Nciphisa inani lezinto futhi unciphise indawo ye- ibhodi yesifunda ngokusebenzisa ukuhlanganiswa okungenantambo kwe-RF

Kumadivayisi anamuhla angenazintambo, ngaphezu kwengxenye yezingxenye ebhodini lesifunda kungamadivayisi we-analog RF. Ngakho-ke, indlela ephumelelayo yokunciphisa indawo yebhodi lesifunda nokusetshenziswa kwamandla ukwenza ukuhlanganiswa okukhulu kakhulu kwe-RF nokuthuthuka kubheke ezingeni lesistimu. Leli phepha lethula isimo sokuthuthuka kokuhlanganiswa kweRF, futhi libeke ezinye izindlela zokumelana nezixazululo kwezinye zalezi zinkinga.

Eminyakeni embalwa eyedlule, imakethe yamaselula yayiphethwe yibhendi eyodwa nezingcingo ezimbili zemodi eyodwa, futhi ubuchwepheshe obusetshenzisiwe bebungobobodwa ??? Bamba ibhande elilodwa noma amabili amaselula kukho konke ??? Indlela efanayo yokushintshashintsha kwezwi, uhlelo lokufinyelela oluneziteshi eziningi kanye neprotocol iyamukelwa ebhendi yemvamisa yokubamba. Ngokuphambene nalokho, ukwakhiwa kwesizukulwane esisha sanamuhla samafoni weselula kuyinkimbinkimbi kakhulu futhi kunganikeza ngamabhendi amaningi nemodi yezindlela eziningi ??? Inenethiwekhi yendawo ye-Bluetooth, ukubeka i-GPS neminye imisebenzi, futhi imisebenzi yokwamukela ye-UWB ne-TV isiqalile ukuvela. Ngaphezu kwalokho, izinhlelo ezifana nemidlalo, izithombe, umsindo kanye nevidiyo sekuyinsakavukela komakhalekhukhwini.

Ucingo olungenantambo luba yinto eyinkimbinkimbi ebizwa ngokuthi indawo yokuzijabulisa ephathwa ngesandla. Umkhuba wayo wokuthuthuka uyaqhubeka nokuletha izinselelo eziningi kubaqambi. Yize kuqhathaniswa nezingcingo ezinomsebenzi wezwi kuphela, isizukulwane esisha samafoni sande kakhulu ekusebenzeni kokuxhumana, ekusetshenzisweni kwesicelo, inani lezindawo zokuxhumana ze-RF namandla ememori ahlanganisiwe, abasebenzisi basalindele ukuthi omakhalekhukhwini babe nevolumu encane, umumo ohlanjululwe, uphansi Intengo nombukiso omkhulu wombala, Inganikeza isikhathi sokulinda nesikhathi sokukhuluma esifana nezingcingo zezwi lendabuko. Ukugcina usayizi ophelele okhona nokusetshenziswa kwamandla, kepha okwenza umsebenzi ukhule kakhulu, ngenkathi kugcinwa izindleko zizoguquka zingaguquki, konke lokhu kuletha izinkinga eziningi kubaqambi bohlelo.

Ngokusobala, inkinga ifaka zonke izingxenye zohlelo lonke lokwakhiwa, kanye nabaphakeli bakho konke ukuxhumana okungenazintambo nokuqukethwe kwezokuzijabulisa. Indawo eyodwa esebenza ngempumelelo ekwehliseni indawo yebhodi nokusetshenziswa kwamandla yingxenye ye-RF yokwakhiwa kohlelo olungenantambo. Lokhu kungenxa yokuthi efonini ephathekayo yanamuhla, ngaphezu kwengxenye yezingxenye ebhodini yizinto ze-analog RF, ezihlanganisa ndawonye ama-30-40% wendawo yonke yebhodi, njengezinhlelo ze-Bluetooth RF ezifana ne-GPS ne-WLAN nazo khulisa izidingo zesikhala.

