PCBs. Therefore, it must develop along the HDI road.

2. Component embedding technology has strong vitality

Forming semiconductor devices (called active components), electronic components (called passive components) or passive components on the inner layer of the PCB. “Component embedded PCB” has begun mass production. The component embedded technology is the PCB functional integrated circuit. Great changes, but simulation design methods must be solved in order to develop. Production technology, inspection quality, and reliability assurance are the top priorities.

We must increase resource investment in systems including design, equipment, testing, and simulation in order to maintain strong vitality.

Third, the development of materials in PCB should be improved

Whether it is rigid PCB or flexible PCB materials, with the globalization of lead-free electronic products, these materials must be made more heat-resistant, so the new type of high Tg, small thermal expansion coefficient, small dielectric constant, and excellent dielectric loss tangent keep appearing.

Fourth, the prospects for optoelectronic PCBs are broad

It uses the optical path layer and the circuit layer to transmit signals. The key to this new technology is to manufacture the optical path layer (optical waveguide layer). It is an organic polymer that is formed by methods such as lithography, laser ablation, and reactive ion etching. At present, this technology has been industrialized in Japan and the United States.

5. The manufacturing process needs to be updated and advanced equipment needs to be introduced

1. Üretim Süreci

HDI manufacturing has matured and tends to be perfect. With the development of PCB technology, although the commonly used subtractive manufacturing methods in the past still dominate, low-cost processes such as additive and semi-additive methods have begun to emerge.

Using nanotechnology to make holes metallized and simultaneously form PCB conductive patterns, a novel manufacturing process method for flexible boards.

High-reliability, high-quality printing method, inkjet PCB process.

2. Gelişmiş ekipman

Production of fine wires, new high-resolution photomasks and exposure devices, and laser direct exposure devices.

Uniform plating equipment.

Production component embedded (passive active component) manufacturing and installation equipment and facilities.