Ibhodi PCB zisetyenziswa kakhulu kwizinto zombane, iikhompyutha, izixhobo zombane, izixhobo zoomatshini kunye namanye amashishini. Yinkxaso yamacandelo kwaye isetyenziselwa ikakhulu ukudibanisa amacandelo ukubonelela ngombane. Phakathi kwabo, iibhodi zeesekethe ezine-4 kunye ne-6-layer zesekethe ziqhelekileyo kwaye zisetyenziswa kakhulu. , Amanqanaba ahlukeneyo amaleko e-PCB anokukhethwa ngokwezicelo zeshishini.

Inkqubo yokonakala kwebhodi yesekethe yePCB:

Inkqubo ye-etching yebhodi yesekethe eprintiweyo idla ngokugqitywa kwi-tank corrosion. Isixhobo sokutsala esisetyenzisiweyo yiferric chloride. Isisombululo (i-FeCL3 yoxinaniso 30% -40%) singabizi, isantya sokusabela kwe-corrosion sicotha, inkqubo kulula ukuyilawula, kwaye iyasebenza Ukonakala kweelaminates ezinxibe ubhedu olulodwa kunye namacala amabini.

Isisombululo esonakalisayo ngokuqhelekileyo senziwe nge-ferric chloride kunye namanzi. I-ferric chloride yinto eqinileyo etyheli, kwaye kulula ukufunxa ukufuma emoyeni, ngoko kufuneka ivalwe kwaye igcinwe. Xa ulungiselela isisombululo se-ferric chloride, i-40% ye-ferric chloride kunye ne-60% yamanzi isetyenziswa ngokubanzi, ngokuqinisekileyo, i-ferric chloride engaphezulu, okanye amanzi ashushu (kungekhona amanzi ashushu ukukhusela ipeyinti ukuba ingawi) ingenza impendulo ngokukhawuleza Qaphela ukuba i-chloride ye-ferric iyadleka. Zama ukuba ungachukumisi ulusu kunye nempahla yakho. Sebenzisa isitya seplastiki esitshiphu kwisitya sokusabela, vele ulungele ibhodi yesekethe.

Qala ukudleka ibhodi yesekethe PCB ukusuka emphethweni. Xa i-foil yobhedu engapeyintwanga idliwe, ibhodi yesekethe kufuneka ikhutshwe kwangethuba ukuthintela ipeyinti ekukhukuliseni iisekethe eziluncedo. Ngeli xesha, hlambulula ngamanzi acocekileyo, kwaye uhlambe ipeyinti kunye ne-bamboo chips ngendlela (ngeli xesha, ipeyinti iphuma kumanzi kwaye kulula ukuyisusa). Ukuba akukho lula ukuyikrwempa, yisusele nje ngamanzi ashushu. Emva koko wosule kwaye upholise nge-sandpaper, utyhile i-foil yobhedu ekhanyayo, kwaye ibhodi yesekethe eprintiweyo ilungile.

Emva kokuba ibhodi yesekethe eprintiweyo idliwe, unyango olulandelayo kufuneka lwenziwe emva kokuba ibhodi yesekethe eprintiweyo idliwe.

1. Emva kokususa ifilimu, ibhodi yesekethe eprintiweyo ehlanjululwe ngamanzi acocekileyo ifakwe emanzini atshisayo ixesha elithile, kwaye ke ifilimu edibeneyo (ifakwe) ingaxutywa. Indawo engapheliyo inokucocwa nge-thinner de ibe ihlambulukile.

2. Susa ifilimu ye-oxide. Xa ifilimu edibeneyo (ifakwe) ihlanjululwe, emva kokuba ibhodi yesekethe eprintiweyo yomile, sula ibhodi ngokuphindaphindiweyo ngelaphu elifakwe kwi-decontamination powder ukuze usule ifilimu ye-oxide kwi-foil yobhedu, ukwenzela ukuba isekethe eprintiweyo kunye ne-soldering. umbala wobhedu utyhilekile kwidiski.

Kufuneka kuqatshelwe ukuba xa usula i-foil yobhedu ngendwangu, kufuneka ihlanjululwe ngendlela echanekileyo ukuze wenze i-foil yobhedu ibonise ulwalathiso olufanayo, olubukeka luhle kakhulu. Hlanza ibhodi yesekethe eprintiweyo epholileyo ngamanzi kwaye uyomise.

3. Ukusebenzisa i-flux Ukuze uququzelele i-soldering, qinisekisa ukuhanjiswa kwebhodi yesekethe eprintiweyo kunye nokuthintela ukubola, emva kokuba ibhodi yesekethe eprintiweyo igqityiwe, umgca we-flux kufuneka usetyenziswe kwi-foil yobhedu yebhodi yesekethe eprintiweyo ukukhusela i-oksijini.