Isixazululo ukwenza ukuhlanganiswa okukhulu kakhulu kwe-RF futhi ekugcineni kukhule kube yi-chip level ehlanganiswe ngokuphelele yohlelo. Abanye abaklami bafaka abaguquli be-analog-to-digital ku-antenna ukunciphisa isikhala sebhodi lesifunda esidingekayo semisebenzi ye-RF. Lapho ubuchwepheshe bokuhlanganiswa kwe-semiconductor bungahlanganisa imisebenzi eminingi kudivayisi eyodwa, inani lamadivayisi ahlukile kanye nendawo yebhodi lesifunda esetshenziselwa ukufaka la madivayisi izoncishiswa ngokufanele. Njengoba imboni isiya ekuhlanganisweni kwe-chip level level, abaklami bazoqhubeka nokuthola ubuchwepheshe obusha bokuhlangabezana nokuphikisana phakathi kobunzima obuphezulu be-RF nempilo yebhethri ende kumadivayisi amancane angenazintambo.

Isimo sokuthuthukiswa kokuhlanganiswa kwe-RF

Intuthuko ebalulekile yokuhlanganiswa kweRF yavela cishe eminyakeni emibili edlule. Ngaleso sikhathi, ukuthuthukiswa kobuchwepheshe be-RF nemodemu ye-baseband yedijithali kwenza ukuthi kube lula ukufaka esikhundleni samadivayisi we-superheterodyne RF ngokuthola ngqo abaguquli bokuguqulwa kumaselula angenazintambo. Amadivayisi we-Superheterodyne RF asebenzisa ama-multistage mixers, izihlungi nama-oscillator amaningi (VCOs), asetshenziswe kahle iminyaka eminingi, kepha ukuhlanganiswa kwamadivayisi wokuguqula imvamisa eqondile kunganciphisa kakhulu inani lezinto ze-GSM RF. Ngasekupheleni kweminyaka yama-1990s, uhlelo olujwayelekile lwe-single superheterodyne RF subsystem lwalufaka i-PA, switch ye-antenna, i-LDO, isignali encane ye-RF ne-vctcxo, edinga amadivayisi angama-200 ahlukile; Namuhla, singakwazi ukuklama uhlelo lokuguqula imvamisa oluqondile ngomsebenzi webhendi amane, ohlanganisa isihlungi se-VCO, VCXO ne-PLL loop, kepha inani lezinto zalo lingaphansi kuka-50.

Isibonelo, i-transceiver trf6151 (Umdwebo 1) we-Texas Instruments we-GSM ufaka i-on-chip voltage regulator, i-VCO ne-VCO channel, i-PA power control, i-PLL loop filter edge edge blocker detection, i-LNA izuza i-step-by-step control ne-VCXO.

Kwabaqambi, ukuhlanganiswa okuthuthukile kusiza ekunqobeni ezinye zezinkinga ezinkulu kwi-RF engenantambo, phakathi kwazo okuyisisekelo kunazo zonke ukunikezwa kwamandla we-DC nokulawulwa kwe-transceiver. Ngesikhathi socingo, amandla webhethri azoshintsha ngokushintsha kwezinga lokushisa nesikhathi. Ngaphezu kwalokho, ukuhlanganiswa komsindo okuvela ku-TX VCO ne-Rx VCO kokuphakelwa kwamandla kuzophazamisa nokusebenza kohlelo lonke. Ngakho-ke, abaklami babhekene nenkinga yokuthi bangaxazulula kanjani isilawuli sebhodi lesifunda se-RF nezinto ezihambelana kakhulu. Ukuhlanganisa lawa madivayisi ku-transceiver ye-RF kusho ukuthi okuwukuphela kwengxenye yangaphandle edingekayo i-decoupling capacitor elula, exhunywe ngqo ekunikezelweni kwamandla, okungagcini nje ngokwenza lula ukwakheka, kepha futhi konga nendawo yebhodi lesifunda.

