Key production process control of high level PCB

1. Intshayelelo yokutolika izibizo
Isiphaluka esishicilelweyo-kumphezulu wento ebambekayo, ibonelela ngendlela yokuhamba kombane phakathi kwezinto, kubandakanya nezinto ezikhuselayo.
Isiphaluka esishicilelweyo-isekethe eyenziwe ngesiphaluka esishicilelweyo, icandelo eliprintiweyo, okanye indibaniselwano yezi zimbini, ngokokuyilwa kwangaphambili kubume bezinto zokwambathisa.
Printed circuit/circuit board — general term for insulating boards that have been finished with printed circuit or printed circuit. Mellors | | ai | | | P CB sample strips, 1, 1, ai, 1 division 1 skill the first P | 1 CB sample sheet
Ubuninzi be-PCB-Ubunzima obuveliswe yi-PCB ngocingo olungaphezulu kwe-0.3 mm (12 / 12mil) kububanzi phakathi kweediski ezimbini kwindawo ekuhlanganayo kwigridi esemgangathweni ye-2.54 mm.
Uxinano oluphakathi lwe-PCB-Ibhodi eshicilelweyo enobunzima obunezingcingo ezimbini ezimalunga ne-0.2 mm (8 / 8mil) kububanzi phakathi kweediski ezimbini kwindawo ekudibana kuyo iigridi ezisemgangathweni eziyi-2.54 mm.
Ukuxinana okuphezulu kweBhodi eshicilelweyo-Ibhodi eshicilelweyo enobunzima obunentambo ezintathu phakathi kweediski ezimbini kwimpambano ye-2.54 mm ububanzi begridi esemgangathweni ye-0.1 ukuya kwi-0.15 mm (4-6 / 4-6mil).
2. What are the types of printed circuits according to the substrate and conductive pattern used? Mellors | | ai | | | PCB sample strips, 1, 1, ai, 1 division 1 skill the first P | 1 CB sample sheet
-Ngokwe-substrate esetyenzisiweyo: ziqinile, ziyaguquguquka, ziqinile-ziyatshintsha;
-Ngokuya kwimizobo eqhubayo: engatshatanga, ephindwe kabini, eyahlukeneyo.
3. Chaza umsebenzi wesekethe eprintiweyo kunye neempawu zeshishini lesekethe eprintiweyo.
– Okokuqala, ibonelela ngenkxaso yoomatshini bokulungiswa kwebhodi yePCB kunye nendibano yeetransistors, iisekethi ezihlanganisiweyo, ii-resistors, ii-capacitors, ii-inductors kunye nezinye izinto.
Okwesibini, iyayiqonda intambo kunye nonxibelelwano lombane phakathi kwezinto ezinje nge-transistors, iisekethi ezihlanganisiweyo, ii-resistors, ii-capacitors kunye ne-inductors, kunye nokufakwa kombane ukuhlangabezana neempawu zombane.
Okokugqibela, abalinganiswa bokuchongwa kunye nemizobo zibonelelwa ngokuhlolwa kunye nokugcinwa kwamacandelo e-PCB yenkqubo yendibano ye-elektroniki, kwaye iigraphics zokuvala ze-welding zibonelelwa nge-wave soldering.
Itekhnoloji ephezulu, utyalomali oluphezulu, umngcipheko omkhulu kunye nenzuzo ephezulu. Abaxhasi | | ai | | | I-P CB isampulu yemigca, 1, 1, ai, 1 isahluko 1 isakhono sokuqala P | Iphepha lesampulu ye-1 ye-CB
4. Ukuhlelwa kwenkqubo yokuveliswa kwesekethe okwahlulahlulwe ikakhulu ziziphi iindlela ezimbini? Zithini iinzuzo zento nganye?
-Indlela yokongeza: thintela inani elikhulu lobhedu, cutha iindleko. Inkqubo yokwenza imveliso yebhodi yekopi ye-PCB, ukuphucula ukusebenza kwemveliso. Iingcingo ezigungxulwayo kunye neendawo ezigungxulwayo zinokufezekiswa. Ukunyaniseka komngxunya osinyithi kuphuculwe.
Indlela yokuNciphisa: inkqubo ekhulileyo, ezinzileyo nethembekileyo. Abaxhasi | | ai | | | I-P CB isampulu yemigca, 1, 1, ai, 1 isahluko 1 isakhono sokuqala P | Iphepha lesampulu ye-1 ye-CB
5. Zeziphi iintlobo zeenkqubo zokongeza ezisetyenzisiweyo kwimveliso yesekethe eprintiweyo? Bhala inkqubo ngokwahlukeneyo?
-Iindlela zokudibanisa zizonke: ukubhola, ukubonwa, unyango lwe-viscosifying (isigaba esingalunganga), ukuxhonywa kobhedu okungasetyenziswanga, ukususwa kwesixhathisi.
-Iindlela zokudibanisa isiqingatha: ukubhola, unyango lwe-catalytic kunye ne-tackification, i-electroless copper plating, imaging (i-electroplating resisting), i-graphic electroplating copper (isigaba esibi), ukususwa kokumelana, ukwahlula.
-Indlela yokongeza:
6. Zeziphi iintlobo zeesekethe eziprintiweyo kwinkqubo yokuthabatha? Bhala ukuhamba kwenkqubo yokugcwalisa ipleyiti yonke kunye nomzobo wegraphic. Abaxhasi | | ai | | | I-P CB isampulu yemigca, 1, 1, ai, 1 isahluko 1 isakhono sokuqala P | Iphepha lesampulu ye-1 ye-CB
-I-PCB engagalelwanga umhlwa, i-PCB eyenziwe ngomgubo, i-PCB eyenziwe ngomgubo kunye ne-PCB ephezulu.
