PCB bubbling is a common defect in wave soldering. The main phenomenon is that spots or bulges appear on the soldering surface of PCB, resulting in PCB layering. So what are the causes of PCB blisters in the wave soldering process? Me pehea te whakaoti i te raru o te PCB mirumiru?

Mahia te wetewete i te pupuhi PCB:

1. Welding tin temperature is too high

What are the causes of PCB blisters in wave soldering process and how to solve them

2. The preheating temperature is too high

3. The speed of the transmission belt is too slow

4. PCB board through the tin furnace for many times

5. Kua poke te poari PCB

6. He he te rauemi PCB

7. Pad is too big

8. PCB o roto kaore i te taurite

9. Kaore e tika te wherikotanga UV

10. The thickness of green oil is insufficient

11. He mākū rawa te taiao rokiroki PCB

Nga rongoa ki te pupuhi PCB:

1. Tin temperature is set within the scope required by the operation instructions

2. Whakaritea te pāmahana whakamahana ki te tukatuka i nga whakaritenga i roto i te awhe

3. Adjust the transmission speed of the transmission belt to the process range

4. Aukati i te poari PCB te whakawhiti i te oumu tine mo nga wa maha

5. Ensure the production and storage standard of PCB board

6. Tino whakahaere i te kounga o te papa PCB raw rauemi

7. In PCB design, copper foil should be reduced as much as possible on the premise of sufficient electrical performance and reliability

8. Tirohia mēnā e tika ana nga taapiri e whakaatuhia ana e nga tuhinga a te umanga, mena kei roto i te awhe nga tautuhinga.

9. Hoki atu ki te umanga a te umanga PCB, te whakaora penehi penehi ranei