PCB bubbling is a common defect in wave soldering. The main phenomenon is that spots or bulges appear on the soldering surface of PCB, resulting in PCB layering. So what are the causes of PCB blisters in the wave soldering process? PCB pufakchalari muammosini qanday hal qilish mumkin?

PCB pufakchalari sabablarini tahlil qilish:

1. Welding tin temperature is too high

What are the causes of PCB blisters in wave soldering process and how to solve them

2. The preheating temperature is too high

3. The speed of the transmission belt is too slow

4. PCB board through the tin furnace for many times

5. PCB platasi ifloslangan

6. PCB materiali nuqsonli

7. Yostig’i juda katta

8. PCB ichki notekis

9. UV yorqinligi mos emas

10. The thickness of green oil is insufficient

11. PCB saqlash muhiti juda nam

PCB pufakchalari uchun echimlar:

1. Tin temperature is set within the scope required by the operation instructions

2. Oldindan isitish haroratini diapazondagi jarayon talablariga moslashtiring

3. Adjust the transmission speed of the transmission belt to the process range

4. Qalay o’chog’idan ko’p marta PCB taxtasidan o’tishdan saqlaning

5. PCB kartasini ishlab chiqarish va saqlash standartini ta’minlang

6. PCB taxtasi xom ashyo sifatini qat’iy nazorat qiling

7. In PCB design, copper foil should be reduced as much as possible on the premise of sufficient electrical performance and reliability

8. Sanoat organi ma’lumotlari tomonidan taqdim etilgan parametrlar mos yoki yo’qligini va Sozlamalar diapazonda ekanligini tekshiring.

9. PCB sanoatining tanasini pishirish yoki chiqindi gazni tozalashga qaytish