Wonke umntu uyayazi indlela yokuthintela ukugoba kwe-PCB kunye nebhodi ejikelezayo ukuba ingangeni kwiziko lokubuyela kwakhona. Oku kulandelayo yingcaciso kumntu wonke:

1. Ukunciphisa impembelelo yobushushu kwi Ibhodi PCB uxinzelelo

Ekubeni “iqondo lokushisa” lingowona mthombo oyintloko woxinzelelo lwebhodi, nje ukuba iqondo lokushisa le-oven yokubuyisela liyancipha okanye izinga lokufudumeza kunye nokupholisa kwebhodi kwi-oven yokubuyisela iyancipha, ukwenzeka kokugoba kweplate kunye ne-warpage kunokuba kakhulu. kuncitshisiwe. Nangona kunjalo, ezinye iziphumo zecala zinokuthi zenzeke, njenge-solder short circuit.

2. Ukusebenzisa iphepha leTg eliphezulu

I-Tg yiqondo lokushisa lokutshintsha kweglasi, oko kukuthi, iqondo lokushisa apho izinto zitshintsha ukusuka kwiglasi ukuya kwimeko yerabha. Ixabiso eliphantsi le-Tg lezinto eziphathekayo, ngokukhawuleza ibhodi iqala ukuthamba emva kokungena kwi-oven yokubuyisela, kwaye ixesha elithathayo ukuze libe yimeko yerabha ethambileyo iya kuba yinde, kwaye ukuguqulwa kwebhodi kuya kuba nzima ngakumbi. . Ukusebenzisa i-Tg plate ephezulu kunokunyusa amandla ayo okumelana noxinzelelo kunye nokuguqulwa, kodwa ixabiso lezinto eziphathekayo liphezulu.

3. Ukwandisa ubukhulu bebhodi yesekethe

Ukuze ufezekise injongo yokukhanya kunye nokuncinci kwiimveliso ezininzi ze-elektroniki, ubukhulu bebhodi bushiye i-1.0mm, 0.8mm, okanye i-0.6mm. Ubungqingqwa obunjalo kufuneka bugcine ibhodi ingakhuli emva kwesithando somlilo, okunzima ngokwenene. Kunconywa ukuba ukuba akukho mfuneko yokukhanya kunye nokunciphisa, ubukhulu bebhodi kufuneka bube yi-1.6mm, enokunciphisa kakhulu umngcipheko wokugoba kunye nokuguqulwa kwebhodi.

4. Nciphisa ubungakanani bebhodi yesekethe

Kwaye unciphise inani leephazili

Ekubeni uninzi lweziko lokutshiza zisebenzisa amatyathanga ukuqhubela phambili ibhodi yesekethe, ubukhulu bebhodi yesekethe buya kuba bubunzima bayo, i-dent kunye nokuguqulwa kwesithando somlilo, ngoko zama ukubeka icala elide lebhodi yesekethe. njengomphetho webhodi. Kwikhonkco lesithando somlilo, ukudakumba kunye nokuguqulwa okubangelwa ubunzima bebhodi yesiphaluka kunokunciphisa. Ukuncitshiswa kwenani leepaneli nako kusekelwe kwesi sizathu. Oko kukuthi, xa udlula isithando somlilo, zama ukusebenzisa i-edge emxinwa ukugqithisa ulwalathiso lwesithando somlilo kangangoko kunokwenzeka. Isixa sokudakumba deformation.

5. Ukusetyenziswa kwetreyi yesithando somlilo

Ukuba iindlela ezi ngasentla zinzima ukufezekisa, okokugqibela kukusebenzisa i-reflow carrier / template ukunciphisa inani le-deformation. Isizathu sokuba i-reflow carrier / template inokunciphisa ukugoba kwepleyiti kukuba ingaba kukwandiswa kwe-thermal okanye ukuchithwa okubandayo, i-tray inethemba Unako ukulungisa ibhodi yesiphaluka kwaye ulinde de ukushisa kwebhodi yesekethe kungaphantsi kwe-Tg. ixabiso kwaye uqale ukuqina kwakhona, kwaye unokugcina ubungakanani begadi.

Ukuba i-pallet ye-single-layer ayikwazi ukunciphisa i-deformation yebhodi yesekethe, isigqubuthelo kufuneka songezwe kwi-clamp ibhodi yesiphaluka kunye neepaliti eziphezulu kunye nezantsi. Oku kunokunciphisa kakhulu ingxaki yokuguqulwa kwebhodi yesiphaluka ngokusebenzisa isithando somlilo. Nangona kunjalo, le tray ye-oveni ibiza kakhulu, kwaye kufuneka ibekwe ngesandla kwaye isetyenziswe kwakhona.

6. Sebenzisa i-Router endaweni ye-V-Cut ukusebenzisa i-sub-board

Ekubeni i-V-Cut iya kutshabalalisa amandla okwakhiwa kwepaneli phakathi kweebhodi zeesekethe, zama ukungasebenzisi i-V-Cut sub-board okanye ukunciphisa ubunzulu be-V-Cut.