Itafile ye-electroplating iphela (indlela yokufihla): ukugquma, ukubola, ukugoba isinyithi emingxunyeni, ukujija ipleyiti yokufakelwa kombane, unyango lomphezulu, ukunamathisela uhlobo lokufihla ukukhanya kwefilimu eyomileyo, ukwenza imizobo yocingo eqhelekileyo, ukutyeba, ukususwa kwefilimu, iplagi yokubumba, ukulungisa imilo, uhlolo, ushicilelo ukutyabeka ukumelana ukutyabeka, sokulinganisa umoya oshushu, ushicilelo womnatha iisimboli zokumakisha, iimveliso ezigqityiweyo. Abaxhasi | | ai | | | I-P CB isampulu yemigca, 1, 1, ai, 1 isahluko 1 isakhono sokuqala P | Iphepha lesampulu ye-1 ye-CB
I-graphic electroplating ye-PCB (ifilimu engavaliyo yokuxhathisa ubhedu): Iibhodi eziboshwe ngamacala amabini obhedu, ukugoba umngxunya, ukubola kwe-CNC, ukuhlolwa, ukuphazamisa, ubhedu obuncinci obungenasiphelo, ubhedu, uhlolo, isitya sebrashi, isitikha (okanye ukuprinta kwesikrini) ), ukuvezwa kwemifanekiso (okanye ukunyanga), ukuphinda uhlole ukuphinda ubambe, ukubumba ubhedu, iigraphics zisebenzisa i-al lead tin alloy, yiya kwifilimu (okanye ususe) yashicilelwa, ukuphinda kulungiswe ukuphinda kuhlolwe, ukubethelwa, ukubuyisela umva, uvavanyo oluvulekileyo lwesekethe, ukucoceka , iplagi ye-nickel / igolide, iplagi yokuncamathelisa iteyiphu, isilinganisi somoya oshushu, ukucoca, iisimboli zoshicilelo lwenethiwekhi, ukucwangciswa kwemilo, ukucoca kunye nokomisa, ukuhlolwa, ukupakisha, iimveliso ezigqityiweyo.
7. Itekhnoloji yokuchongwa kombane inokwahlulwa ibe zeziphi iintlobo zetekhnoloji?
-Itheknoloji eqhelekileyo yesingxobo se-porous, itekhnoloji ye-plating ngqo, iteknoloji yokuncamathela ngokuthe ngqo. Abaxhasi | | ai | | | I-P CB isampulu yemigca, 1, 1, ai, 1 isahluko 1 isakhono sokuqala P | Iphepha lesampulu ye-1 ye-CB
8. Zeziphi ezona mpawu ziphambili kwiibhodi eziprintiweyo? Yintoni izinto zayo ezisisiseko?
-Flexible kwaye isongelwe ukunciphisa ivolumu; Ubunzima bokukhanya, ukungqinelana kweentambo ezilungileyo, ukuthembeka okuphezulu.
9. Chaza ezona mpawu ziphambili kunye nokusetyenziswa kwe-PCB eguqukayo.
-Izinto eziqinileyo neziguqukayo ziyadityaniswa, zishenxisa isidingo sokudibanisa, unxibelelwano oluthembekileyo, ukunciphisa ubunzima, ukuhlanganisa i-miniaturization. Ibhodi yokukopela ye-PCB isetyenziswa ikakhulu kwizixhobo zonyango ze-elektroniki, iikhompyuter kunye nakwipheripherali, izixhobo zonxibelelwano, izixhobo ze-aerospace kunye nokhuselo lwesizwe kunye nezixhobo zomkhosi. Abaxhasi | | ai | | | I-P CB isampulu yemigca, 1, 1, ai, 1 isahluko 1 isakhono sokuqala P | Iphepha lesampulu ye-1 ye-CB
10. Chaza iimpawu zebhodi eshicilelweyo enamathelayo.
– Itekhnoloji yokuqhubekeka ngokulula, ukusebenza kakuhle kwemveliso, iindleko eziphantsi, amanzi amdaka amancinci.
11. What is multiple wiring PCB?

-Ibhodi eprintiweyo eyenziwe ngokubeka iingcingo zesinyithi ngqo kwi-substrate yokwambathisa.
12. Yintoni ibhodi eprintiweyo esekwe kwisinyithi? Zeziphi izinto eziphambili?
Ixesha elipheleleyo lebhodi yesinyithi eprintiweyo kunye nebhodi yentsimbi eprintiweyo. Abaxhasi | | ai | | | I-P CB isampulu yemigca, 1, 1, ai, 1 isahluko 1 isakhono sokuqala P | Iphepha lesampulu ye-1 ye-CB
13. Yintoni i-multilayer PCB enamacala amabini? Zeziphi izinto eziphambili?
Ukuveliswa kweebhodi zeesekethe ezininzi kwi-PCB enye. Iimpawu zebhodi ye-PCB: ayikwazi kuphela ukubamba umtshini wangaphakathi we-electromagnetic kwi-radiation engaphandle, kodwa inokuthintela ukuphazamiseka kweliza elingaphandle kwe-electromagnetic kuyo, ayifuni umgodi we-metallization, iindleko eziphantsi, ubunzima bokukhanya, bunokuba mncinci.
14. Intshayelelo emfutshane kwinkcazo kunye nokwenziwa kwesekethe eprintiweyo?
-Uxinano oluphezulu lwebhodi eshicilelweyo ye-wiring eshicilelweyo yenziwa ngokutshintsha ubushushu kunye nokuhambisa ngendlela yokubeka ingqokelela kumaleko angaphakathi webhodi egcwalisiweyo yemigangatho emininzi, kwaye imingxunya engaboniyo isetyenziswa ngokukhululekileyo ukuqhuba phakathi kwamaleko.