With the overall transformation and upgrading of the domestic manufacturing industry, people have put forward higher requirements on the quality of PCB products in the PCB segmentation market. The traditional PCB splicing equipment is mainly processed by cutter, milling cutter and gongs knife, which has more or less disadvantages such as dust, burr and stress. It has a great impact on the small or PCB board loaded with components, so it is a little difficult in new applications.

The application of laser technology in PCB cutting provides a new solution for PCB sub-board processing. The advantages of laser cutting PCB lie in the advantages of small cutting clearance, high precision, small heat affected area, etc. Compared with the traditional PCB cutting process, laser cutting PCB has no dust, no stress, no burr, and the cutting edge is smooth and neat. But at present laser cutting PCB equipment is not fully mature, laser cutting PCB still has obvious shortcomings.

At present, the biggest disadvantage of laser cutting PCB equipment lies in the low cutting speed, the thicker the cutting material, the lower the cutting speed, and the speed of different materials processing also has a certain difference, compared with the traditional processing method, can not meet the needs of large-scale production. At the same time, the hardware cost of laser equipment itself is high, a laser cutting PCB equipment is about 2-3 times the price of traditional milling cutter equipment, the higher the power, the more expensive the price, if three laser cutting PCB equipment can achieve the speed of a milling cutter cutting PCB equipment, the processing cost and labor cost will also rise greatly. In addition, laser cutting thick materials such as MORE than 1mm PCB, the cross section will have carbonization impact, which is also the reason why many PCB processing manufacturers can not accept laser cutting PCB.

In a word, the current market of laser cutting PCB equipment has the disadvantages of high cost and low speed, resulting in the market is not mature, only mobile phone PCB, automobile PCB, medical PCB and other relatively high requirements of manufacturers to use. But with the continuous progress of laser technology, laser power improvement, better beam quality, cutting process upgrade, the stability of the future equipment will gradually improve, equipment cost will be lower and lower, the future laser cutting in the PCB market application is worth looking forward to. Will be another laser industry growth point.