Gudiga wareegga daabacan (PCB) waa taageerada qaybaha wareegga iyo qaybaha alaabta elektarooniga ah. Waxay bixisaa isku xirnaanta korontada ee u dhexeeya walxaha wareegga iyo aaladaha. With the rapid development of electronic technology, PCB density is getting higher and higher. Awoodda naqshadaynta PCB -ga si ay uga hortagto faragelinta waxay samaysaa farqi weyn. Practice has proved that even if the circuit schematic design is correct and the printed circuit board design is improper, the reliability of electronic products will be adversely affected. For example, if two thin parallel lines on a printed board are close together, there will be a delay in the signal waveform, resulting in reflected noise at the end of the transmission line. Therefore, when designing printed circuit board, we should pay attention to the correct method, comply with the general principle of PCB design, and should meet the requirements of anti-interference design.

Mabaadi’da guud ee naqshadaynta PCB

The layout of components and wiring is important for optimal performance of electronic circuits. In order to design PCB with good quality and low cost, the following general principles should be followed:

1. Fiilooyinka

Mabaadi’da fiilooyinka waa sida soo socota:

(1) Fiilooyinka isbarbar socda ee boosteejada gelinta iyo soo -saarka waa in laga fogaadaa intii suurtogal ah. Waxaa fiican inaad ku darto silig dhulka u dhexeeya fiilooyin si aad uga fogaato isku xirnaanta warcelinta.

(2) The minimum width of PCB wire is mainly determined by the adhesion strength between wire and insulating substrate and the value of current flowing through them. When the thickness of copper foil is 0.5mm and the width is 1 ~ 15mm, the current through 2A, the temperature will not be higher than 3℃. Therefore, the wire width of 1.5mm can meet the requirements. For integrated circuits, especially digital circuits, 0.02 ~ 0.3mm wire width is usually selected. Of course, whenever possible, use wide wires, especially power and ground cables. Kala -fogaanshaha ugu yar ee fiilooyinka waxaa inta badan lagu go’aamiyaa iska -caabbinta dahaarka iyo korantada burburka u dhexeysa fiilooyinka marka ay ugu daran tahay. For integrated circuits, especially digital circuits, the spacing can be less than 5 ~ 8mil as long as the process permits.

(3) Laabashada siligga la daabacay guud ahaan waxay qaadataa qaanso wareegsan, iyo Xagasha midig ama ku jirta Xaglaha ee wareegga soo noqnoqoshada sare waxay saamayn doontaa waxqabadka korantada. In addition, avoid using large copper foil as far as possible, otherwise, when heated for a long time, copper foil is easy to expand and fall off. Marka ay tahay in la isticmaalo meelo waaweyn oo naxaas -naxaas ah, waxaa fiican in la isticmaalo shabag. Tani waxay ku habboon tahay in laga saaro foornada naxaasta ah iyo isku -xidhka substrate -ka u dhexeeya kulaylka uu soo saaro gaaska kacsan.