PCB bubbling is a common defect in wave soldering. The main phenomenon is that spots or bulges appear on the soldering surface of PCB, resulting in PCB layering. So what are the causes of PCB blisters in the wave soldering process? How to solve the problem of PCB bubbling?

Cause analysis of PCB bubbling:

1. Welding tin temperature is too high

What are the causes of PCB blisters in wave soldering process and how to solve them

2. The preheating temperature is too high

3. The speed of the transmission belt is too slow

4. PCB board through the tin furnace for many times

5. PCB board is polluted

6. PCB material is defective

7. Pad is too big

8. PCB internal uneven

9. UV brightness is not appropriate

10. The thickness of green oil is insufficient

11. PCB storage environment is too wet

Solutions to PCB bubbling:

1. Tin temperature is set within the scope required by the operation instructions

2. Adjust the preheating temperature to process requirements within the range

3. Adjust the transmission speed of the transmission belt to the process range

4. Avoid PCB board passing through tin furnace for many times

5. Ensure the production and storage standard of PCB board

6. Strictly control the quality of PCB board raw materials

7. In PCB design, copper foil should be reduced as much as possible on the premise of sufficient electrical performance and reliability

8. Check whether the parameters provided by the industry body data are appropriate and whether the Settings are within the range.

9. Return to PCB industry body baking or waste gas treatment