Thatha isikhulumi se-Bluetooth njengesibonelo sokuhlanganisa ulwazi oluyisisekelo lwe- PCB yakhela esimweni esisebenzayo, bese uchaza umsebenzi nesipiliyoni esisebenzayo namakhono we-software ye-PCB design ngenqubo yokusebenza. Lezi zifundo zizofunda ulwazi oluhlobene lwentambo ye-PCB ngokuchaza ukubuka konke kanye nemigomo yokwakhiwa kwezintambo.

Amaphuzu abalulekile kulolu cwaningo:

1. Ukubuka konke kwe-Wiring nezimiso

Izidingo eziyisisekelo ze-wiring ze-PCP

3.Impedance control ye-wiring ye-PCB

Ubunzima bokufunda ngalesi sikhathi:

1. Ukubuka konke kwe-Wiring nezimiso

2.Impedance control ye-wiring ye-PCB

1. Ukubuka konke kwe-Wiring nezimiso

Ekudizayinweni kwendabuko kwe-PCB, izintambo ezibhodini zisebenza kuphela njengothwali wokuxhumeka kwesiginali, futhi unjiniyela wokwakha we-PCB akadingi ukucabanga ngemingcele yokusabalalisa izintambo.

Ngokuthuthuka okusheshayo komkhakha we-elekthronikhi, idatha egwinya kusuka kumamegabhayithi ambalwa ngeyunithi ngayinye, amashumi ama-megabyte esilinganisweni se-10Gbit / s alethe ukuthuthuka okusheshayo kwethiyori yejubane, i-PCB wiring ayiseyona into elula yokuxhumana , kodwa kusukela kumcabango womugqa wokudlulisa ukuhlaziya umthelela wamapharamitha wokusabalalisa ahlukahlukene

Ngasikhathi sinye, ubunzima nobuningi be-PCB bukhula ngasikhathi sinye, kusukela ekwakhiweni komgodi ovamile kuya ekwakhiweni komgodi omncane kuya ekwakhiweni kwembobo eyimpumputhe, kusenomngcwabo ongcwatshiwe, isitsha esingcwatshiwe, umklamo wentambo enkulu ye-PCB letha ubunzima obukhulu ngasikhathi sinye, futhi udinga i-PCB design engineer ngokujula kokuqonda kwenqubo yamapharamitha womkhiqizo we-PCB kanye nenqubo yokucubungula.

Ngokuthuthukiswa kwesivinini esikhulu kanye nokuqina okuphezulu kwe-PCB, onjiniyela bokwakha be-PCB baya ngokuya bebaluleke kakhulu ekwakhiweni kwezingxenyekazi zekhompiyutha, kuyilapho izinselelo zokuklanywa kwe-PCB ezihambelana nazo ziya ngokuya zanda, futhi onjiniyela bokudizayina badinga ukwazi amaphuzu amaningi wolwazi.

Okubili, uhlobo lwentambo ye-PCB

Izinhlobo zezintambo ebhodini le-PCB ikakhulu zifaka ikhebula lesiginali, ukunikezwa kwamandla kanye nocingo lomhlabathi. Phakathi kwabo ulayini wesiginali yi-wiring ejwayelekile kakhulu, uhlobo lukhulu kakhulu. Namanje uno-mono line ngokuya ngefomu lezintambo, ulayini wokuhluka.

Ngokuya ngesakhiwo somzimba sezintambo, singabuye sihlukaniswe ngomugqa weribhoni nolayini we-microstrip.

Iii. Ulwazi oluyisisekelo lwe-wiring ye-PCB

Izintambo ezijwayelekile ze-PCB zinezidingo eziyisisekelo ezilandelayo:

(1) I-QFP, i-SOP namanye ama-pads angunxande ahlanganisiwe kufanele akhishwe esikhungweni se-PIN (imvamisa kusetshenziswa umumo wepali).

(2) Indwangu (1) i-QFP, i-SOP namanye amaphakheji wamapayipi angama-rectangular aphuma ocingweni, avela esikhungweni se-PIN (ngokuvamile esebenzisa ukuma. Ibanga elisuka kulayini liye emaphethelweni epuleti ngeke libe ngaphansi kuka-20MIL.

