Panyaya yekuvandudzwa kwemaitiro ezvino PCB tekinoroji, ndine maonero anotevera:

1. Kubudirira munzira yemhando yepamusoro-density interconnection tekinoroji (HDI)

Sezvo HDI inomiririra tekinoroji yepamusoro yePCB yemazuva ano, inounza waya yakanaka uye diki aperture kuPCB. Pakati peHDI akawanda-layer board application terminal zvigadzirwa zvemagetsi-nharembozha (serura) muenzaniso weHDI yekucheka-kumucheto tekinoroji yekuvandudza. Munharembozha, iyo PCB motherboard micro-waya (50μm～75μm/50μm～75μm, waya hupamhi/spacing) dzave huru. Mukuwedzera, iyo conductive layer uye bhodhi ukobvu dzakatetepa; iyo conductive pateni inonatswa, iyo inounza yakakwirira-density uye yakakwirira-inoshanda michina yemagetsi .

Mumakumi maviri emakore adarika, HDI yakasimudzira kuvandudzwa kwenharembozha, zvakakonzera kuvandudzwa kweruzivo rwekugadzirisa uye basic frequency control LSI uye CSP chips (mapakeji), uye template substrates yekurongedza. Inokurudzirawo kuvandudzwa kwePCBs. Naizvozvo, inofanirwa kusimudzira munzira yeHDI.

2. Component embedding tekinoroji ine simba rakasimba

Kugadzira semiconductor madivayiri (anonzi anoshanda components), electronic components (zvinonzi passive components) kana passive components pane yemukati layer yePCB. “Component embedded PCB” yatanga kugadzirwa kwakawanda. Icho chikamu chakamisikidzwa tekinoroji ndiyo PCB inoshanda yakabatanidzwa dunhu. Shanduko dzakakura, asi nzira dzekugadzira dzekunyepedzera dzinofanirwa kugadziriswa kuti dzisimbe. Tekinoroji yekugadzira, mhando yekuongorora, uye vimbiso yekuvimbika ndizvo zvinonyanya kukosha.

Isu tinofanirwa kuwedzera mari yekushandisa mumasisitimu anosanganisira dhizaini, zvishandiso, kuyedza, uye simulation kuitira kuchengetedza simba rakasimba.

Chechitatu, kuvandudzwa kwezvinhu muPCB kunofanira kuvandudzwa

Ingave yakaomarara PCB kana inochinjika PCB zvinhu, nekudyidzana kwepasirese kweasina lead-isina zvigadzirwa zvemagetsi, zvinhu izvi zvinofanirwa kuitwa zvakanyanya-kusapisa kupisa, saka rudzi rutsva rwepamusoro Tg, diki yekuwedzera kupisa kwekuwedzera, diki dielectric inogara, uye yakanakisa dielectric. kurasikirwa tangent ramba uchionekwa.

Chechina, tarisiro ye optoelectronic PCBs yakakura

Inoshandisa optical nzira layer uye dunhu redunhu kuendesa masaini. Kiyi yeiyi tekinoroji nyowani kugadzira iyo optical nzira layer (optical waveguide layer). Iyo organic polymer inoumbwa nenzira dzakadai selithography, laser ablation, uye reactive ion etching. Parizvino, tekinoroji iyi yakagadziridzwa muJapan neUnited States.

5. Nzira yekugadzira inoda kuvandudzwa uye michina yepamusoro inoda kuiswa

1. Kugadzira Maitiro

Kugadzirwa kweHDI kwakura uye kunowanzo kuve kwakakwana. Nekuvandudzwa kwePCB tekinoroji, kunyangwe nzira dzaiwanzo shandiswa dzekubvisa dzekugadzira munguva yakapfuura dzichiri kutonga, maitiro akaderera akadai sekuwedzera uye semi-add nzira atanga kubuda.

Kushandisa nanotechnology kugadzira maburi esimbi uye panguva imwe chete kugadzira PCB conductive mapatani, inoveli yekugadzira nzira yekugadzira mabhodhi anochinjika.

Kuvimbika kwepamusoro, nzira yekudhinda yemhando yepamusoro, inkjet PCB process.

2. Zvigadzirwa zvemberi

Kugadzirwa kwewaya dzakanaka, nyowani yepamusoro-resolution photomasks uye exposure zvishandiso, uye laser yakananga exposure zvishandiso.

Uniform plateting equipment.

Chikamu chekugadzira chakamisikidzwa (passive active component) kugadzira uye kuisa michina uye zvivakwa.