Amalungu e-Ball Gate (BGA) Ephrintiwe wesifunda ibhodi (I-PCB) i-PCB ekhonjiwe ebusweni esetshenziswa ngqo kumasekethe ahlanganisiwe. BGA boards are used for surface mount in permanent applications, for example, in devices such as microprocessors. These are disposable printed circuit boards that cannot be reused. Amabhodi we-BGA anezikhonkwane eziningi zokuxhumeka kune-PCBS ejwayelekile. Iphuzu ngalinye kupuleti le-BGA lingashiselwa ngokuzimela. Konke ukuxhumana kwalezi PCBS kusatshalaliswa njenge-matrix efanayo noma igridi yaphezulu. La ma-PCBS aklanyelwe ukuthi kusetshenziswe yonke indawo engaphansi, esikhundleni sendawo ezungezile kuphela.

Izikhonkwane zephakeji le-BGA zifushane kakhulu kune-PCBS ejwayelekile ngoba inezinhlobo zohlobo lwangaphandle kuphela. Ngalesi sizathu, ingahlinzeka ngokusebenza okungcono ngejubane eliphakeme. BGA welding requires precise control and is more often guided by automatic machines. Kungakho amadivayisi we-BGA engakulungele ukufakwa kwesokhethi.

Welding technology BGA package

Reflow furnaces are used to weld BGA packages onto printed circuit boards. Lapho ukuncibilika kwebhola le-solder kuqala ngaphakathi kuhhavini, ukungezwani ebusweni bebhola le-solder kugcina iphakethe lihambelana nendawo yalo yangempela ebhodini lesifunda eliphrintiwe. Le nqubo iyaqhubeka kuze kube yilapho iphakethe likhishwa kuhhavini, lipholile futhi liphenduke isitimela. Ukuze ube nokuhlangana okuqinile kwe-solder, inqubo yokuwelda ephethwe yi-BGA iyadingeka futhi izinga lokushisa elidingekayo kufanele lifinyelelwe. Kungasusa futhi noma yikuphi ukujikeleza okufishane lapho kusetshenziswa izindlela ezifanele zokushisela.

Izinzuzo zokupakisha kwe-BGA

Ukupakisha kwe-BGA kunezinzuzo eziningi, kepha kuphela ochwepheshe abaphezulu abachazwe ngezansi.

1. Amaphakeji we-BGA asebenzisa isikhala se-PCB kahle: Amaphakeji we-BGA asebenzisa ukuqondiswa kwezinto ezincane nendawo encane. Lawa maphakeji asiza futhi ukonga isikhala esanele sokwenza ngokwezifiso ku-PCB, ngaleyo ndlela kwandise ukusebenza kwayo kahle.

2. Ukuthuthuka kokusebenza kukagesi nokushisa: Usayizi wephakeji le-BGA mncane kakhulu, ngakho-ke lawa ma-PCBS anokulahleka okuncane kokushisa futhi kulula ukufeza izinqubo zokushabalalisa. Noma nini lapho i-silicon wafer ifakwa phezulu, iningi lokushisa lidluliselwa ngqo esangweni lebhola. Kodwa-ke, esimweni sezingqimba ze-silicon ezibekwe phansi, amafers e-silicon axhuma phezulu kwephakeji. Kungakho kuthathwa njengokukhetha okuhle kakhulu kwezobuchwepheshe bokupholisa. Azikho izikhonkwane ezigoqekayo noma ezinamahloni kuphakeji le-BGA, ngaleyo ndlela kwandise ukuqina kwala ma-PCBS ngenkathi kuqinisekiswa nokusebenza okuhle kukagesi.

3. Amamajini wokukhiqiza athuthukisiwe ngokusebenzisa i-welding ethuthukisiwe: Amaphakethe wephakethe le-BGA makhulu ngokwanele ukwenza kube lula ukuwelda nokusebenziseka kalula. Ngakho-ke, ukusebenziseka kalula kokushisela nokuphatha kwenza kusheshe kakhulu ukukhiqiza. Amapayipi amakhulu ala ma-PCBS nawo angavuselelwa kalula uma kudingeka.

4. Ukwehlisa ubungozi bokulimala: Iphakethe le-BGA lisebenzisa i-solid state welding, ngaleyo ndlela linikeze ukuqina okuqinile nokuqina kuzo zonke izimo.

5. Ukwehliswa kwezindleko: Lezi zinzuzo zisiza ukunciphisa izindleko zokupakisha kwe-BGA. Ukusetshenziswa kahle kwamabhodi wesekethe aphrintiwe kunika amanye amathuba okonga izinto nokwenza ngcono izakhiwo ze-thermoelectric, okusiza ukuqinisekisa izinga eliphezulu le-elekthronikhi nokunciphisa ukukhubazeka.