Cum incremento ambitus integrati output mutandi celeritatem et PCB tabula density, Signal Integrity has become one of the issues that must be concerned in high-speed digital PCB design. The parameters of components and PCB board, the layout of components on PCB board, the wiring of high-speed Signal line and other factors, Can cause problems with signal integrity.

For PCB layouts, signal integrity requires a board layout that does not affect signal timing or voltage, while for circuit wiring, signal integrity requires termination elements, layout strategies, and wiring information. Maximum signum celeritatis in PCB, falsa collocatione partium finium, vel falsae wiring signa summae celeritatis signa simplicitatis causare possunt problemata, quae systema ad falsas notitias outputare possunt, ambitus ad minus operandum vel omnino non laborandum. Quomodo egregia integritas in plena consideratione capienda et efficax moderatio mensurarum in consilio PCB calido argumento factus est in industria consilio PCB.

Forsit signum integritatis Bonum signum integritatis significat signum respondere posse rectis valoribus sincere et intentione campestri cum opus fuerit. E converso, quando signum proprie non respondet, est quaestio integritatis signum. Insignis integritas problemata ducere possunt vel directe ducere ad corruptelam, timidam errores, falsas notitias, inscriptiones et lineas moderandas, systematis misoperationem, vel etiam ratio ruinae. In processu PCB consilio usu, populus multus of PCB consilio praecepta collegerunt. In consilio PCB, signum integritatis PCB melius obtineri potest a diligenter referendo ad has regulas designatas.

Cum cogitamus PCB, primum debemus intelligere consilium informationis totius circuli tabulae, quae maxime includit;

1. The number of devices, device size, device package, chip rate, whether PCB is divided into low speed, medium speed and high speed area, which is the interface input and output area;

2. The overall layout requirements, device layout location, whether there is a high power device, chip device heat dissipation special requirements;

3. Typus signorum lineae, directio velocitatis et transmissionis, impedimentum imperium exigentias lineae signo dato, velocitas directio et situ pulsis, clavis signa et mensuras tutelae;

4. Genus potentiae copia, genus humi, strepitus tolerantiae requisita ad potentiam copiam et humum, occasum et justos potentiae copiam et planum humi;

5. Genera et rates linearum horologii, principium et directio linearum horologii, horologii mora requisita, linea longissima requisita.

Nunc PCB design

Post praecipuam informationem circa tabulas intelligendas, necesse est ut ratio exigentias circa tabulas sumptus et insignem integritatem perpendat, et rationabilem numerum laminis wiring eligere. At present, the circuit board has gradually developed from single layer, double layer and four layer to more multi-layer circuit board. Multi-layer PCB design can improve the reference surface of signal routing and provide backflow path for signal, which is the main measure to achieve good signal integrity. When designing PCB layering, follow the following rules:

1. Planum potius referendum erit ad planum humum. Utraque potentia copia et terra planum adhiberi potest ut planum referat, et utrumque munus munit. Attamen effectus protegens potentiae supplere planum est multo humilius quam plani loci propter altiorem proprietatem impedimenti et maioris potentiae differentiam inter potentiam suppeditat planum et planitiem referentia.

2. Digital circuit and analog circuit are layered. Ubi ratio expensarum permittit, optimum est circulos digitales et analogos in stratis separatis disponere. If must want to arrange in same wiring layer, can use ditch, add earthing line, the method such as dividing line to remedy. Analogia et digitalis potentia et terra separari debent, numquam mixta.

3. Clavis signo fuso in stratis adjacentibus area segmentationis non transit. Signa magnum signum trans regionem ansam formabunt et radios fortes generabunt. If the signal cable must cross the area when the ground cable is divided, a single point can be connected between the ground to form a connection bridge between the two ground points, and then the cable can be routed through the connection bridge.

4. Planum humus infra superficiem componentem esse debet relative integra. Simplicitas plani humi pro multilateri lamina quantum fieri potest servanda est. Nullum signum lineae normaliter in plano terram currere licet.

V, alta frequentia, altum celeritatem, horologium et aliae lineae clavem signo adiacentibus planum habere debent. In this way, the distance between signal line and ground line is only the distance between PCB layers, so the actual current always flows in the ground line directly below the signal line, forming the smallest signal loop area and reducing radiation.

