Bon jan kalite a nan la enprime kous Komisyon Konsèy, the occurrence and solution of problems, and the evaluation of process improvement need to be sliced as the basis of objective inspection, research and judgment. The quality of slice has a great influence on the determination of results.

Section analysis is mainly used to check the thickness and number of layers of PCB internal wiring, through hole aperture size, through hole quality observation, used to check the internal cavity of PCBA solder joint, interface bonding condition, wetting quality evaluation and so on. Slice analysis is an important technique for failure analysis of PCB/PCBA, and the quality of slice will directly affect the accuracy of failure location confirmation.

PCB section classification: general section can be divided into vertical section and horizontal section

1. Vertical slicing means cutting along the direction perpendicular to the surface to observe the profile condition, usually used to observe the quality, lamination structure and internal bonding surface of the hole after copper plating. Vertical sectioning is the most commonly used method in sectioning analysis.

2. The horizontal slice is ground down one layer by layer along the overlapping direction of the board to observe the condition of each layer. It is usually used to assist the analysis and judgment of the quality abnormality of the vertical slice, such as the inner short or the inner open abnormality.

Slicing generally includes sampling, Mosaic, slicing, polishing, corrosion, observation and a series of means and steps to obtain a smooth PCB cross section structure. Then through metallographic microscope and scanning electron microscope, the microscopic details of the sections are analyzed. Only when the sections are correctly interpreted can correct analysis be made and effective solutions be given. Therefore, slice quality is particularly important, poor quality slice will bring serious misdirection and misjudgment to failure analysis. Metallographic microscope as the most important analysis equipment, its magnification from 50 to 1000 times, the measurement accuracy deviation within 1μm.

After section making, section analysis and interpretation follow. To find out the cause of the occurrence of the adverse, and make the corresponding improvement measures, in order to improve yield and reduce the loss.