Mayelana nendlela yamanje yentuthuko ye PCB ubuchwepheshe, nginokubuka okulandelayo:

1. Ukuthuthukiswa kwendlela yobuchwepheshe bokuxhumana obusondelene kakhulu (HDI)

Njengoba i-HDI ihlanganisa ubuchwepheshe obuthuthuke kakhulu be-PCB yesimanje, iletha ucingo oluhle kanye nembobo encane ku-PCB. Phakathi kwe-HDI ye-multi-layer board application terminal products electronics-cell phones (omakhalekhukhwini) kukhona imodeli yobuchwepheshe bokuthuthukiswa kwe-HDI obusezingeni eliphezulu. Kumafoni aphathwayo, izintambo ezincane zebhodi lomama le-PCB (50μm～75μm/50μm～75μm, ububanzi bentambo/isikhala) seziphenduke insakavukela. Ngaphezu kwalokho, ungqimba lwe-conductive kanye nokuqina kwebhodi kuncane; iphethini ye-conductive icwengisisiwe, okuletha ukuminyana okuphezulu kanye nemishini ye-elekthronikhi esebenza kahle kakhulu .

Emashumini amabili eminyaka adlule, i-HDI ikhuthaze ukuthuthukiswa komakhalekhukhwini, okuholele ekuthuthukisweni kokucutshungulwa kolwazi kanye nokulawulwa kwamafrikhwensi ayisisekelo e-LSI nama-CSP chips (amaphakheji), nama-substrates ezifanekiso zokupakisha. Iphinde ikhuthaze ukuthuthukiswa kwama-PCB. Ngakho-ke, kufanele ithuthuke eduze nomgwaqo we-HDI.

2. Ubuchwepheshe bokushumeka ingxenye bunamandla aqinile

Ukwakha amadivaysi e-semiconductor (abizwa ngokuthi izingxenye ezisebenzayo), izingxenye ze-elekthronikhi (ezibizwa ngokuthi i-passive components) noma izingxenye ze-passive kungqimba lwangaphakathi lwe-PCB. I-“Component embedded PCB” isiqalile ukukhiqizwa ngobuningi. Ubuchwepheshe obushumekiwe yisekethe ehlanganisiwe ye-PCB. Izinguquko ezinkulu, kodwa izindlela zokuklama ukulingisa kufanele zixazululwe ukuze kuthuthukiswe. Ubuchwepheshe bokukhiqiza, ikhwalithi yokuhlola, nokuqinisekisa ukwethembeka yizinto eziza kuqala kuqala.

Kufanele sikhulise utshalomali lwezinsiza kumasistimu afaka ukuklama, okokusebenza, ukuhlola, nokulingisa ukuze sigcine ubungqabavu obuqinile.

Okwesithathu, ukuthuthukiswa kwezinto ku-PCB kufanele kuthuthukiswe

Kungakhathaliseki ukuthi i-PCB eqinile noma izinto ze-PCB eziguquguqukayo, ngokuhwebelana kwembulunga yonke kwemikhiqizo ye-elekthronikhi engenamthofu, lezi zinto kufanele zenziwe zikwazi ukumelana nokushisa, ngakho-ke uhlobo olusha lwe-Tg ephezulu, i-coefficient encane yokwandisa okushisayo, i-dielectric constant encane, kanye ne-dielectric enhle kakhulu. i-tangent yokulahlekelwa ilokhu ivela.

Okwesine, amathemba ama-optoelectronic PCBs abanzi

Isebenzisa ungqimba lwendlela yokubona kanye nongqimba lwesifunda ukuze idlulise amasignali. Isihluthulelo salobu buchwepheshe obusha ukwenza isendlalelo sendlela ye-optical (i-optical waveguide layer). Kuyi-polymer ephilayo eyakhiwe ngezindlela ezifana ne-lithography, i-laser ablation, kanye ne-reactive ion etching. Njengamanje, lobu buchwepheshe buthuthukisiwe eJapan nase-United States.

5. Inqubo yokukhiqiza idinga ukubuyekezwa futhi imishini esezingeni eliphezulu idinga ukwethulwa

1. Inqubo Yokukhiqiza

Ukukhiqizwa kwe-HDI sekukhulile futhi kuvame ukuphelela. Ngokuthuthuka kobuchwepheshe be-PCB, nakuba izindlela zokukhiqiza ezisetshenziswayo ezivame ukusetshenziswa esikhathini esidlule zisabusa, izinqubo ezingabizi kakhulu ezifana nezindlela zokwengeza kanye ne-semi-additive seziqalile ukuvela.

Kusetshenziswa i-nanotechnology ukwenza izimbobo zenziwe ngensimbi futhi ngesikhathi esisodwa kwakha amaphethini e-PCB conductive, indlela yokukhiqiza inoveli yamabhodi avumelana nezimo.

Ukuthembeka okuphezulu, indlela yokuphrinta yekhwalithi ephezulu, inqubo ye-inkjet PCB.

2. Imishini esezingeni eliphezulu

Ukukhiqizwa kwezintambo ezinhle, ama-photomasks amasha anokulungiswa okuphezulu namadivayisi asobala, namadivayisi e-laser okuchayeka okuqondile.

Imishini yokufaka iyunifomu.

Ingxenye yokukhiqiza eshumekiwe (ingxenye esebenzayo yokwenziwa) imishini yokukhiqiza nokufaka kanye nezinsiza.