abaninzi PCB abathandi boyilo, ngakumbi abaqalayo, abaqondi ngokupheleleyo iileya ezahlukeneyo kuyilo lwePCB. Abawazi umsebenzi kunye nokusetyenziswa kwayo. Nantsi ingcaciso ecwangcisiweyo yomntu wonke:

1. Umaleko oomatshini, njengoko negama lisitsho, yinkangeleko yebhodi yePCB yonke yokubunjwa koomatshini. Enyanisweni, xa sithetha umaleko oomatshini, sithetha inkangeleko iyonke yebhodi PCB. Ingasetyenziselwa ukuseta imilinganiselo yebhodi yesekethe, amanqaku edatha, amanqaku okulungelelaniswa, imiyalelo yendibano kunye nolunye ulwazi lomatshini. Olu lwazi luyahluka ngokuxhomekeke kwiimfuno zenkampani yoyilo okanye umenzi wePCB. Ukongeza, umaleko womatshini unokongezwa kwezinye iileya ukuvelisa kunye nokubonisa kunye.

2. Gcina ngaphandle umaleko (i-wiring enqatshelwe), esetyenziselwa ukuchaza indawo apho amacandelo kunye ne-wiring inokufakwa ngokufanelekileyo kwibhodi yesekethe. Zoba indawo evaliweyo kulo maleko njengendawo esebenzayo yomzila. Uyilo oluzenzekelayo kunye nomzila akwenzeki ngaphandle kwalo mmandla. Uluhlu lwe-wiring olunqatshelwe luchaza umda xa sibeka iimpawu zombane zobhedu. Oko kukuthi, emva kokuba siqale sichaze umgca we-wiring onqatshelwe, kwinkqubo yocingo yexesha elizayo, i-wiring eneempawu zombane ayikwazi ukudlula i-wiring engavumelekanga. Kumda woluhlu, kukho rhoqo umkhwa wokusebenzisa i-Keepout layer njengoluhlu lomatshini. Le ndlela ayilunganga ngokwenene, ngoko kuyacetyiswa ukuba wenze ulwahlulo, ngaphandle koko i-factory yebhodi iya kufuneka itshintshe iimpawu kuwe rhoqo xa uvelisa.

3. Umaleko wesignali: Uluhlu lwesignali lusetyenziswa ikakhulu ukulungiselela iingcingo kwibhodi yesekethe. Kubandakanya umaleko oPhezulu (umaleko ongaphezulu), umaleko ongezantsi (umaleko ongezantsi) kunye ne-30 MidLayer (umaleko ophakathi). Iingqimba eziphezulu kunye nezantsi zibeka izixhobo, kwaye iileyile zangaphakathi zihanjiswa.

4. Top paste and Bottom paste are the top and bottom pad stencil layers, which are the same size as the pads. This is mainly because we can use these two layers to make the stencil when we do SMT. Just dug a hole the size of a pad on the net, and then we cover the stencil on the PCB board, and apply the solder paste evenly with a brush with solder paste, as shown in Figure 2-1.

5. I-Solder ephezulu kunye ne-Bottom Solder Le yimaski ye-solder ukukhusela ioli eluhlaza ukuba ingagqunywa. Sihlala sithi “vula ifestile”. Ubhedu oluqhelekileyo okanye i-wiring zihlanganiswe ngeoli eluhlaza ngokungagqibekanga. Ukuba sisebenzisa imaski ye-solder ngokufanelekileyo Ukuba iphathwa, iya kuthintela ioli eluhlaza ukuyigubungela kwaye iveze ubhedu. Umahluko phakathi kwezi zimbini unokubonwa kulo mfanekiso ulandelayo:

6. Umaleko wendiza yangaphakathi (amandla angaphakathi / umaleko womhlaba): Olu hlobo lomaleko lusetyenziselwa kuphela iibhodi ze-multilayer, ezisetyenziselwa ukucwangcisa imigca yamandla kunye nemigca yomhlaba. Sibiza iibhodi ezinemigangatho ephindwe kabini, iibhodi ezine-four-layer, kunye neebhodi ezithandathu. Inani leeleya zesignali kunye namandla angaphakathi / iileya zomhlaba.

7. Umaleko wesikrini sesilika: Umaleko wescreen sesilika usetyenziswa ikakhulu ukubeka ulwazi oluprintiweyo, olufana nelawuni yecandelo kunye neelebhile, iimpawu ezahlukeneyo zenkcazo, njl. njl. iifayile zesikrini zesilika ezisezantsi ngokulandelelana.

8. I-Multi layer (i-multi-layer): I-pads kunye ne-vias yokungena kwibhodi yesekethe kufuneka ingene kwibhodi yesekethe yonke kwaye iseke uxhulumaniso lombane kunye neepatheni ezahlukeneyo zokuqhuba. Ngoko ke, inkqubo iye yamisela i-abstract layer-multi-layer . Ngokuqhelekileyo, iipads kunye ne-vias kufuneka zicwangciswe kwiileyile ezininzi. Ukuba olu maleko lucinyiwe, iipads kunye ne-vias azikwazi ukuboniswa.

9. I-Drill Drawing (i-drilling layer): I-drilling layer inikezela ngolwazi lokugaya ngexesha lenkqubo yokuvelisa ibhodi yesekethe (ezifana neepads, vias kufuneka zibhorwe). Ialtium ibonelela ngeeleya ezimbini zokomba: Drill grid kunye nomzobo weDrill.