Wonke umuntu uyazi ukuthi kuvinjwa kanjani ukugoba kwe-PCB kanye ne-warping yebhodi ukuthi ingangeni esithandweni sokugeleza kabusha. Okulandelayo kuyincazelo yawo wonke umuntu:

1. Yehlisa ithonya lokushisa PCB ibhodi ukucindezeleka

Njengoba “izinga lokushisa” liwumthombo oyinhloko wokucindezeleka kwebhodi, inqobo nje uma izinga lokushisa lehhavini lokugeleza lehliswa noma izinga lokushisa nokupholisa ibhodi kuhhavini lokugeleza liyancipha, ukuvela kokugoba kwepuleti kanye ne-warpage kungaba kakhulu. kuncishisiwe. Kodwa-ke, eminye imiphumela emibi ingase yenzeke, njenge-solder short circuit.

2. Ukusebenzisa ishidi le-Tg eliphezulu

I-Tg izinga lokushisa lokushintsha kwengilazi, okungukuthi, izinga lokushisa lapho izinto zishintsha kusuka kusimo sengilazi kuya esimweni senjoloba. Lapho liphansi inani le-Tg lezinto ezibonakalayo, ibhodi liqala ukuthamba ngokushesha ngemva kokungena kuhhavini lokugeleza kabusha, futhi isikhathi esisithathayo ukuze sibe isimo senjoloba ethambile Lizoba lide, futhi ukuguqulwa kwebhodi kuzoba kubi kakhulu. . Ukusebenzisa ipuleti le-Tg eliphakeme kungakhuphula ikhono layo lokumelana nengcindezi nokuguqulwa, kodwa intengo yezinto ezibonakalayo iphezulu uma kuqhathaniswa.

3. Khulisa ubukhulu bebhodi lesifunda

Ukuze kuzuzwe inhloso yokukhanya nokuzaca kwemikhiqizo eminingi ye-elekthronikhi, ukujiya kwebhodi kushiye u-1.0mm, 0.8mm, noma u-0.6mm. Ubukhulu obunjalo kufanele bugcine ibhodi lingaguquki ngemva kwesithando somlilo sokugeleza kabusha, okunzima ngempela. Kunconywa ukuthi uma kungekho mfuneko yokukhanya nokuqina, ubukhulu bebhodi kufanele bube ngu-1.6mm, okunganciphisa kakhulu ingozi yokugoba nokuguqulwa kwebhodi.

4. Yehlisa ubukhulu bebhodi lesifunda

Futhi ukunciphisa inani puzzle

Njengoba iningi lama-reflow furnaces lisebenzisa amaketanga ukuze liqhubele phambili ibhodi lesifunda, ubukhulu bebhodi lesifunda buyoba likhulu ngenxa yesisindo salo, ukubola kanye nokuguqulwa kwesithando somlilo, ngakho-ke zama ukubeka uhlangothi olude lwebhodi lesifunda. njengomphetho webhodi. Eketheni lesithando somlilo sokugeleza, ukucindezeleka nokuguqulwa okubangelwa isisindo sebhodi lesifunda kungancishiswa. Ukwehliswa kwenani lamaphaneli nakho kusekelwe kulesi sizathu. Okusho ukuthi, lapho udlula isithando somlilo, zama ukusebenzisa unqenqema oluncane ukuze udlule isiqondiso sesithando somlilo ngangokunokwenzeka. Inani le-deformation deformation.

5. I-tray yesithando somlilo esetshenzisiwe

Uma izindlela ezingenhla zinzima ukufeza, okokugcina ukusebenzisa isithwali sokugeleza kabusha/isifanekiso ukuze kuncishiswe inani lokuguqulwa. Isizathu sokuthi umthwali we-reflow / ithempulethi inganciphisa ukugoba kwepuleti kungenxa yokuthi kungakhathaliseki ukuthi ukunwetshwa okushisayo noma ukugoqa okubandayo, i-tray ithenjwa Ungakwazi ukulungisa ibhodi lesifunda bese ulinda kuze kube yilapho izinga lokushisa lebhodi lesifunda liphansi kune-Tg. value bese uqala ukuqina futhi, futhi ungakwazi nokugcina ubukhulu bensimu.

Uma i-pallet ye-single-layer ingakwazi ukunciphisa ukuguqulwa kwebhodi lesifunda, isembozo kufanele sengezwe ukuze ubambe ibhodi lesifunda ngamaphalethi aphezulu naphansi. Lokhu kunganciphisa kakhulu inkinga yokuguqulwa kwebhodi lesifunda ngokusebenzisa isithando somlilo sokugeleza kabusha. Nokho, leli threyi likahhavini libiza kakhulu, futhi kufanele libekwe mathupha futhi ligaywe kabusha.

6. Sebenzisa i-Router esikhundleni se-V-Cut ukuze usebenzise i-sub-board

Njengoba i-V-Cut izobhubhisa amandla esakhiwo sephaneli phakathi kwamabhodi wesifunda, zama ukungasebenzisi i-V-Cut sub-board noma ukunciphisa ukujula kwe-V-Cut.