Purpose 1.

Standardize the PCB process design of products, specify the related parameters of PCB process design, make The PCB design meet the requirements of producibility, testability, safety, EMC, EMI and other technical specifications, and build the advantages of process, technology, quality and cost of products in the process of product design.

Analysis of related parameters of PCB process design

2. Application scope

This specification is applicable to PCB process design of all electric products, and applies to but not limited to PCB design, PCB board casting process review, single board process review and other activities. In case of any conflict between the relevant standards and the contents of the specifications before this Code and the provisions of this Code, this code shall prevail.

3. Define

Through hole (VIA) : A metallized hole used for inner connection, but not for insertion of component leads or other reinforcement material.

Blind via: A through-hole extending from the printed board to only one surface.

Buried via: A conductive hole that does not extend to the surface of a printed board.

Through via: A through-hole extending from one surface of a printed board to another.

Component hole: hole used for Component terminals fixed to PCB and electrical connection of conductive graphics.

Stand off: Vertical distance from the bottom of the body of the surface mount device to the bottom of the pin.

4. Reference/reference standards or materials

Ts-s0902010001 information Technology Equipment PCB = “”

Ts-soe0199001 “Specification for Forced Air Cooling and Heating Design of Electronic Equipment”

Ts-soe0199002 “Specification for Natural Cooling and Heat Design of Electronic Equipment”

Printed Circuit Board Design IEC60194 Printed Circuit Board Design, Manufacturing and Assembly Terms and Definitions

Manufacture and Assembly – Terms and Definitions)

IPC — A-600F Acceptably of Printed Board

IEC60950

5. Regulate content

5.1 PCB board requirements

5.1.1 Determine PCB plate and TG value

Determine the board used for PCB, such as FR — 4, aluminum, ceramic, paper core, etc. If high TG is used, thickness tolerance should be indicated in the document.

5.1.2 Determine the surface treatment coating of PCB

Determine PCB copper foil surface treatment coating, such as tin, nickel gold or OSP, and note in the document.