Enye inselelo yabaqambi be-RF uhla lwe-VCO tuning nesikhathi sokukhiya. Kuyo yonke imidwebo ye-analog VCO. Ngoba kuvame ukudingeka ukulinganisela isikhathi sokukhiya nobubanzi bokushuna, isihlungi se-loop ngokuvamile sibekwa ngaphandle kwe-chip. Kwesinye isikhathi, lokhu kungaxazululwa ekulawuleni isoftware kobubanzi bokushuna kwe-VCO. Kodwa-ke, le ndlela ibeka phambili izidingo ezengeziwe zezinsizakusebenza ekuthuthukisweni kocingo jikelele. Lapho umsebenzi wokushuna wedijithali ufakiwe ku-VCO futhi unganikeza ukulinganisa ngokwakho, ububanzi bokushuna obunwetshiwe bungatholakala, futhi into yokuhlunga iluphu ingafakwa ku-chip. Ngokusobala, lolu hlelo lungenza onjiniyela bokuklama benze umsebenzi wabo ube lula.

Ukuze uthole amandla okudlulisa amandla adingekayo ngohlelo lwe-GSM, abakhiqizi be-PA ngokuvamile bafaka lo msebenzi kwimodyuli yesikhulisi samandla (PAM). Isilawuli samandla ngokuvamile sakhiwa kuze kube yizinkulungwane zamasango edijithali e-CMOS, enziwa nge-chip ezimele ePAM. Le nto izokhuphula izindleko ze-PAM nge-US $ 0.30 ~ 0.40. Ukuhlanganisa lo msebenzi kumadivayisi we-RF kuzokwenza ukuthi abakhiqizi be-GaAs PAM bangathengi amasekethe edijithali e-CMOS bese bewafaka kwi-PAM. Kwi-OEM ekhiqiza imikhiqizo eyizinkulungwane njalo ngenyanga, ukususa le ngxenye engafuneki kuzonciphisa kakhulu izindleko zayo.

Enye indawo lapho ukuhlanganiswa okuthuthukile kungaletha ukonga okukhulu yi-VCXO. Esikhathini esedlule, amamojula we-vctcxo abizayo athengwa futhi aklanywa kumadivayisi we-RF njengezinto ezihlukile. Ngakho-ke, ukufaka izinto ezijwayelekile zamamojula we-vctcxo kumadivayisi we-RF kunganciphisa izindleko nezinkinga ezihlobene zokuklama. Usebenzisa i-trf6151, kuphela i-crystal ebiza izindleko kanye ne-varactor okudingeka ukuqedela umsebenzi we-vctcxo.

Ngaphandle kwalokhu kuhlanganiswa nokwenziwa lula kokuklanywa, onjiniyela bokwakha be-RF basabhekene nezinqumo ezinzima, enye yazo ukuzwela kokufaka nokusetshenziswa kwamandla kweRx. Kuyaziwa kahle ukuthi uma amandla asetshenziswa kakhulu ekwakhiweni kwesikhulisi somsindo esiphansi (i-LNA), kwehlisa izimpawu zomsindo jikelele. Unjiniyela wokuklama kufanele anqume isabelomali samandla esiphelele somamukeli nezidingo zezinga lokuzwela lalowo owamukelayo. Kodwa-ke, umsindo awunciphi ngokuncipha kwamandla. Eqinisweni, kuphambene. Ngakho-ke, noma ingahlangabezana nokucaciswa okujwayelekile kwe-GSM, abaklami kumele bavame ukuzibuza ukuthi kufanele yini ukukhokha intengo ekusetshenzisweni kwamandla ukuze kuzuzwe izinga elithile lokuzwela. Lo mbuzo uphinde uchaze ukuthi kungani kubalulekile ukuthi onjiniyela bokudizayina nabakhiqizi be-IC babambisane eduze kuyo yonke inqubo yokwakhiwa. Impendulo evela konjiniyela bokudizayina ingahola abakhiqizi be-IC ukuthi basebenzise kangcono imboni engenantambo lapho benza imikhiqizo ye-RF yesikhathi esizayo.

