Ka kholo ea 5g, AI le mebaraka ea likhomphutha tse sebetsang hantle, tlhoko ea bajari ba IC, haholo-holo bajari ba ABF e phatlohile. Leha ho le joalo, ka lebaka la matla a fokolang a bafani ba thepa ba amehang, phepelo ea bajari ba ABF e haella mme theko e ntse e tsoela pele ho nyoloha. Indasteri e lebelletse hore bothata ba phepelo e tiileng ea lipoleiti tsa ABF li ka tsoelapele ho fihlela ka 2023. Moelelong ona, limela tse ‘ne tse kholo tsa ho kenya lipoleiti Taiwan, Xinxing, Nandian, jingshuo le Zhending, li phatlalalitse merero ea katoloso ea lipoleiti tsa ABF selemong sena, ka Ts’ebeliso ea chelete eohle ea chelete e fetang NT $ 65 billion ho lijalo tsa mainland le Taiwan. Ntle le moo, ibiden le shinko ea Japane, lisebelisoa tsa motlakase tsa Samsung Korea le Dade li ekelitse letsete la tsona ho lipoleiti tsa ABF.

Tlhokahalo le theko ea boto ea bajari ea ABF e nyoloha haholo, mme khaello e kanna ea tsoela pele ho fihlela 2023
IC substrate e hlahisoa motheong oa boto ea HDI (boto ea potoloho e phahameng ea segokanyipalo), e nang le litšobotsi tsa letsoalo le phahameng, ho nepahala ho phahameng, miniaturization le bosesane. Ha thepa ea lipakeng e hokahanya chip le boto ea potoloho ts’ebetsong ea chip, mosebetsi oa mantlha oa board ea ABF ke ho etsa lipuisano tse phahameng le lebelo le phahameng la khokahano le chip, ebe o hokahana le board e kholo ea PCB ka mela e mengata ka boto ea bajari ea IC, e bapalang karolo e hokahanyang, e le ho sireletsa bots’epehi ba potoloho, ho fokotsa ho dutla, ho lokisa boemo ba mohala Ho loketse mochini o futhumatsang mocheso oa chip ho sireletsa chip, esita le ho kenya letsoho le sa sebetseng lisebelisoa tsa ho fihlela ts’ebetso e itseng ea sistimi.

Hajoale, lebaleng la liphutheloana tse phahameng, sesebelisoa sa IC se fetohile karolo ea bohlokoahali ea ho paka chip. Lintlha li bonts’a hore hajoale, karolo ea sesebelisoa sa IC ka litšenyehelo tsa ho paka ka kakaretso e fihlile ka 40%.
Har’a bajari ba IC, ho na le bajari haholo ba ABF (Ajinomoto build up film) le BT bajari ho latela mekhoa e fapaneng ea tekheniki e kang CLL resin system.
Har’a tsona, boto ea bajari ea ABF e sebelisoa haholo bakeng sa likhomphutha tse phahameng tse kang CPU, GPU, FPGA le ASIC. Kamora hore lits’oants’o tsena li hlahisoe, hangata ho hlokahala hore li kenngoe ka lebokoseng la bajari ba ABF pele li ka bokelloa botong e kholo ea PCB. Hang ha sesebelisoa sa ABF se felile, baetsi ba ka sehloohong ba kenyeletsang Intel le AMD ba ke ke ba pholoha pheletso ea hore chip e ke ke ea romelloa. Bohlokoa ba moreki oa ABF bo ka bonoa.

Ho tloha halofo ea bobeli ea selemo se fetileng, ka lebaka la kholo ea 5g, computing ea AI ea leru, li-server le limmaraka tse ling, tlhoko ea li-chips tsa ts’ebetso e phahameng ea ts’ebetso (HPC) e eketsehile haholo. Hammoho le kholo ea tlhoko ea mmaraka bakeng sa ofisi ea lapeng / boithabiso, makoloi le mebaraka e meng, tlhoko ea li-chips tsa CPU, GPU le AI ka lehlakoreng la terminal e eketsehile haholo, e leng se entseng hore tlhokeho ea liboto tsa bajari ba ABF e eketsehe.