Ukusungulwa nokusetshenziswa kwesekethe edidiyelwe kanye nokwenziwa kwezinto ezincane nokusebenza okuphezulu kwemikhiqizo ye-elektroniki PCB substrate ubuchwepheshe bezinto ezibonakalayo kumkhondo wentuthuko ephezulu yokusebenza. Ngokukhula okusheshayo kokufunwa kwe-PCB emakethe yomhlaba, okukhiphayo, okuhlukahlukene nobuchwepheshe bemikhiqizo ebonakalayo ye-PCB substrate ithuthukiswe ngesivinini esikhulu. Lesi sigaba sokwenza umsebenzi we-substrate, kuvele inkambu entsha ebanzi – ibhodi yesifunda ephrintiwe enhlobonhlobo. Ngasikhathi sinye, lesi sigaba se-substrate impahla ngokwakhiwa kwesakhiwo, sithuthukise kakhulu ukwehluka kwayo.

Kusukela ekuqaleni kwekhulu lama-20 kuze kube sekupheleni kwawo-1940, imboni ye-PCB substrate yezinto ezibonakalayo yayisanda kuqala. Izici zayo zokuthuthuka ziboniswa kakhulu kulokhu: phakathi nale nkathi, kwavela inqwaba yama-resin, izinto zokuqinisa kanye nama-substrates wokuvikela izinto ezisetshenziswayo, futhi ubuchwepheshe bekungukuhlola kokuqala. Konke lokhu kudale izimo ezidingekayo zokubonakala nokwakhiwa kwepuleti eligqokwe ngethusi, into ejwayelekile kunazo zonke ebhodini lesifunda eliphrintiwe. Ngakolunye uhlangothi, ubuchwepheshe bokukhiqiza be-PCB, obusebenzisa indlela yokwenza ucwecwe lwensimbi (indlela yokukhipha) ukwenza isekethe njengendaba enkulu, sekusungulwe futhi kwathuthukiswa ekuqaleni. Ibamba iqhaza elibonakalayo ekunqumeni ukwakheka kwesakhiwo nezimo zesici sepuleti egqoke ithusi.

Amapaneli agqokwe ngethusi asetshenziswa ekukhiqizeni i-PCB ngezinga langempela futhi aqala ukuvela embonini ye-American PCB ngo-1947. PCB substrate impahla umkhakha ungene isigaba salo sokuqala yentuthuko. Kulesi sigaba, izinto zokusetshenziswa ezisetshenziselwa ukwenziwa kwezinto ezisetshenziswayo – i-resin ephilayo, izinto zokuqinisa, ucwecwe lwethusi nenye inqubekela phambili yobuchwepheshe bokukhiqiza, ekuqhubekeni komkhakha wezinto ezibonakalayo ukuze unikeze umfutho oqinile. Ngenxa yalokhu, ubuchwepheshe bokwenza izinto ezingaphansi komhlaba baqala ukuvuthwa igxathu negxathu.

Ngasekupheleni kweminyaka yama-1980, imikhiqizo ephathekayo ephathekayo eyayimelwe ngamakhompyutha ezincwajana, omakhalekhukhwini, namakhamera amancane evidiyo aqala ukungena emakethe. Le mikhiqizo ye-elekthronikhi ithuthuka ngokushesha ohlangothini lwe-miniaturization, engasindi kanye nokusebenza okuningi, okukhuthaza kakhulu inqubekela phambili ye-PCB ibheke emigodini emincane nakucingo oluncane. Ngaphansi kokushintshwa kwesidingo semakethe ye-PCB, isizukulwane esisha sebhodi le-multilayer elingabona izintambo eziphakeme kakhulu, i-BUM (BUM ngamafuphi) yaphuma ngawo-1990. Lokhu kuqhamuka kwezobuchwepheshe okubalulekile futhi kwenza imboni ye-substrate impahla ingene esigabeni esisha sentuthuko esilawulwa yizinto ezisetshenziswayo ze-high density interconnect (HDI) multilayer. Kulesi sigaba esisha, ubuchwepheshe bendabuko bokugqoka ithusi bubhekene nezinselelo ezintsha. Kukhona izinguquko ezintsha nokudala okusha ku-PCB substrate materials, kungaba ezintweni zokukhiqiza, izinhlobo zokukhiqiza, isakhiwo se-substrate, izici zokusebenza, noma kwimisebenzi yomkhiqizo.

Ukuthuthukiswa kwe-PCB substrate materials kudlule cishe iminyaka engama-50. Ngaphezu kwalokho, bekukhona cishe iminyaka engama-50 yocwaningo lwesayensi nokuhlola ngezinto eziyisisekelo zokusetshenziswa ezisetshenziswa yimboni – izinhlaka kanye nezinto zokuqinisa, nezinto zokwakha ze-PCB substrate zithole umlando weminyaka ecishe ibe yi-100. Isigaba ngasinye sokuthuthukiswa kwemboni yempahla esezingeni eliphansi siqhutshwa ukusungulwa kwemikhiqizo yomshini ophelele we-elekthronikhi, ubuchwepheshe bokukhiqiza be-semiconductor, ubuchwepheshe bokufakwa kwe-elekthronikhi kanye nobuchwepheshe bokwenza ubuchwepheshe besekethe.