Take the Bluetooth speaker as an example to integrate the basic knowledge of PCB mamanu i totonu o se tulaga aoga, ma faʻamatala le aoga ma aoga poto masani ma tomai o PCB mamanu polokalama e ala i le faʻagaioiga gaioiga. Lenei vasega o le a aʻoaʻoina le fesoʻotaʻi malamalama o PCB faʻapipiʻi ala i le faʻamatalaina o le aotelega ma mataupu faʻavae o uaea mamanu.

Key points of this study:

1. Vaʻaiga lautele vaʻaiga ma mataupu faʻavae

2.PCB uaea manaʻomia tulaga masani

3. Faʻatonutonu le faʻatonutonuina o PCB uaea

Aʻoaʻoina faigata i lenei vaitaimi:

1. Vaʻaiga lautele vaʻaiga ma mataupu faʻavae

2. Faʻatonutonu le faʻatonutonuina o PCB uaea

1. Vaʻaiga lautele vaʻaiga ma mataupu faʻavae

In traditional PCB design, the wiring on the board only serves as the carrier of signal connectivity, and the PCB design engineer does not need to consider the wiring distribution parameters.

With the rapid development of the electronic industry, data swallowing from a few megabytes per unit time, tens of megabytes to the rate of 10Gbit/s has brought about the rapid development of high-speed theory, PCB wiring is no longer a simple interconnection carrier, but from the transmission line theory to analyze the impact of various distribution parameters

I le taimi lava e tasi, o le lavelave ma le mafiafia o le PCB o loʻo faʻateleina i le taimi e tasi, mai le taatele pu mamanu i Laiti pu mamanu i multistage pu pupu mamanu, o loʻo i ai pea tanu teteʻe, tanu koneteina, o se mamanu o maualuga maualuga density PCB i. aumaia faigata tele i le taimi e tasi, e manaʻomia foi PCB tisaini inisinia sili malamalama loloto o le faʻagasologa tapulaʻa o le PCB gaosiga ma gaioiga gaioiga.

Faatasi ai ma le atinae o maualuga saosaoa ma maualuga density PCB, PCB tisainiina inisinia ua avea sili atu ma sili atu taua i le masini mamanu, ae o le tutusa PCB luitau luitau ua amata ona avea atili ma sili atu, ma tisaini inisinia tatau ona iloa sili atu ma sili atu malamalamaʻaga manatu.

Lua, PCB ituaiga uʻamea

O ituaiga uaea i luga ole laupapa PCB e tele lava ina aofia ai faailo uaea, paoa sapalai ma eleele uaea. Among them signal line is the most common wiring, the type is more. Still have mono line according to wiring form, difference line.

E tusa ai ma le faʻavae tino o uaea, e mafai foi ona vaevaeina i laina lipine ma microstrip laina.

Iii. Malamalama masani o PCB uaea

General PCB wiring has the following basic requirements:

(1) QFP, SOP and other packaged rectangular pads should be led out from the PIN center (generally using pave shape).

(2) Lavalava (1) QFP, SOP ma isi afifi o faatafafa pads mai le uaea, mai le PIN center (e masani ona faʻaaoga foliga. O le mamao mai le laina i le pito o le ipu e le tatau ona itiiti ifo ma le 20MIL.

Faʻaaliga: i le ata i luga atu, o le mumu o le OUTLINE o le pito i fafo o le laupapa, ma le lanumeamata o le taʻavale o le atoa laupapa vaega vaega (o le Routkeepin e sili atu nai lo 20mil indent e faatatau i le OUTLINE).

Note: This board edge also includes window opening, milling groove, ladder, milling thin area by milling cutter processing graphics edge.

(3) I lalo o uamea masini atigi, isi fesootaiga pu e le faʻatagaina, ma luga uʻamea (masani uʻamea atigi aofia oscillator tioata, maa, ma isi)

(4) E le tatau ona i ai ni mea sese a le DRC, e aofia ai le igoa igoa tutusa DRC mea sese, seʻi vagana ai le fetaui lelei, vagana ai DRC mea sese mafua mai i le afifiina ia lava.)

(5) E leai se fesoʻotaʻiga fesoʻotaʻi i le maeʻa ai o le PCB design, ma o le PCB network e tatau ona o gatasi ma le matagaluega ata.

He is not allowed to attend the Dangline.

(7) If it is clear that non-functional pads do not need to be retained, they must be removed from the light drawing file.

(8) E fautuaina e aua le muamua afa o le mamao mai le iʻa lapoʻa 2MM

(9) It is recommended to use inner wiring for signal cables

(10) It is recommended that the corresponding power plane or ground plane of the high-speed signal area be kept intact as far as possible

(11) It is recommended that the wiring be evenly distributed. Copper should be laid in large areas without wiring, but the impedance control should not be affected

(12) It is recommended that all wiring should be chamfered, and the chamfering Angle is 45°

(13) O loʻo fautua mai e taofi laina faʻailo mai le faia o ni faʻatautau ia lava ma le umi o le itu i luga atu o le 200ML i isi vaega e sosoʻo ai

(14) It is recommended that the wiring direction of adjacent layers be orthogonal structure

Faʻaaliga: O le uaea o sosoʻo sosoʻo e tatau ona ‘aloʻalo i le auala lava e tasi e faʻaititia ai fefaʻatauaiga i le va o faaputuga. Afai e le mafai ona alofia, aemaise lava pe a fai o le faʻailoga fua e maualuga, o le foloa vaalele tatau ona mafaufauina e vavaeʻese taʻitasi vaega o laina, ma o le faʻailoga fanua e tatau ona tuʻu eseʻese laina faʻailo.

4. Faʻatonutonu le faʻatonutonuina o PCB uaea

Description: Line width in PCB processing is divided into two parts, the width of the upper surface and the width of the lower surface.

Schematic diagram of impedance calculation of single-ended signal microstrip line:

Ata faʻakomepiuta o faʻafitauli fuafuaina o laina eseʻesega laina microstrip:

Schematic diagram of impedance calculation of strip line of single-ended signal:

Ata faʻakomepiuta o laina laina faʻafetaui fuafuaina o eseesega faʻailoga:

Ata faʻakomepiuta o faʻafitauli fuafuaina o le tasi-iʻuga laina microstrip laina (ma coplanar uaea eleele):

Schematic diagram of impedance calculation of differential signal microstrip line (with coplanar ground wire) :

Lenei o le faʻaopoopoina faʻaopoopo telefoni ma mataupu faʻavae o ALLEgro mo PCB mamanu polokalama.