Ndikukula kwa 5g, AI ndi misika yama kompyuta ogwiritsa ntchito kwambiri, kufunika kwa omwe amanyamula IC, makamaka onyamula a ABF, kwaphulika. Komabe, chifukwa chakuchepa kwa operekera othandizira, kupezeka kwa onyamula ABF kukuchepa ndipo mtengo ukupitilizabe kukwera. Makampaniwa akuyembekeza kuti vuto la kupezeka kwa mbale zonyamulira za ABF zitha kupitilirabe mpaka 2023. Poterepa, mbewu zinayi zikuluzikulu zonyamula mbale ku Taiwan, Xinxing, Nandian, jingshuo ndi Zhending, akhazikitsa njira zokulitsira mbale za ABF chaka chino, ndi Zogwiritsira ntchito ndalama zonse zopitilira NT $ 65 biliyoni kuzomera kumtunda ndi ku Taiwan. Kuphatikiza apo, ibiden ndi shinko waku Japan, zamagetsi aku Samsung ku Korea ndi Dade zamagetsi zakulitsa ndalama zawo m’mapepala onyamula a ABF.

Kufunika ndi mtengo wa board yaonyamula ya ABF ikukwera kwambiri, ndipo kuchepa kungapitirire mpaka 2023
Gawo la IC limapangidwa pamaziko a bolodi la HDI (bolodi lolumikizana kwambiri), lomwe limakhala ndi mawonekedwe a kachulukidwe kakang’ono, kukhathamira kwakukulu, miniaturization ndi kuwonda. Monga zinthu zapakatikati zolumikiza chip ndi bolodi loyenda mu njira yolongera chip, ntchito yayikulu ya bolodi ya ABF ndikutulutsa kulumikizana kwapamwamba kwambiri komanso kulumikizana kwapamwamba kwambiri ndi chip, kenako kulumikizana ndi bolodi lalikulu la PCB kudzera m’mizere yambiri pa bolodi yonyamula ya IC, yomwe imagwira ntchito yolumikizira, kuti iteteze kukhulupirika kwa dera, kuchepetsa kutayikira, kukonza mzere Ndiwothandiza kutaya kutentha kwa chip kuteteza chip, komanso kuphatikizira kungokhala chabe zipangizo kuti akwaniritse ntchito zina.

Pakadali pano, pantchito yonyamula kumapeto kwambiri, chonyamulira cha IC chakhala gawo lofunikira kwambiri pakupanga kwa chip. Zomwe zikuwonetsedwazo zikuwonetsa kuti pakadali pano, kuchuluka kwaonyamula kwa IC pamtengo wokwanira wafikira pafupifupi 40%.
Pakati pa omwe amanyamula IC, pali onyamula a ABF (Ajinomoto build up film) ndi ma BT onyamula malinga ndi njira zosiyanasiyana zaukadaulo monga CLL resin system.
Mwa iwo, bolodi yonyamula ya ABF imagwiritsidwa ntchito popanga ma tchipisi apamwamba monga CPU, GPU, FPGA ndi ASIC. Zips izi zitapangidwa, nthawi zambiri zimafunikira kuti zizinyamulidwa pa bolodi la ABF zisanasonkhanitsidwe pa bolodi lalikulu la PCB. Chonyamulira cha ABF chikachoka, opanga zazikulu kuphatikiza Intel ndi AMD sangathe kuthawa tsoka lomwe chip sichingatumizedwe. Kufunika kwaonyamula wa ABF kumatha kuwonedwa.

Kuyambira theka lachiwiri la chaka chatha, chifukwa chakukula kwa 5g, mtambo AI kompyuta, maseva ndi misika ina, kufunika kwa tchipisi tating’onoting’ono ta makompyuta (HPC) kwawonjezeka kwambiri. Kuphatikizana ndi kukula kwa msika wamsika kumaofesi apanyumba / zosangalatsa, magalimoto ndi misika ina, kufunikira kwa tchipisi cha CPU, GPU ndi AI kumbali yakumapeto kwawonjezeka kwambiri, zomwe zalimbikitsanso kufunikira kwa mabungwe onyamula a ABF.