Ukuthuthukela ku-SOC

Ukunciphisa izindleko, amandla nobunzima bezinhlelo ezingenantambo kubaluleke kakhulu ukuhlangabezana ngempumelelo nezidingo zokuhlanganiswa kohlelo. Kodwa-ke, ukuthuthukiswa kwezixazululo eziphezulu zokuhlanganisa omakhalekhukhwini kudinga imboni ye-semiconductor ukunqoba izithiyo eziyinkimbinkimbi zobuchwepheshe. Ezinye zalezi zithiyo azikhathazi kakhulu ngabaqambi, ngoba eziningi zazo azifuni ukwazi ukuthi zenziwa kanjani amadivayisi we-SOC, inqobo nje uma inganikeza ukusebenza okudingekayo. Ngakho-ke, kuyadingeka ukuthi ube nokuqonda okusheshayo kobunye ubuchwepheshe bezinqubo, obuzothinta amandla nokutholakala kwamadivayisi asetshenziswe ekuhlanganisweni kwamaselula.

Kunezinhlelo eziningi ezingenzeka zokuhlanganiswa kohlelo lwe-elektroniki lomakhalekhukhwini i-RF. Okokuqala, ukwakhiwa kwendabuko kwe-RF kungenziwa nge-bipolar elula noma inqubo ye-BiCMOS kusetshenziswa ubuchwepheshe bendabuko. I-chip ye-RF yokugcina ingahlanganiswa nemisebenzi yocingo yedijithali yomakhalekhukhwini kusetshenziswa ubuchwepheshe obuningi bokupakisha (ubuchwepheshe bezinga lokupakisha). Yize lobu buchwepheshe bunezinzuzo eziningi, njengokusebenzisa izindlela ezijwayelekile zokuklama ze-RF nezinqubo ezivuthiwe nobuchwepheshe, kunzima ukwenza inzuzo ngenxa yezindleko eziphezulu nokukhishwa kwamadivayisi wokuhlola.

Ngaphezu kwalokho, ukuhlanganiswa kohlelo lwe-elekthronikhi lomakhalekhukhwini kungabuye kutholakale ngenqubo yokudla okuthuthukile ye-BiCMOS (SiGe). Kodwa-ke, ngoba ukucubungulwa kwamadivayisi we-SiGe HBT kudinga inqubo eyengeziwe ye-lithography, i-chip yokugcina izodinga izindleko ezingeziwe. Ngasikhathi sinye, ngoba ubuchwepheshe be-SiGe BiCMOS abukwazi ukusebenzisa inqubo ye-lithography esithuthuke kakhulu, inqubo ye-BiCMOS imvamisa ukuthi isalele emuva kwenqubo esezingeni eliphezulu ye-digital CMOS. Lokhu kuzoletha ingcindezi enkulu yokwengeza izici zamaselula nokunciphisa izindleko. Ayikwazi ukuxazululwa ngecebo elilula lezinqubo ezilucwecwana, ngoba lobu buchwepheshe abukwazi ukugcina i-logic yohlelo noma ingxenye yedijithali ngentengo ephansi kakhulu ngaso sonke isikhathi. Ngakho-ke, ukuhlanganiswa kwe-monolithic kohlelo lwe-baseband function RF okuyingxenye ku-BiCMOS (noma i-SiGe) akuyona into enhle.

