Ho qaptjoa le ts’ebeliso ea potoloho e kopaneng le ts’ebetso e nyane ea ts’ebetso le ts’ebetso e phahameng ea lihlahisoa tsa elektroniki PCB substrate theknoloji ea thepa holim’a pina ea nts’etsopele e phahameng ea ts’ebetso. Le katoloso e potlakileng ea tlhoko ea PCB ‘marakeng oa lefatše, tlhahiso, mefuta e fapaneng le theknoloji ea lihlahisoa tsa lihlahisoa tsa substrate tsa PCB li entsoe ka lebelo le phahameng. Mothati ona oa tšebeliso ea thepa ea substrate, ho hlahile lebala le lecha le pharalletseng – boto ea potoloho e hatisitsoeng ka bongata. Ka nako e ts’oanang, sethala sena sa substrate ea thepa ka sebopeho sa sebopeho, se ntlafalitse phapang ea sona haholo.

Ho tloha qalong ea lekholo la bo20 la lilemo ho isa qetellong ea li-1940, indasteri ea lihlahisoa tsa PCB e ne e le qalong. Likarolo tsa eona tsa nts’etsopele li bonahala haholo ho: nakong ena, palo e kholo ea li-resin, lisebelisoa tsa matlafatso le li-substrate tse sirelletsang thepa ea substrate li hlahile, mme theknoloji e bile tlhahlobo ea pele. Tsena tsohle li thehile maemo a hlokahalang bakeng sa ponahalo le nts’etsopele ea poleiti e koahetsoeng ka koporo, e leng thepa e tloaelehileng ea substrate bakeng sa boto ea potoloho e hatisitsoeng. Ka lehlakoreng le leng, theknoloji ea tlhahiso ea PCB, e sebelisang mokhoa oa tšepe oa ho cheka tšepe (mokhoa oa ho tlosa) ho etsa potoloho e le ea mantlha, e se e thehiloe qalong ebile e ntlafalitsoe. E bapala karolo ea makhaola-khang ho laoleng sebopeho le sebopeho sa maemo a poleiti e koahetsoeng ka koporo.

Likarolo tse koahetsoeng ka koporo li ne li sebelisoa tlhahiso ea PCB ka bongata ‘me li qala ho hlaha indastering ea PCB ea Amerika ka 1947. PCB substrate indasteri tse bonahalang e kene sethaleng lona ea pele ea ntshetsopele. Mothating ona, lisebelisoa tse tala tse sebelisitsoeng ho hlahiseng thepa ea substrate – organic resin, lisebelisoa tsa matlafatso, foil ea koporo le tsoelo-pele e ngoe ea mahlale a tlhahiso, tsoelo-peleng ea indasteri ea thepa ea substrate ho fana ka tšusumetso e matla. Ka lebaka la sena, theknoloji ea tlhahiso ea thepa ea substrate e qalile ho hola mohato ka mohato.

Ho ella bofelong ba lilemo tsa bo-1980, lihlahisoa tse nkehang tsa elektroniki tse neng li emetsoe ke likhomphutha tsa libuka, mehala ea thekeng le likhamera tse nyane tsa video li ile tsa qala ho kena ‘marakeng. Lihlahisoa tsena tsa elektroniki li nts’etsapele ka potlako ntlheng ea miniaturization, lightweight le multi-function, e khothalletsang haholo tsoelo-pele ea PCB e lebisang ho lesoba le senang terata. Tlas’a phetoho ea tlhokeho ea mmaraka oa PCB, moloko o mocha oa boto ea multilayer e ka bonang wiring e phahameng, BUM (BUM ka bokhutšoanyane) e hlahile lilemong tsa bo-1990. Ts’ebetso ena ea bohlokoa ea mahlale e boetse e etsa hore indasteri ea thepa ea substrate e kene mohatong o mocha oa nts’etsopele o laoloang ke lisebelisoa tsa substrate bakeng sa li-multilayer tse phahameng tsa HD. Mokhahlelong ona o mocha, theknoloji ea setso e apereng koporo e tobane le liphephetso tse ncha. Ho na le liphetoho tse ncha le pōpo e ncha ea thepa ea PCB substrate, ekaba lisebelisoa tsa tlhahiso, mefuta ea tlhahiso, sebopeho sa substrate, litšobotsi tsa ts’ebetso, kapa lits’ebetsong tsa sehlahisoa.

Nts’etsopele ea thepa ea substrate ea PCB e fetile lilemo tse ka bang 50. Ntle le moo, ho bile le lilemo tse ka bang 50 tsa liteko tsa mahlale le tlhahlobo ea lisebelisoa tsa mantlha tse sebelisoang ke indasteri – li-resin le lisebelisoa tsa matlafatso, ‘me thepa ea substrate ea PCB e bokelletse nalane ea lilemo tse ka bang 100. Karolo e ngoe le e ngoe ea nts’etsopele ea indasteri ea thepa ea substrate e tsamaisoa ke boqapi ba lihlahisoa tsa mochini o felletseng oa elektroniki, theknoloji ea tlhahiso ea semiconductor, theknoloji ea ho kenya ka elektroniki le theknoloji ea ho etsa thepa ea potoloho ea elektroniki.