I-substrate yefilimu I-substrate yefilimu yinkqubo ehamba phambili ye PCB Mveliso. Kwimveliso yohlobo oluthile lwe-PCB, iigrafiki zombane nganye (imizobo yesekethe yemizobo yesekethe kunye nomhlaba, iigrafiki zamandla ombane) kunye nemizobo engahambisiyo (iigraphics zokumelana ne-welding kunye nabalinganiswa) kufuneka babe nembasa enye yeplate. Ukusetyenziswa kwe-substrate yefilimu kwimveliso ye-PCB yimizobo yemaski yokuhambisa imifanekiso, kubandakanya nemizobo yesekethe kunye nemizobo yeefotoresistive. Inkqubo yoshicilelo lwesikrini kwimveliso yesilika, kubandakanya ukuvalela imizobo ye-welding kunye nabalinganiswa; Machining (ukubhola kunye nokugaya intaba) CNC umatshini lwenkqubo isiseko kunye nereferensi ukubhola.

I-Copper Clad Laminates (CLL), ekubhekiselwa kuyo njenge-Copper Clad foil layers okanye iipleyiti ze-copper-clad, ziyi-substrate material yokwenza i-PCBS. Okwangoku, ezona ndawo zisetyenziswayo kakhulu ze-PCBS ezikhethiweyo zikhethwe kwi-foil-clad foil ukufumana imigca kunye nemizobo oyifunayo.

Emva kokuba uyilo lwe-PCB lugqityiwe, kuba imilo yebhodi ye-PCB incinci kakhulu ukuhlangabezana neemfuno zenkqubo yemveliso, okanye imveliso yenziwe zii-PCBS ezininzi, kubalulekile ukuhlanganisa iibhodi ezininzi ezincinci kwibhodi enkulu ehlangabezana neemfuno zemveliso. Imephu yesiseko sefilimu kufuneka yenziwe kuqala, emva koko ifotwe okanye iphinde yenziwe kwakhona kusetyenziswa imephu esisiseko. Nophuhliso iteknoloji yekhompyutha, ibhodi eprintiweyo iteknoloji CAD wenze inkqubela phambili enkulu, kunye nobuchwepheshe kwimveliso PCB iye yaphuculwa ngokukhawuleza ukuya multi-maleko, ucingo obhityileyo, umngxuma omncinane ulwalathiso ezixineneyo. Inkqubo yoqobo yokwenziwa kwefilim ayisenako ukuhlangabezana neemfuno zoyilo lwe-PCB, ke iteknoloji yokuzoba elula ivele. Iifayile zedatha yemizobo ye-PCB eyilelwe yi-CAD inokuthunyelwa ngokuthe ngqo kwinkqubo yekhompyuter yomatshini wokuzoba obonakalayo usebenzisa ukukhanya ukuzoba imizobo ngokuthe ngqo kwizinto ezingalunganga, emva koko kuphuhliso, uguqulelo lwefilimu oluzinzileyo.

Ukuveliswa kwedatha yokudweba ukukhanya kukuguqula idatha yoyilo eyenziwa yi-software ye-CAD kwidatha yomzobo okhanyayo (uninzi lwedatha yeGerber), eguqulwa kwaye ihlelwe yinkqubo yeCAM ukugqiba ukukhanya komzobo kwangaphambili (i-collage, i-mirroring, njl.), ukuze ukuhlangabezana neemfuno zenkqubo yemveliso PCB, uze uthumele idatha kusingathwa kumatshini wokuzoba ukukhanya. Iprosesa yedatha yomfanekiso womatshini wokupeyinta optical iguqulwa ibe yidatha ye-raster, kwaye idatha ye-raster ithunyelwa kumatshini wokupeyinta i-laser optical ngokusebenzisa i-high magnifying fast compression and restoration algorithm ukugqiba umzobo optical.