O le mea fou ma le faʻaogaina o tuʻufaʻatasia o matagaluega ma le faʻataʻitaʻiga ma le faʻatinoina maualuga o oloa faʻaeletoroni tulei PCB substrate mea tekonolosi luga o le ala o le maualuga faʻatinoina atinae. Faatasi ai ma le televave faʻalauteleina o PCB manaʻoga i le lalolagi maketi, o le gaosiga, ituaiga ma tekonolosi o PCB substrate mea oloa na atiina ae i se saoasaoa maualuga. O lenei tulaga substrate mea talosaga, na aliali mai se lautele lautele fanua – multilayer lolomi laupapa matagaluega. I le taimi lava e tasi, o lenei tulaga substrate mea i tuutuuga o fausaga fausiaina, sili atiina ae lona faʻateleina.

Mai le amataga o le 20 seneturi i le faaiuga o le 1940s, PCB substrate mea alamanuia na i lona amataga. O lona atinaʻe foliga e masani ona atagia mai i: i lenei vaitaimi, o le tele numera o resins, faʻamalosia mea ma insulated substrates mo substrate mea na aliaʻe mai, ma o le tekonolosi na muamua suʻesuʻega. O nei mea uma ua fausia ai tulaga tatau mo le aliali mai ma le atinaʻeina o le apamemea-ofuina ipu, o le sili ona masani substrate mea mo lolomi laupapa matagaluega. I leisi itu, o le PCB gaosi tekonolosi, lea e faʻaaogaina ai le uʻamea foil metotia metotia (toʻesea metotia) e gaosia matagaluega o le autu, ua muamua faʻavaeina ma atiaʻe. E i ai se taua filifiliga i le fuafuaina o le fausaga tuufaatasiga ma uiga tulaga o apamemea ofu lino.

Na faʻaaoga panels apamemea i le gaosiga o le PCB i luga o se fua moni ma muamua faʻaalia i Amerika PCB alamanuia i le 1947. PCB substrate mea alamanuia ua ulufale i lona amataga tulaga o atinae. I lenei laasaga, o mea masani na faʻaaogaina i le gaosiaina o mea taua – vailaʻau resin, faʻamalosia mea, apamemea foil ma isi gaosiga tekonolosi alualu i luma, i le alualu i luma o substrate mea alamanuia e maua ai se malosi malosiaga. Ona o lenei, substrate mea gaosi tekonolosi amata ona matutua laʻasaga.

I le faʻaiuga o le 1980s, na amata ulufale ai oloa faʻaeletoroni feaveaʻi i komepiuta api, telefoni feʻaveaʻi, ma tamaʻi ata puʻe ata i le maketi. O nei oloa faʻaeletoroni o loʻo televave atinae i le itu o miniaturization, mama ma tele-gaioiga, lea e faʻateleina ai le alualu i luma o le PCB agai micro-hole ma micro-wire. I lalo o le suiga o le PCB maketi manaʻoga, o se fou augatupulaga o multilayer laupapa e mafai ona iloaina maualuga density maualuga, BUM (BUM mo puʻupuʻu) sau i fafo i le 1990s. O lenei taua tekonolosi alualu i luma faia foi le substrate mea alamanuia e ulufale i se fou laasaga o atinae puleaina e substrate mea mo maualuga maualuga density interconnect (HDI) multilayer. I lenei laʻasaga fou, o le tekonolosi masani-apamemea fusia feagai fou luitau. E i ai suiga fou ma fou fausiaina i PCB substrate mea, pe i fale gaosi mea, ituaiga gaosiga, substrate fausaga, faʻatinoga uiga, poʻo i oloa galuega.

O le atinaʻeina o mea faʻavae PCB substrate ua silia ma le 50 tausaga. I se faʻaopopoga, e tusa ma le 50 tausaga o faʻasaienisi faʻataʻitaʻiga ma le suʻesuʻeina o mea masani lava na faʻaaogaina e le pisinisi – resins ma mea e faʻamalosia ai, ma PCB substrate mea na faʻaputuputuina se talafaʻasolopito toeitiiti 100 tausaga. Taitasi laasaga o atinae o substrate mea alamanuia o lo o tuleia e le fou o eletise atoatoa masini oloa, semiconductor gaosiga tekonolosi, faaeletonika faapipiiina tekonolosi ma faaeletonika matagaluega gaosi tekonolosi.