Uluhlu lweSango leBhola (BGA) Ishicilelwe ibhodi yesekethe (I-PCB) yindawo engaphezulu epakishwe i-PCB esetyenziswe ngokukodwa kwiisekethi ezihlanganisiweyo. Iibhodi ze-BGA zisetyenziselwa ukunyuka komhlaba kwizicelo ezisisigxina, umzekelo, kwizixhobo ezinje ngee-microprocessors. Ezi ziibhodi zesekethe ezishicilelweyo ezingenakusetyenziswa kwakhona. Iibhodi ze-BGA zinezikhonkwane zonxibelelwano ngakumbi kuneePCBS eziqhelekileyo. Inqaku ngalinye kwipleyiti ye-BGA linokudityaniswa ngokuzimeleyo. Unxibelelwano olupheleleyo lwezi PCBS lusasazwa njenge matrix efanayo okanye igridi yomphezulu. Ezi PCBS ziyilelwe ukwenzela ukuba indawo engaphantsi ingasetyenziswa ngokulula, endaweni nje yendawo ejikelezileyo.

Izikhonkwane zephakheji ye-BGA zimfutshane kakhulu kuneePCBS eziqhelekileyo kuba inemilo yohlobo kuphela. Ngesi sizathu, inokubonelela ngokusebenza ngcono ngesantya esiphezulu. I-BGA welding ifuna ulawulo oluchanekileyo kwaye ihlala ikhokelwa ngoomatshini abazenzekelayo. Kungenxa yoko le nto izixhobo zeBGA zingakulungelanga ukufakelwa kwesokethi.

Itekhnoloji yeWelding yephakheji ye-BGA

Amanzi aphuma kwakhona asetyenziselwa ukujija iipakeji zeBGA kwiibhodi zesekethe eziprintiweyo. Xa ukunyibilika kwebhola ye-solder kuqala ngaphakathi ehovini, uxinzelelo kumphezulu webhola ye-solder igcina iphakheji ilungelelaniswe nendawo yayo kwibhodi yesekethe eprintiweyo. Le nkqubo iyaqhubeka de iphakheji isuswe ehovini, ipholile kwaye ijike ibe yinto eqinileyo. Ukuze ube nokudibanisa okuqinileyo kwe-solder, inkqubo ye-BGA elawulwa yentsimbi iyimfuneko kwaye kufuneka ubushushu obufunekayo bufikelelwe. Inokuphelisa nakuphi na ukubakho kokujikeleza okufutshane xa kusetyenziswa iindlela ezifanelekileyo zentsimbi.

Izinto eziluncedo zokupakishwa kwe-BGA

Ukupakishwa kwe-BGA kunezibonelelo ezininzi, kodwa kuphela ziingcali eziphezulu ezichaziweyo apha ngezantsi.

1. Iiphakheji ze-BGA zisebenzisa indawo ye-PCB ngokufanelekileyo: Iiphakheji ze-BGA zisebenzisa isikhokelo kumacandelo amancinci kunye nendawo encinci. Ezi phakheji zikwanceda ukugcina indawo eyoneleyo yokwenza ngokwezifiso kwi-PCB, ngokwenyusa ukusebenza kwayo ngokukuko.

2. Ukuphuculwa kokusebenza kombane kunye nobushushu: Ubungakanani bephakheji ye-BGA incinci kakhulu, ke ezi PCBS zinokulahleka kobushushu okuncinci kwaye kulula ukufikelela kwiinkqubo zokuchitha. Nanini na xa isiciko se-silicon sibekwe phezulu, ubukhulu bobushushu buhanjiswa ngqo kwisango lebhola. Nangona kunjalo, kwimeko yeefers zesilicon ezibekwe emazantsi, iifers zesilicon zidibanisa phezulu kwiphakheji. Kungenxa yoko le nto ithathwa njengeyona nto iphambili kubuchwephesha bokupholisa. Akukho zikhonkwane zinokugoba okanye zibethekileyo kwiphakeji ye-BGA, ke oko kuyonyusa ukuzinza kwezi PCBS ngelixa kuqinisekisa ukusebenza kakuhle kombane.

3. Ukuphuculwa kwemida yokuvelisa ngokuphucula i-welding: Iipakethe zepakethe ye-BGA zikhulu ngokwaneleyo ukwenzela ukuba kube lula ukudibanisa kwaye kulula ukuyisebenzisa. Ke ngoko, ukusebenziseka lula kwentsimbi kunye nokuphathwa kuyenza ikhawuleze kakhulu ukuvelisa. Iipads ezinkulu zezi PCBS zinokuphinda zisebenze ngokulula xa kufuneka njalo.

4. Ukuncitshiswa komngcipheko womonakalo: Iphakheji ye-BGA isebenzisa iwelding yombuso oqinileyo, ngaloo ndlela ibonelela ngokuzinza okunamandla kunye nokuqina kuzo zonke iimeko.

5. Ukunciphisa iindleko: Ezi zibonelelo zinceda ukunciphisa iindleko zokupakishwa kwe-BGA. Ukusetyenziswa kakuhle kweebhodi zesekethe eziprintiweyo kunika amanye amathuba okonga izinto kunye nokuphucula iipropathi zetekhnoloji yombane, ukunceda ukuqinisekisa umgangatho ophezulu we-elektroniki kunye nokunciphisa iziphene.