E pili ana i ke au ulu o keia wa PCB ʻenehana, loaʻa iaʻu nā manaʻo penei:

1. Hoʻomohala ma ke ala o ka ʻenehana hoʻohui kiʻekiʻe (HDI)

Ke hoʻokomo nei ʻo HDI i ka ʻenehana ʻoi loa o ka PCB o kēia manawa, lawe mai ia i ka uea maikaʻi a me ka puka liʻiliʻi i ka PCB. Ma waena o ka HDI multi-layer board application terminal electronic products-mobile phones (cellphones) he kumu hoʻohālike o ka ʻenehana hoʻomohala ʻokiʻoki o HDI. Ma nā kelepona paʻalima, ua lilo ka PCB motherboard micro-wires (50μm～75μm/50μm～75μm, wire width/spacing) i mea nui. Eia kekahi, ʻoi aku ka lahilahi o ka papa conductive a me ka mānoanoa o ka papa; hoʻomaʻemaʻe ʻia ke ʻano conductive, e lawe mai ana i nā lako uila kiʻekiʻe a me ka hana kiʻekiʻe.

I loko o nā makahiki he ʻelua i hala iho nei, ua hoʻolaha ʻo HDI i ka hoʻomohala ʻana i nā kelepona paʻalima, i alakaʻi ʻia i ka hoʻomohala ʻana i ka hoʻoponopono ʻike a me ka mana alapine maʻamau LSI a me CSP chips (packages), a me nā substrates template for packaging. Hoʻoikaika ia i ka hoʻomohala ʻana o nā PCB. No laila, pono e hoʻomohala ma ke alanui HDI.

2. He ikaika ko ka ʻenehana hoʻokomo ʻana i ka ʻenehana

Ka hana ʻana i nā mea semiconductor (i kapa ʻia nā ʻāpana hana), nā ʻāpana uila (i kapa ʻia nā ʻāpana passive) a i ʻole nā ​​​​mea passive ma ka papa o loko o ka PCB. Ua hoʻomaka ka “Component embedded PCB” i ka hana nui. ʻO ka ʻenehana i hoʻopili ʻia ʻo ka PCB functional integrated circuit. Nui nā loli, akā pono e hoʻoholo i nā ʻano hana hoʻolālā simulation i mea e hoʻomohala ai. ʻO ka ʻenehana hana, ka maikaʻi o ka nānā ʻana, a me ka hōʻoia ʻana i ka hilinaʻi ka mea nui.

Pono mākou e hoʻonui i ka waiwai waiwai i nā ʻōnaehana me ka hoʻolālā, nā mea hana, ka hoʻāʻo ʻana, a me ka simulation i mea e mālama ai i ke ola ikaika.

ʻO ke kolu, pono e hoʻomaikaʻi ʻia ka hoʻomohala ʻana o nā mea ma PCB

Inā he PCB paʻa a i ʻole nā ​​mea PCB maʻalahi, me ka hoʻonui ʻia ʻana o nā huahana uila me ke alakaʻi ʻole, pono e hoʻonui ʻia kēia mau mea i ka wela, no laila ke ʻano hou o Tg kiʻekiʻe, liʻiliʻi thermal expansion coefficient, liʻiliʻi dielectric mau, a me ka dielectric maikaʻi loa. ʻike mau ʻia ka tangent poho.

ʻO ka hā, he ākea ka manaʻolana no nā PCB optoelectronic

Hoʻohana ia i ka ʻaoʻao ala optical a me ka ʻāpana kaapuni e hoʻouna i nā hōʻailona. ʻO ke kī o kēia ʻenehana hou, ʻo ia ka hana ʻana i ka papa ala optical (optical waveguide layer). He polymer organik ia i hana ʻia e nā ʻano e like me ka lithography, laser ablation, a me ka reactive ion etching. I kēia manawa, ua hana ʻia kēia ʻenehana ma Iapana a me ʻAmelika Hui Pū ʻIa.

5. Pono e hoʻonui i ka hana hana a pono e hoʻokomo i nā mea hana kiʻekiʻe

1. Ke Kaʻina Hana

Ua oʻo ka hana ʻana o HDI a makemake e hemolele. Me ka hoʻomohala ʻana o ka ʻenehana PCB, ʻoiai ʻo nā ʻano hana subtractive maʻamau i hoʻohana ʻia i ka wā i hala, ua hoʻomaka e puka mai nā kaʻina hana haʻahaʻa e like me ka additive a me ka semi-additive.

Ke hoʻohana nei i ka nanotechnology no ka hana ʻana i nā lua metala a i ka manawa like me ka hana ʻana i nā mamana conductive PCB, kahi kaʻina hana hana hou no nā papa maʻalahi.

Kiʻekiʻe-hilinaʻi, kiʻekiʻe kiʻekiʻe-koʻikoʻi paʻi hana, inkjet PCB kaʻina.

2. Nā lakohana holomua

Iecaianoaaiiuo o ka maikai uea, hou kiʻekiʻe-hoʻonā photomasks a me ka wehe ‘ana mea, a me ka laser ike pololei.

ʻO nā lako hoʻopaʻa like.

Hoʻokomo ʻia nā mea hana (passive active component) hana a hoʻokomo i nā lako a me nā mea pono.