Q1

Andizange ndidibane namadyungudyungu. Injongo yokwenza browning kukudibanisa ngcono ubhedu lwentsimbi kunye pp?

Ewe, eqhelekileyo PCB iba mdaka phambi kokuba ucinezele ukunyusa uburhabaxa befoyile yobhedu ukunqanda i-delamination emva kokucinezela ngePP.

Q2

Ngaba kuya kubakho amadyungudyungu kumphezulu wobhedu oveziweyo wokwalekwa ngegolide? Njani ukuncamathelwa kweGolide yokuntywiliselwa?

Igolide yokuntywiliselwa isetyenziswa kwindawo yobhedu eveziweyo kumphezulu. Ngenxa yokuba igolide ishukuma ngakumbi, ukuze kuthintelwe ukusasazwa kwegolide kubhedu kwaye kusilele ekukhuseleni umphezulu wobhedu, ihlala ityatyiswe ngomaleko wenickel phezu kobhedu, emva koko iyenze phezu kobhedu. nickel. Uluhlu lwegolide, ukuba uluhlu lwegolide luncinci kakhulu, luya kubangela ukuba i-nickel layer i-oxidize, ibangele i-disk effect emnyama ngexesha le-soldering, kwaye i-solder joints iya kuqhekeka kwaye ziwe. Ukuba ubukhulu begolide bufikelela kwi-2u “nangaphezulu, olu hlobo lwemeko embi aluyi kwenzeka.

Q3

Ndifuna ukwazi ukuba ushicilelo lwenziwa njani emva kokutshona nge-0.5mm?

Umhlobo omdala ubhekiselele kwi-solder yokuprinta, kwaye indawo yesinyathelo ingathengiswa ngomatshini wetin okanye ulusu lwe-tin.

Q4

Ngaba i-pcb iyatshona ekuhlaleni, ngaba inani leeleya kwindawo ezikayo liyahluka? Zizakwenyuka kangakanani iindleko ngokubanzi?

Indawo yokucwila idla ngokufezekiswa ngokulawula ubunzulu bomatshini we-gong. Ngokuqhelekileyo, ukuba ubunzulu kuphela bulawulwa kwaye umaleko awuchanekanga, iindleko ziyafana. Ukuba umaleko uchanekile, kufuneka uvulwe ngamanyathelo. Indlela yokwenza, oko kukuthi, i-graphic design yenziwe kwinqanaba langaphakathi, kwaye isiciko senziwe nge-laser okanye i-milling cutter emva kokucinezela. Iindleko zinyukile. Ngokumalunga nokuba ixabiso linyukile kangakanani, wamkelekile ukudibana nabalingane kwisebe lezentengiso leYibo Technology. Baya kukunika impendulo eyanelisayo.

Q5

Xa iqondo lokushisa kwi-press lifikelela ngaphezu kwe-TG yalo, emva kwexesha elithile, liya kutshintsha ngokukhawuleza ukusuka kwindawo eqinile ukuya kwiglasi, oko kukuthi, (i-resin) iba yi-glue shape. Ayilunganga le nto. Enyanisweni, ngaphezulu kwe-Tg yimeko ephezulu ye-elastic, kwaye ngaphantsi kwe-Tg yimeko yeglasi. Oko kukuthi, iphepha liyiglasi kwiqondo lobushushu begumbi, kwaye liguqulwa libe yindawo enwebekayo ngaphezulu kwe-Tg, enokukhubazeka.

Kusenokubakho ukungaqondi kakuhle apha. Ukuze kube lula ukuba wonke umntu aqonde xa ebhala inqaku, ndayibiza ngokuba yi-gelatinous. Enyanisweni, ixabiso elibizwa ngokuba yi-PCB TG ixabiso libhekisela kwindawo ebalulekileyo yokushisa apho i-substrate inyibilika ukusuka kwisimo esiqinileyo ukuya kwi-rubbery fluid, kwaye i-Tg point yindawo yokunyibilika.

Iqondo lobushushu beglasi lolunye uphawu oluphawulweyo lobushushu beepholima eziphezulu zemolekyuli. Ukuthatha iqondo lobushushu beglasi njengomda, iipolymers zibonakalisa iimpawu ezahlukeneyo zomzimba: ngaphantsi kobushushu beglasi yokutshintsha, izinto zepolymer zikwimeko yeplastiki edityanisiweyo yemolekyuli, kwaye ngaphezulu kobushushu beglasi yokutshintsha, imathiriyeli yepolymer ikwimo yerabha…

Ngokwembono yezicelo zobunjineli, iqondo lobushushu beglasi lolona bushushu liphezulu lobunjineli beplastiki ekhompawundi yeemolekyuli, kunye nomda osezantsi wokusetyenziswa kwerabha okanye i-elastomers.

Ukuphakama kwexabiso le-TG, ngcono ukumelana nobushushu kwebhodi kwaye bhetele ukuchasana nokuguqulwa kwebhodi.

Q6

Sinjani isicwangciso esenziwe ngokutsha?

Iskimu esitsha sinokusebenzisa lonke umaleko wangaphakathi ukwenza imizobo. Xa ibhodi yenziwe, umaleko wangaphakathi ugxothwa ngokuvula isigqubuthelo. Iyafana nebhodi ethambileyo nenzima. Inkqubo inzima ngakumbi, kodwa umgca wangaphakathi we-foil yobhedu Ukususela ekuqaleni, ibhodi engundoqo icinezelwe kunye, ngokungafaniyo kwimeko apho ubunzulu bulawulwa khona kwaye emva koko i-electroplated, amandla okudibanisa akulungile.

Q7

Ngaba umzi-mveliso webhodi awundikhumbuzi xa ndibona iimfuno zobhedu? I-Gold plating kulula ukuyithetha, i-copper plating kufuneka ibuzwe

Ayithethi ukuba yonke i-copper plating elawulwayo iya kuba namadyunguza. Le yingxaki enokwenzeka. Ukuba indawo yokubeka ubhedu kwi-substrate incinci, ayiyi kuba ne-blistering. Umzekelo, akukho ngxaki enjalo kumphezulu wobhedu wePOV. Ukuba indawo yokubeka ubhedu inkulu, kukho umngcipheko onjalo.