PCB ibhodi zisetshenziswa kabanzi kuma-electronics, amakhompiyutha, izinto zikagesi, izinto zemishini nezinye izimboni. Iwukusekelwa kwezingxenye futhi isetshenziselwa ngokuyinhloko ukuxhuma izingxenye ukuhlinzeka ngogesi. Phakathi kwazo, amabhodi wesifunda ane-4-layer kanye ne-6-layer avame kakhulu futhi asetshenziswa kabanzi. , Amazinga ahlukene wezendlalelo ze-PCB angakhethwa ngokuya ngezinhlelo zokusebenza zemboni.

Inqubo yokugqwala yebhodi lesifunda le-PCB:

Inqubo yokufaka ibhodi lesifunda ephrintiwe ivamise ukuqedwa ethangini lokugqwala. I-etching material esetshenzisiwe yi-ferric chloride. Isixazululo (i-FeCL3 concentration 30% -40%) sishibhile, isivinini sokuphendula ukugqwala sihamba kancane, inqubo kulula ukuyilawula, futhi siyasebenza Ukugqwala kwama-laminates agqoke ithusi anezinhlangothi ezimbili.

Isixazululo esonakalisayo ngokuvamile senziwe nge-ferric chloride namanzi. I-ferric chloride iqinile ngokuphuzi, futhi kulula ukumunca umswakama emoyeni, ngakho kufanele ivalwe futhi igcinwe. Lapho ulungiselela isisombululo se-ferric chloride, i-ferric chloride engu-40% kanye namanzi angu-60% ngokuvamile asetshenziswa, yebo, i-ferric chloride eyengeziwe, noma amanzi afudumele (hhayi amanzi ashisayo ukuvimbela upende ukuthi ungawi) angenza ukusabela kusheshe Qaphela ukuthi i-ferric chloride iyagqwala. Zama ukuthi ungasithinti isikhumba sakho nezingubo. Sebenzisa isitsha sepulasitiki esishibhile somkhumbi wokusabela, vele ulingane nebhodi lesifunda.

Qala ukugqwala ibhodi lesifunda le-PCB ukusuka onqenqemeni. Lapho i-foil yethusi engapendiwe igqwalile, ibhodi lesifunda kufanele likhishwe ngesikhathi ukuze kuvinjelwe upende ekuguguleni amasekethe awusizo. Ngalesi sikhathi, hlambulula ngamanzi ahlanzekile, bese usula upende ngama-bamboo chips ngendlela (ngalesi sikhathi, upende uphuma oketshezini futhi kulula ukuwususa). Uma kungelula ukunwaya, vele uyihlambulule ngamanzi ashisayo. Bese wesula bese upholisha nge-sandpaper, uveze i-foil yethusi ecwebezelayo, futhi ibhodi lesifunda eliphrintiwe selilungile.

Ngemva kokuba ibhodi lesifunda eliphrintiwe lidliwe, lezi zindlela zokwelapha ezilandelayo kufanele zenziwe ngemva kokuba ibhodi lesifunda eliphrintiwe ligqwalile.

1. Ngemuva kokukhipha ifilimu, ibhodi lesifunda eliphrintiwe elihlanjululwe ngamanzi ahlanzekile lifakwe emanzini ashisayo isikhathi esithile, bese ifilimu eboshwe (enamathiselwe) ingasuswa. Indawo engasuliwe ingahlanzwa nge-thinner ize ihlanzeke.

2. Susa ifilimu ye-oxide. Lapho ifilimu eboshiwe (enamathiselwe) ihlutshiwe, ngemva kokuba ibhodi lesifunda eliphrintiwe isomile, sula ibhodi ngokuphindaphindiwe ngendwangu efakwe ku-decontamination powder ukuze usule ifilimu ye-oxide ku-foil yethusi, ukuze isekethe ephrintiwe kanye ne-soldering The bright umbala wethusi uvezwa kudiski.

Kumele kuqashelwe ukuthi lapho usula i-foil yethusi ngendwangu, kufanele isulwe ngendlela eqondile ukuze wenze i-foil yethusi ibonise isiqondiso esifanayo, esibukeka sihle kakhulu. Hlanza ibhodi lesifunda elipholishiwe eliphrintiwe ngamanzi bese ulomisa.

3. Ukusebenzisa i-flux Ukuze wenze lula i-soldering, qinisekisa ukuqhutshwa kwebhodi lesifunda eliphrintiwe futhi uvimbele ukugqwala, ngemva kokuba ibhodi lesifunda eliphrintiwe seliqediwe, ungqimba lwe-flux kufanele lusetshenziswe ku-foil yethusi yebhodi lesifunda eliphrintiwe ukuvimbela umoya-mpilo.