How to design the signal of integrity PCB

PCB layout design

Clavis insigni integritatis designationis tabulae impressae est layout et wiring, quae directe ad PCB observantia refertur. Prior to layout, the PCB size must be determined to meet the function at the lowest possible cost. Si PCB nimis amplus et distributus est, linea transmissionis longissima esse potest, inde in impedimento aucta, resistentia sonitus reducta, sumptus aucta. If the components are placed together, heat dissipation is poor, and coupling crosstalk may occur in adjacent wiring. Propositum igitur ponendum est in unitatibus functionis circuli, considerans compatibilitatem electromagneticam, calor dissipationis et factores instrumenti.

Cum pono PCB cum signo mixto digitali et analogo, non miscentur signa digitales et analogon. Si signa analoga et digitales misceri debent, fac ut linea perpendiculariter ad effectum coeundi redigendos. Circuitus digitalis, circuitus analogus, et sonitus generans, circuii in tabula circuii debet separari, et sensitivus circuii primo debet fugari, et coitu inter gyros eliminari. Praesertim considera horologium, lineas reset et interrumpendas, has lineas altas lineas transitorias currentes non parallelas, aliter facile per signa copulae electromagneticas laeditur, reseto inopinato causando vel interrumpendum. The overall layout should follow the following principles:

1. Partitio functionis extensionis, circuitus analogi et circuli digitalis in PCB varias extensiones spatii habere debet.

2. Secundum signum circuii est processus ad functiones circuli unitates disponere, ita ut signum fluat ad eandem partem tuendam.

3. Take the core components of each functional circuit unit as the center, and other components are arranged around it.

4. Connexionem inter praecipua frequentia quam maxime minuere ac parametri distributionem minuere conantur.

5. Easily disturbed components should not be too close to each other, input and output components should be far away.

How to design the signal of integrity PCB

PCB wiring design

Omnes signum lineae ante PCB wiring indicari debent. First of all, clock line, sensitive signal line, and then high-speed signal line, in order to ensure that this kind of signal through the hole is enough, distribution parameters of good characteristics, and then general unimportant signal line.

Incompatible signal lines should be far away from each other and do not parallel wiring, such as digital and analog, high speed and low speed, high current and small current, high voltage and low voltage. Signi funes in diversis stratis verticaliter ad invicem fusi sunt ut crosstalk redigerent. Dispositio linearum signorum optime disposita est secundum directionem signorum. In output signum lineae circuitionis ad input signum lineae area retractari non debet. High-speed signal lines should be kept as short as possible to avoid interfering with other signal lines. In duplici tabula, si opus est, filum de humo solitario adici potest ab utraque parte lineae signo summus velocitatis. Omnes lineae horologii altae velocitatis in tabula multilateri muniti debent secundum lineas horologii longitudinem.

Principia communia ad wiring sunt:

1. Quantum fieri potest, humilium densitatis wiring designa, et insigne wiring, quantum fieri potest, crassitudine constanti, impedimento congruens conducit. Nam rf circuii, inrationabilis designatio rectae directionis signatae, latitudo et spatium lineae causare possunt impedimentum transire inter lineas transmissas signo.

2. Quantum fieri potest, ne filis input et output adjacent et longum intervallum wiring parallela. Ut linearum signorum parallelarum transversim reducas, spatium inter lineas signos augeri potest, vel cingula solitaria inter lineas signos inseri possunt.

3. Linea latitudo super PCB uniformis erit et nulla linea latitudo mutationis occurret. PCB wiring anfractus uti non debet 90 gradus anguli, uti arcui vel 135 gradibus Angulus, quantum fieri potest, ad continuitatem linee impedimenti conservandam.

4. Minimize the area of the current loop. The external radiation intensity of current-carrying circuit is proportional to the current passing through, the loop area and the square of signal frequency. Reducing the current loop area can reduce the ELECTROMAGNETIC interference of PCB.

5. Quantum fieri potest reducere longitudinem fili, latitudinem fili auge, ad minuendum impedimentum filum conducit.

6. Ad commutandum imperium significationibus, numerus SIGNI PCB wiring qui mutat statum simul quoad fieri potest minuendus est.