Uyilo lwephedi ye-SMT yinxalenye ebaluleke kakhulu PCB uyilo. Imisela indawo yokuthengisa yamacandelo kwi-PCB, ukuthembeka kwamalungu e-solder, iziphene ze-solder ezinokuthi zenzeke ngexesha lenkqubo ye-soldering, ukucaca, ukuvavanywa kunye nokugcinwa kokulinda ukudlala indima ebalulekileyo. Ukuba i-pad ye-PCB uyilo ichanekile, inani elincinci le-skew ngexesha lokunyuka lingalungiswa ngenxa yesiphumo sokuzilungisa soxinzelelo lomphezulu we-solder etyhidiweyo ngexesha lokuphinda kufakwe i-solder. Ngokuchasene noko, ukuba uyilo lwephedi yePCB ayichanekanga, nokuba indawo yokubeka ichanekile kakhulu, kuya kubakho iziphene ze-solder ezifana nokufuduswa kwecandelo kunye nelitye lengcwaba emva kokuphinda kufakwe i-solder. Ke ngoko, uyilo lwephedi ngomnye wemiba ephambili emisela ukwenziwa kwezixhobo zokubeka umphezulu. Iipads eziqhelekileyo “isifo esiqhelekileyo kunye nesifo esixhaphakileyo” kuyilo lwe-PCB, kwaye yenye yezinto eziphambili ezibangela iingozi ezifihliweyo kwikhwalithi yokuthengisela i-PCB.

Zithini iziphumo zeepads eziqhelekileyo kumgangatho we-solder we-PCB

1. Emva kokuba amacandelo e-chip athengiswa kwi-pad efanayo, ukuba i-pin plug-in components okanye i-wiring zithengiswa kwakhona, kukho ingozi efihliweyo yokutshatyalaliswa kobuxoki ngexesha lesibini.

2. Inani lolungiso ngexesha lokugunyaziswa okulandelayo, uvavanyo kunye nokugcinwa kokuthengiswa emva kokuthengiswa kuncinci.

3. Xa kulungiswa, i-unsoldering a component, amacandelo ajikelezayo e-pad efanayo onke ahlanjululwayo.

4. Xa i-pad isetyenziswe ngokufanayo, uxinzelelo kwi-pad lukhulu kakhulu, olubangela ukuba i-pad ihlambuluke ngexesha le-soldering.

5. I-pad efanayo yabelwana phakathi kwamacandelo, inani le-tin lininzi kakhulu, ukunyanzeliswa komhlaba ku-asymmetric emva kokunyibilika, amacandelo atsalwa kwelinye icala, abangela ukufuduka okanye amangcwaba.

6. Ngokufana nokusetyenziswa okungaqhelekanga kwezinye iipads, isizathu esona sizathu kukuba kuphela iimpawu zesekethe ziqwalaselwa kwaye indawo okanye indawo iyancipha, nto leyo ekhokelela ekufakeni icandelo elininzi kunye neziphene ezidibeneyo ze-solder kwindibano kunye nenkqubo ye-welding. , ekugqibeleni ichaphazela ukuthembeka kwesekethe. Impembelelo enkulu.