Ukuyilwa kunye nokusetyenziswa kwesekethe emanyanisiweyo kunye nokwenza umsebenzi omncinci kunye nokusebenza okuphezulu kweemveliso zombane PCB izinto ze-substrate zetekhnoloji yezinto kumkhondo wendlela yokusebenza okuphezulu. Ngenxa yokwanda ngokukhawuleza kwemfuno PCB kwimarike zehlabathi, imveliso, ezahlukeneyo kunye nobuchwepheshe PCB zeendawana imveliso iimveliso ziye zaphuhliswa ngesantya esiphezulu. Eli nqanaba izinto zeendawana yesicelo, kwavela umhlaba omtsha obanzi-ibhodi yesekethe eprintiweyo. Kwangelo xesha, eli nqanaba le-substrate yezinto ngokubhekisele kulwakhiwo, liphuhlise ngakumbi ukwahlukahlukana.

Ukususela ekuqaleni kwenkulungwane yama-20 ukuya ekupheleni 1940, PCB zeendawana kushishino izinto waba kwasebusaneni. Iimpawu zalo zophuhliso ziboniswa ikakhulu: ngeli xesha, inani elikhulu le-resins, izinto zokuqinisa kunye ne-substrates zokwambathisa izinto ze-substrate ziye zavela, kwaye itekhnoloji ibikukuhlola kwangaphambili. Zonke ezi zinto zidale iimeko eziyimfuneko ekubonakaleni nasekuphuhlisweni kwepleyiti enxibe ubhedu, eyona nto iqhelekileyo kwibhodi yesekethe eprintiweyo. Kwelinye icala, iteknoloji lemveliso PCB, esebenzisa indlela ngefoyile yeethole indlela (ukuthabatha indlela) ukuvelisa wesekethe njengoko zesiqhelo, iye ekuqaleni yasekwa yaphuhliswa. Idlala indima yokuthatha isigqibo ekumiseleni ukwakheka kobume kunye neemeko ezibonakalayo zepleyiti enxibe ipleyiti.

Iiphaneli eziboshwe ngobhedu zazisetyenziswa kwimveliso ye-PCB kwisikali sokwenyani kwaye yaqala ukubonakala kumzi-mveliso wasePCB waseMelika ngo-1947. Ishishini le-PCB substrate lezinto ezibonakalayo lingene kwinqanaba lalo lokuqala lophuhliso. Kweli nqanaba, izinto ezingasetyenziswanga ekwenziweni kwezinto ze-substrate zokwenza izinto-i-resin ye-organic, izinto zokuqinisa, ifoyile yobhedu kunye nenye inkqubela phambili yetekhnoloji yokuvelisa, kwinkqubela phambili yomzi mveliso we-substrate ukuze unike amandla okomeleza. Ngenxa yoku, i-substrate yetekhnoloji yokuvelisa izinto yaqala ukukhula ngokwamanqanaba.

Ngasekupheleni kweminyaka yoo-1980, iimveliso zekhompyuter eziphathwayo ezimelwe ziikhompyuter zamanqaku, iifowuni eziphathwayo kunye neekhamera ezincinci zevidiyo zaqala ukungena kwintengiso. Ezi mveliso zekhompyuter zikhula ngokukhawuleza kwicala le-miniaturization, ukukhanya kunye nokusebenza okuninzi, okukhuthaza kakhulu inkqubela phambili ye-PCB isiya kumbhobho omncinci kunye nocingo oluncinci. Phantsi kotshintsho lweemfuno zemakethi ye-PCB, isizukulwana esitsha sebhodi yee-multilayer ezinokuqonda ukuba ziintambo ezixineneyo, i-BUM (BUM ngokufutshane) yaphuma nge-1990s. Olu phulo lubalulekileyo lwetekhnoloji lwenza ukuba umzi mveliso we-substrate ungene kwisigaba esitsha sophuhliso esilawulwa zizinto ze-substrate zezixhobo zonxibelelwano oluphezulu (HDI) multilayer. Kweli nqanaba litsha, itekhnoloji yesiko enxibe ubhedu ijongene nemiceli mngeni emitsha. Kukho utshintsho olutsha kunye nokudalwa okutsha kwizinto ze-PCB ze-substrate, nokuba kukwizinto zokuvelisa, iintlobo zemveliso, isakhiwo se-substrate, iimpawu zomsebenzi, okanye kwimisebenzi yemveliso.

Ukuphuhliswa kwezinto ze-PCB ze-substrate sele kudlule phantse iminyaka engama-50. Ukongeza, bekukho malunga neminyaka engama-50 yolingelo lwenzululwazi kunye nokuphononongwa kwezinto ezisisiseko ezisetyenzisiweyo zeshishini- i-resins kunye nezinto zokomeleza, kunye nezinto ze-PCB ze-substrate eziqokelele imbali phantse ye-100 yeminyaka. Inqanaba ngalinye lophuhliso lweshishini lezinto ezingaphantsi komhlaba liqhutywa kukutsha kwemveliso yomatshini e-elektroniki, itekhnoloji yokuvelisa isemiconductor, itekhnoloji yokufaka i-elektroniki kunye netekhnoloji yokuvelisa isekethe.