PCB futhi izingxenye ziyajika ngesikhathi senqubo yokushisela, kanye nokukhubazeka okufana nokushisela okubonakalayo kanye nesifunda esifushane ngenxa yokuguqulwa kwengcindezi. I-Warpage ngokuvamile ibangelwa ukungalingani kwezinga lokushisa kwezingxenye ezingaphezulu neziphansi ze-PCB. Ku-PCB enkulu, i-warping nayo izokwenzeka ngenxa yokwehla kwesisindo sebhodi. Idivayisi evamile ye-PBGA imayelana no-0.5mm kude nebhodi lesifunda eliphrintiwe. Uma idivayisi ebhodini lesifunda likhulu, i-solder joint izoba ngaphansi kokucindezeleka isikhathi eside njengoba ibhodi lesifunda lipholile futhi i-solder joint izoba ngaphansi kokucindezeleka. Uma idivayisi iphakanyiswe ngo-0.1mm, izokwanela ukubangela i-Weld open circuit.

Ngenkathi i-PCB ingqubuzana, izingxenye ngokwazo zingase zijike, futhi amalunga e-solder atholakala phakathi nendawo aphakanyiswe asuke ku-PCB, okuholela ekusongeleni okungenalutho. Lesi simo sivame ukwenzeka lapho kusetshenziswa i-flux kuphela futhi akukho unamathisele we-solder osetshenziselwa ukugcwalisa igebe. Uma usebenzisa i-solder paste, ngenxa yokuguqulwa, i-solder paste kanye nebhola le-solder zixhunywe ndawonye ukuze zenze iphutha elifushane lesifunda. Esinye isizathu sesifunda esifushane ukuhlukaniswa kwe-substrate yengxenye ngesikhathi senqubo yokugeleza kabusha. Lesi sici sibonakala ngokwakhiwa kwamabhamuza ngaphansi kwedivayisi ngenxa yokwanda kwangaphakathi. Ngaphansi kokuhlolwa kwe-X-ray, kungabonakala ukuthi i-welding short circuit ivame ukuba phakathi kwedivayisi. .