Isixazululo sokugcina esingacatshangelwa ukuhlanganiswa kwe-RF ku-CMOS, nayo ebhekene nezinselelo ezinkulu. Yize kunemiklamo eminingi ye-CMOS yeselula ye-RF, le miklamo isuselwa kakhulu kwimisebenzi ye-analog. Kunzima ukusebenzisa ama-analog mixers, izihlungi nezikhulisi ngobuchwepheshe be-CMOS, futhi ukusetshenziswa kwamandla ngokuvamile kukhulu kunohlelo lwe-SiGe BiCMOS. Ngokuthuthukiswa kobuchwepheshe bezinqubo, izinga elilinganisiwe le-CMOS liyehla naphansi, okwenza kube nzima ukwakheka kwe-analog. Esigabeni sokuqala sokwenza izinqubo ezintsha, ukumodeliswa kwensiza nokuvuthwa kwenqubo ngokuvamile akukwazi ukuhlangabezana nezidingo zokumodela okuphezulu okuphezulu okudingekayo ekwakhiweni kwemodyuli ye-analog. Kodwa-ke, ukwakhiwa okwakhiwa kwe-digital CMOS RF okwenziwe muva nje kwenza ukuhlanganiswa kwe-monolithic CMOS kukhange ngokwengeziwe.

Lezi zixazululo futhi ziqhuba imboni ye-semiconductor njengoba abakhiqizi befuna izixazululo zezinga eliphansi le-RF system level chip. Yize uhlelo ngalunye lokuhlanganisa lunobunzima, kuyamangaza impela ukuthi ukuhlanganiswa kwengxenye ye-RF kungafinyelela ezingeni eliphakeme kangaka. Ukunqoba lobu bunzima kuzothatha igxathu elikhulu phambili ekwakhiweni kwezingcingo ezingenazintambo futhi kubeke umkhombandlela wokuhlanganiswa okukhulu esikhathini esizayo esiseduze.

Isiphetho saleli phepha

Kusenezinkinga eziningi ekuhlanganisweni kweRF. Yonke into ye-RF yocingo lwesimanje ibhekene nezidingo zokusebenza eziqinile. Isidingo sokuzwela cishe siyi-106dbm (106db ngaphansi kwe-1 MW) noma ngaphezulu, futhi ileveli ehambisanayo ngama-microvolts ambalwa nje; Ngaphezu kwalokho, ukukhetha, okungukuthi, ikhono lokwenqatshwa kwesiteshi esiwusizo kwibhendi yemvamisa eseduze (okuvame ukubizwa ngokuthi ukuvimba), kufanele kube ngokohlelo lwe-60dB; Ngaphezu kwalokho, i-oscillator yesistimu iyadingeka ukuthi isebenze ngaphansi komsindo wesigaba esiphansi kakhulu ukuvimbela ukusonga amandla okuvimba amandla okungena ebhendi eyamukelayo. Ukuhlanganiswa kwe-RF kunzima kakhulu ngenxa yemvamisa ephezulu kakhulu nezidingo zokusebenza ezidinga ngokweqile.

Ukucubungula indinganiso yemvamisa eminingi kuletha inselelo yangempela kuyo yonke imvamisa ye-SOC. Kuthenjwa ukuthi kuzoncishiswa ukuheha okwenziwe ngokudluliswa kwesiginali yebhendi. Okuqukethwe kokuhlanganiswa kwedijithali kwe-RF kungaphezulu kokubeka izinto eziningi ze-RF ku-chip eyodwa. Ukwakhiwa okusha kokwabelana ngehadiwe kuyadingeka.

Kwabaqambi bohlelo, amadivayisi we-semiconductor wamanje alula, ahlanganiswe kakhulu futhi angabizi kakhulu angakunciphisa kakhulu ubunzima bokudizayina. Ngasikhathi sinye, zinganothisa izici zamadivayisi angenantambo futhi zigcine usayizi wesistimu, impilo yebhethri nezindleko zingashintshi. Amadivayisi amasha we-RF ahlanganiswe kakhulu nawo angaqeda izingxabano ezithile ekwakhiweni okungenantambo futhi alondoloze isikhathi esibalulekile sonjiniyela.