Qerta çapê ya çapkirî (PCB) di hilberên elektronîkî de piştgiriya hêman û hêmanên gerdûnî ye. Ew pêwendiyên elektrîkê di navbera hêman û cîhazên gerdûnê de peyda dike. With the rapid development of electronic technology, PCB density is getting higher and higher. Kapasîteya sêwirana PCB -ê ku li hember destwerdanan bisekine cûdahiyek mezin dike. Practice has proved that even if the circuit schematic design is correct and the printed circuit board design is improper, the reliability of electronic products will be adversely affected. For example, if two thin parallel lines on a printed board are close together, there will be a delay in the signal waveform, resulting in reflected noise at the end of the transmission line. Therefore, when designing printed circuit board, we should pay attention to the correct method, comply with the general principle of PCB design, and should meet the requirements of anti-interference design.

Prensîbên gelemperî yên sêwirana PCB

The layout of components and wiring is important for optimal performance of electronic circuits. In order to design PCB with good quality and low cost, the following general principles should be followed:

1. Têlbirînê

Prensîbên sazkirinê wiha ne:

(1) Têlên paralel ên li termînalên têketin û derketinê divê heya ku ji dest tê were dûr xistin. Çêtir e ku meriv têla erdê di navbera têlan de lê zêde bike da ku ji berhevdana bertek dûr bikeve.

(2) The minimum width of PCB wire is mainly determined by the adhesion strength between wire and insulating substrate and the value of current flowing through them. When the thickness of copper foil is 0.5mm and the width is 1 ~ 15mm, the current through 2A, the temperature will not be higher than 3℃. Therefore, the wire width of 1.5mm can meet the requirements. For integrated circuits, especially digital circuits, 0.02 ~ 0.3mm wire width is usually selected. Of course, whenever possible, use wide wires, especially power and ground cables. Navbera herî kêm a têlan bi giranî ji hêla berxwedana însulasyonê û voltaja şikestinê ya di navbera têlan de di rewşa herî xirab de tê destnîşan kirin. For integrated circuits, especially digital circuits, the spacing can be less than 5 ~ 8mil as long as the process permits.

(3) Çêçika çapkirî bi gelemperî kembera gerdûnî digire, û Goşeya rastê an Kûreya ku tê de di nav frekansa bilind de heye dê bandorê li performansa elektrîkê bike. In addition, avoid using large copper foil as far as possible, otherwise, when heated for a long time, copper foil is easy to expand and fall off. Dema ku divê qadên mezin ên felqê sifir werin bikar anîn, çêtirîn e ku meriv torek bikar bîne. Ev ji bo rakirina pelika sifir û girêdana substratê di navbera germahiya ku ji hêla gaza volatil ve hatî hilberandin de dibe alîkar.