Ngokumalunga nentsingiselo yangoku yophuhliso lwe PCB iteknoloji, ndinezi mbono zilandelayo:

1. Uphuhliso ecaleni kwendlela yeteknoloji yoqhagamshelwano oluphezulu (HDI)

Njengoko i-HDI iquka eyona teknoloji iphambili ye-PCB yangoku, izisa ucingo olucokisekileyo kunye nokuvula okuncinci kwi-PCB. Phakathi kwe-HDI ye-multi-layer yesicelo sebhodi ye-terminal yeemveliso ze-elektroniki-iifowuni eziphathwayo (iiselfowuni) ngumzekelo weteknoloji yophuhliso lwe-HDI. Kwiifowuni eziphathwayo, i-PCB motherboard micro-wires (50μm～75μm/50μm～75μm, ububanzi bocingo/isithuba) ziye zaba zezona ziphambili. Ukongeza, i-conductive layer kunye nobukhulu bebhodi buncinci; iphethini ye-conductive iphuculwe, ezisa ubuninzi obuphezulu kunye nokusebenza okuphezulu kwezixhobo ze-elektroniki.

Kule minyaka ingamashumi amabini idlulileyo, i-HDI ikhuthaze ukuphuhliswa kweefowuni eziphathwayo, okukhokelela ekuphuhlisweni kokulungiswa kolwazi kunye nolawulo olusisiseko lwe-LSI kunye ne-CSP chips (iiphakheji), kunye ne-template substrates yokupakisha. Ikwakhuthaza nophuhliso lweePCBs. Ke ngoko, kufuneka iphuhlise ecaleni kwendlela ye-HDI.

2. Itekhnoloji yokufakela icandelo linobomi obunamandla

Ukwenza izixhobo zesemiconductor (ekuthiwa ngamacandelo asebenzayo), amacandelo e-elektroniki (abizwa ngokuba ngamacandelo okwenziwa kokwenziwa) okanye amacandelo okwenziwa kumaleko angaphakathi we-PCB. “I-PCB efakwe kwi-Component” iqalile ukuveliswa ngobuninzi. Itekhnoloji edibeneyo yecandelo yi-PCB esebenzayo yesekethe edibeneyo. Utshintsho olukhulu, kodwa iindlela zoyilo lokulinganisa kufuneka zisonjululwe ukuze kuphuhliswe. Itekhnoloji yemveliso, umgangatho wokuhlola, kunye nokuqinisekiswa kokuthembeka zizinto eziphambili eziphambili.

Kufuneka sandise utyalo-mali lwezibonelelo kwiinkqubo ezibandakanya uyilo, izixhobo, uvavanyo, kunye nokulinganisa ukuze kugcinwe amandla okuqina.

Okwesithathu, uphuhliso lwemathiriyeli kwi-PCB kufuneka luphuculwe

Nokuba i-PCB eqinile okanye izinto eziguquguqukayo ze-PCB, kunye nokudityaniswa kwemveliso ye-elektroniki engena lead, ezi zixhobo kufuneka zenziwe zikwazi ukumelana nobushushu, ngoko ke uhlobo olutsha lwe-Tg ephezulu, i-coefficient yokwandiswa kwe-thermal encinci, i-dielectric encinci engaguqukiyo, kunye ne-dielectric egqwesileyo. ilahleko tangent iqhubeka ukubonakala.

Okwesine, ithemba le-optoelectronic PCBs libanzi

Isebenzisa i-optical path layer kunye ne-circuit layer ukuhambisa iimpawu. Isitshixo kule teknoloji intsha kukwenza umaleko wendlela ye-optical (i-optical waveguide layer). Yipolymer ephilayo eyenziwa ngeendlela ezifana ne-lithography, i-laser ablation, kunye ne-ion etching esebenzayo. Okwangoku, le teknoloji iphuhliswe eJapan nase-United States.

5. Inkqubo yokwenziwa kwezinto kufuneka ihlaziywe kwaye kufuneka kuqaliswe izixhobo eziphezulu

1. Inkqubo yokuThengisa

Imveliso ye-HDI ikhulile kwaye ithande ukugqibelela. Ngophuhliso lwetekhnoloji yePCB, nangona iindlela zokuvelisa ezisetyenziswa ngokuqhelekileyo kwixesha elidlulileyo zisalawula, iinkqubo ezinexabiso eliphantsi ezifana neendlela zokudibanisa kunye ne-semi-additive sele ziqalile ukuvela.

Ukusebenzisa i-nanotechnology ukwenza imingxunya eyenziwe ngesinyithi kwaye ngaxeshanye yenze iipateni zokuqhuba ze-PCB, indlela yokuvelisa inoveli yeebhodi eziguquguqukayo.

Ukuthembeka okuphezulu, indlela yoshicilelo oluphezulu, inkqubo ye-inkjet yePCB.

2. Izixhobo eziphezulu

Ukuveliswa kweengcingo ezilungileyo, ii-photomasks ezichanekileyo eziphezulu kunye nezixhobo zokuvezwa, kunye nezixhobo ze-laser zokuvezwa ngokuthe ngqo.

Izixhobo zokufaka izinto ezifanayo.

Icandelo lemveliso elizinzisiweyo (icandelo elisebenzayo elisebenzayo) ukuvelisa kunye nofakelo izixhobo kunye nezibonelelo.