Qaphela: kulesi sibalo esingenhla, okubomvu yi-OUTLINE yohlaka lwangaphandle lwebhodi, futhi okuluhlaza kuyindlela yokuhamba kuyo yonke indawo enezintambo zebhodi (i-Routkeepin ingaphezulu kwama-20mil okufakwe ngaphakathi ku-OUTLINE).

Qaphela: Leliphetho lebhodi lifaka nokuvulwa kwewindi, indawo yokugaya, iladi, indawo yokugaya ngomugqa wokugaya wokusika wehluzo.

(3) Ngaphansi kwamadivayisi egobolondo lensimbi, ezinye izimbobo zenethiwekhi azivunyelwe, kanye ne-wiring surface (amagobolondo wensimbi ajwayelekile afaka i-crystal oscillator, ibhethri, njll.)

(4) Ukuxhuma izintambo ngeke kube namaphutha e-DRC, kufaka phakathi amaphutha we-network efanayo e-DRC, ngaphandle kokuklanywa okuhambisanayo, ngaphandle kwamaphutha e-DRC adalwe ukuzipakisha uqobo.)

(5) Ayikho inethiwekhi engaxhumekile ngemuva kokuklanywa kwe-PCB, futhi inethiwekhi ye-PCB kufanele ihambisane nomdwebo wesifunda.

Akavumelekile ukuya eDangline.

(7) Uma kusobala ukuthi amaphedi angasebenzi awadingi ukugcinwa, kufanele asuswe kufayela lokudweba elikhanyayo.

(8) Kunconywa ukuthi ungaqali uhhafu webanga ukusuka ku-2MM enkulu yenhlanzi

(9) Kunconywa ukusebenzisa izintambo zangaphakathi zezintambo zesiginali

(10) Kunconywa ukuthi indiza yamandla ahambisanayo noma indiza yaphansi yendawo yesiginali enejubane eliphezulu igcinwe iqinile ngangokunokwenzeka

(11) Kunconywa ukuthi izintambo zisatshalaliswe ngokulinganayo. Ithusi kufanele libekwe ezindaweni ezinkulu ngaphandle kwezintambo, kepha ukulawulwa kwe-impedance akufanele kuthinteke

(12) Kunconywa ukuthi yonke i-wiring kufanele ibhajwe, kanti i-Angfering Angle ingama-45 °

(13) Kuphakanyiswa ukuthi kuvinjelwe imigqa yesiginali ukuthi ingazenzeli izihibe ngobude bezinhlangothi ezingaphezulu kuka-200ML ezingqimbeni eziseduze

(14) Kunconywa ukuthi ukuqondiswa kwentambo kwezendlalelo ezincikene kube yisakhiwo se-orthogonal

Qaphela: Ukuxhunywa kwezendlalelo eziseduze kufanele kugwenywe ohlangothini olufanayo ukwehlisa ukukhuluma phakathi kwezendlalelo. Uma kungenakugwenywa, ikakhulukazi uma izinga lesiginali liphezulu, indiza yaphansi kufanele ibhekwe njengehlukanisa isendlalelo ngasinye sezintambo, futhi nesiginali yomhlaba kufanele ihlukanise ulayini ngamunye wesiginali.

4.Impedance control ye-wiring ye-PCB

Incazelo: Ububanzi bomugqa ekusetshenzisweni kwe-PCB buhlukaniswe izingxenye ezimbili, ububanzi bendawo engenhla nobubanzi bendawo engezansi.

Umdwebo wesikimu wokubalwa kwe-impedance kolayini owodwa wesiginali microstrip:

Umdwebo wokuhlelwa kokubalwa kwe-impedance womugqa wesiginali we-microstrip ohlukile:

Umdwebo wesikimu wokubalwa kwe-impedance kolayini we-strip wesiginali esiphelile:

Umdwebo wesikimu we-band line impedance calculation of signal differential:

Umdwebo wokuhlelwa kokubalwa kwe-impedance kolayini owodwa ophelile wesiginali microstrip (ngocingo lwe-coplanar ground):

Umdwebo wesikimu wokubalwa kwe-impedance kolayini wokuhlukaniswa kwesiginali microstrip (ngocingo lwaphansi lwe-coplanar):

Lokhu ukubuka konke kwezintambo kanye nemigomo ye-ALLEgro yesoftware yokwakha ye-PCB.