Introduction to general principles of PCB design

Printed mzunguko wa bodi (PCB) ni msaada wa vifaa vya mzunguko na vifaa katika bidhaa za elektroniki. Inatoa unganisho la umeme kati ya vitu vya mzunguko na vifaa. With the rapid development of electronic technology, PCB density is getting higher and higher. Uwezo wa muundo wa PCB kupinga kuingiliwa hufanya tofauti kubwa. Practice has proved that even if the circuit schematic design is correct and the printed circuit board design is improper, the reliability of electronic products will be adversely affected. For example, if two thin parallel lines on a printed board are close together, there will be a delay in the signal waveform, resulting in reflected noise at the end of the transmission line. Therefore, when designing printed circuit board, we should pay attention to the correct method, comply with the general principle of PCB design, and should meet the requirements of anti-interference design.

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Kanuni za jumla za muundo wa PCB

The layout of components and wiring is important for optimal performance of electronic circuits. In order to design PCB with good quality and low cost, the following general principles should be followed:

1. Wiring

Kanuni za wiring ni kama ifuatavyo.

(1) Samba zinazofanana kwenye vituo vya kuingiza na kutoa zinapaswa kuepukwa iwezekanavyo. Ni bora kuongeza waya wa ardhini kati ya waya ili kuepuka kuunganishwa kwa maoni.

(2) The minimum width of PCB wire is mainly determined by the adhesion strength between wire and insulating substrate and the value of current flowing through them. When the thickness of copper foil is 0.5mm and the width is 1 ~ 15mm, the current through 2A, the temperature will not be higher than 3℃. Therefore, the wire width of 1.5mm can meet the requirements. For integrated circuits, especially digital circuits, 0.02 ~ 0.3mm wire width is usually selected. Of course, whenever possible, use wide wires, especially power and ground cables. Nafasi ya chini ya waya imedhamiriwa na upinzani wa insulation na voltage ya kuvunjika kati ya waya katika hali mbaya. For integrated circuits, especially digital circuits, the spacing can be less than 5 ~ 8mil as long as the process permits.

(3) Maneno ya waya yaliyochapishwa kwa ujumla huchukua upinde wa mviringo, na Angle ya kulia au Angle iliyojumuishwa katika mzunguko wa mzunguko wa juu itaathiri utendaji wa umeme. In addition, avoid using large copper foil as far as possible, otherwise, when heated for a long time, copper foil is easy to expand and fall off. Wakati maeneo makubwa ya karatasi ya shaba lazima itumike, ni bora kutumia gridi ya taifa. Hii inafaa kwa kuondolewa kwa karatasi ya shaba na kushikamana kwa substrate kati ya joto linalozalishwa na gesi tete.