ອາເລບານປະຕູ (BGA) ແຜງວົງຈອນພິມ (PCB) is a surface mount packaged PCB specifically used in integrated circuits. BGA boards are used for surface mount in permanent applications, for example, in devices such as microprocessors. These are disposable printed circuit boards that cannot be reused. BGA boards have more interconnect pins than regular PCBS. Each point on the BGA plate can be welded independently. ການເຊື່ອມຕໍ່ທັງofົດຂອງ PCBS ເຫຼົ່ານີ້ແມ່ນໄດ້ແຈກຢາຍເປັນຕາຕະລາງເອກະພາບຫຼືຕາ ໜ່າງ ພື້ນຜິວ. These PCBS are designed so that the entire underside can be easily used, rather than just the surrounding area.

The BGA package pins are much shorter than regular PCBS because it only has peripheral-type shapes. For this reason, it can provide better performance at higher speeds. BGA welding requires precise control and is more often guided by automatic machines. This is why BGA devices are not suitable for socket installation.

Welding technology BGA package

Reflow furnaces are used to weld BGA packages onto printed circuit boards. ເມື່ອການລະລາຍຂອງລູກກົ່ວໄດ້ເລີ້ມຂຶ້ນພາຍໃນເຕົາອົບ, ຄວາມເຄັ່ງຕຶງຢູ່ດ້ານໃນຂອງລູກປືນໄດ້ເຮັດໃຫ້ແພັກເກັດສອດຄ່ອງກັບຕໍາ ແໜ່ງ ຕົວຈິງຂອງມັນຢູ່ໃນແຜງວົງຈອນທີ່ພິມອອກ. This process continues until the package is removed from the oven, cooled and turned into a solid. ເພື່ອໃຫ້ມີການເຊື່ອມໂລຫະທີ່ທົນທານໄດ້, ຂັ້ນຕອນການເຊື່ອມໂລຫະທີ່ຄວບຄຸມດ້ວຍຊຸດ BGA ແມ່ນມີຄວາມຈໍາເປັນແລະຕ້ອງໄດ້ບັນລຸອຸນຫະພູມທີ່ຕ້ອງການ. It can also eliminate any possibility of short circuiting when appropriate welding techniques are used.

Advantages of BGA packaging

BGA packaging has many advantages, but only the top professionals are detailed below.

1. ແພັກເກັດ BGA ໃຊ້ພື້ນທີ່ PCB ຢ່າງມີປະສິດທິພາບ: ແພັກເກດ BGA ໃຊ້ ຄຳ ແນະ ນຳ ສຳ ລັບສ່ວນປະກອບນ້ອຍແລະພື້ນທີ່ນ້ອຍກວ່າ. These packages also help to save enough space for customization in the PCB, thereby increasing its efficiency.

2. Electrical and thermal performance improvements: The BGA package size is very small, so these PCBS have less heat loss and are easy to achieve dissipation processes. Whenever the silicon wafer is mounted on top, most of the heat is transferred directly to the ball gate. ແນວໃດກໍ່ຕາມ, ໃນກໍລະນີຂອງ wafers ຊິລິໂຄນຕິດຢູ່ດ້ານລຸ່ມ, wafers ຊິລິໂຄນເຊື່ອມຕໍ່ກັບດ້ານເທິງຂອງຊຸດ. That’s why it’s considered the best choice for cooling technology. ບໍ່ມີເຂັມຂັດທີ່ສາມາດງໍຫຼືແຕກໄດ້ຢູ່ໃນຊຸດ BGA, ສະນັ້ນເພີ່ມຄວາມທົນທານຂອງ PCBS ເຫຼົ່ານີ້ໃນຂະນະທີ່ຍັງຮັບປະກັນການປະຕິບັດໄຟຟ້າທີ່ດີ.

3. Improved manufacturing margins through improved welding: BGA package pads are large enough to make them easy to weld and easy to operate. Therefore, the ease of welding and handling makes it very fast to manufacture. ແຜ່ນຮອງແຜ່ນໃຫຍ່ຂອງ PCBS ເຫຼົ່ານີ້ຍັງສາມາດເອົາກັບມາໃຊ້ໃeasily່ໄດ້ຢ່າງງ່າຍດາຍຖ້າຈໍາເປັນ.

4. Reduced risk of damage: The BGA package uses solid state welding, thus providing strong durability and durability in all conditions.

5. ການຫຼຸດຕົ້ນທຶນ: ຂໍ້ໄດ້ປຽບເຫຼົ່ານີ້ຊ່ວຍຫຼຸດຕົ້ນທຶນການຫຸ້ມຫໍ່ BGA. The efficient use of printed circuit boards offers further opportunities to save materials and improve thermoelectric properties, helping to ensure high quality electronics and reduce defects.