Ball Faʻasologa faitotoʻa (BGA) Lolomi laupapa matagaluega (PCB) o se laualuga luga afifi PCB faʻapitoa faʻaaogaina i tuʻufaʻatasia taʻamilosaga. BGA boards are used for surface mount in permanent applications, for example, in devices such as microprocessors. These are disposable printed circuit boards that cannot be reused. O laupapa BGA e tele atu fesoʻotaʻiga pine nai lo PCBS masani. Taʻitasi itu i luga o le BGA ipu mafai ona uʻamea tutoʻatasi. O le atoa fesootaiga o nei PCBS ua tufatufaina o se toniga laugatasia po luga grid. These PCBS are designed so that the entire underside can be easily used, rather than just the surrounding area.

O le BGA afifi pine e sili atu le puʻupuʻu nai lo PCBS masani aua e naʻo ona peripheral-ituaiga foliga. Mo lenei mafuaʻaga, e mafai ona maua ai sili atu faʻatinoga i maualuga maualuga televave. BGA welding requires precise control and is more often guided by automatic machines. This is why BGA devices are not suitable for socket installation.

Welding technology BGA package

Reflow furnaces are used to weld BGA packages onto printed circuit boards. A amata le faʻaliliuga o le polo solder i totonu o le ogaumu, o le le mautonu i luga o le polo solder o loʻo faʻatulagaina le afifi i lona tulaga tonu i luga o le lolomi laupapa matagaluega. O lenei gaioiga e faʻaauau pea seʻia oʻo ina aveʻese le afifi mai le ogaumu, faʻalili ma liu uʻamea. Ina ia mafai ona i ai se soʻoga soʻoga soʻoga, BGA afifi faʻatonutonuina uelo gaioiga e talafeagai ma le vevela manaʻomia tatau ona ausia. It can also eliminate any possibility of short circuiting when appropriate welding techniques are used.

Lelei o afifi BGA

BGA packaging has many advantages, but only the top professionals are detailed below.

1. BGA afifi faʻaaoga lelei PCB avanoa: BGA afifi faʻaaoga le taʻiala mo laiti vaega ma laʻititi avanoa. O nei afifi fesoasoani foi e sefe lava avanoa mo customization i le PCB, ma faʻalauteleina lona lelei.

2. Faaleleia atili o le eletise ma le vevela: O le lapoʻa BGA e laʻititi tele, o lea la o nei PCBS e faʻaititia ai le paʻu o le vevela ma e faigofie ona faʻataunuʻuina gaioiga. Soʻo se taimi e faʻamau ai le silika wafer i luga, o le tele o le vevela e faʻasaʻo tuʻusaʻo atu i le faitotoʻa o le polo. Peitaʻi, i le tulaga o silika wafers faʻapipiʻi luga o le pito i lalo, o silicon wafers fesoʻotaʻi i le pito i luga o le afifi. O le mafuaʻaga lena e manatu ai o le sili filifiliga mo faʻamaluluina tekonolosi. E leai ni faʻapipiʻi pe magaugofie pine ile afifi BGA, faʻapea ona faʻateleina ai le anagata o nei PCBS faʻapea foi ona mautinoa le lelei faʻatinoina o le eletise.

3. Improved manufacturing margins through improved welding: BGA package pads are large enough to make them easy to weld and easy to operate. O le mea lea, o le faigofie o le ueloina ma le tagofiaina faia e sili ona vave e gaosia. O lapoʻa lapoʻa o nei PCBS e mafai foi ona toe faʻaaogaina pe a manaʻomia.

4. Faʻaititia le lamatiaga o le faʻaleagaina: O le BGA afifi faʻaaogaina malo maopoopo ma faʻapea ona maua ai le malosi anagata ma anagata i tulaga uma.

5. Tau faʻaititia: O nei tulaga lelei fesoasoani faʻaititia le tau o BGA afifiina. O le lelei faʻaaogaina o lolomi laupapa faʻataʻitaʻiga ofaina nisi avanoa e sefe ai mea ma faʻaleleia thermoelectric meatotino, fesoasoani e faʻamautinoa maualuga lelei eletise ma faʻaititia leaga.