PCB wayoyi zai shafi na gaba Majalisar PCB sarrafawa. Ya kamata mu yi la’akari sosai da faɗin layi da tazarar layi na wayoyi, haɗin kai tsakanin waya da guntu bangaren guntu, waya da SOIC, PLCC, QFP, SOT da sauran na’urori a cikin tsarin ƙirar PCB. Dangantaka tsakanin haɗin pad, faɗin layi da na yanzu, kawai lokacin da waɗannan matsalolin suka yi kyau sosai, za’a iya sarrafa allon PCBA mai inganci.

1. Kewayon waya

Girman bukatu na kewayon wayoyi suna kamar yadda aka nuna a cikin tebur, gami da girman girman ciki da na waje da foil ɗin tagulla zuwa gefen allo da bangon rami mara ƙarfe.

2. Faɗin layi da tazarar layi na wayoyi

A cikin hali na PCBA taro aiki yawa izni, ƙananan yawa wayoyi ya kamata a yi amfani da shi gwargwadon yiwuwa don inganta iyawar masana’anta mara lahani kuma abin dogaro. A halin yanzu, ƙarfin aiki na masana’antun gabaɗaya shine: mafi ƙarancin faɗin layin shine 0.127mm (5mil), kuma mafi ƙarancin tazarar layin shine 0.127mm (5mil). Ana nuna nunin ƙira na ƙira mai yawa wayoyi a cikin tebur.

3. Haɗin kai tsakanin waya da kushin ɓangaren guntu

Lokacin haɗa wayoyi da sassan guntu, bisa manufa, ana iya haɗa su a kowane wuri. Koyaya, don abubuwan haɗin guntu waɗanda aka welded ta hanyar walda reflow, yana da kyau a ƙira bisa ga ƙa’idodi masu zuwa.

a. Don abubuwan da aka sanya tare da pads guda biyu, kamar resistors da capacitors, wayoyi da aka buga da ke da alaƙa da pads ɗin su yakamata a zana su daidai gwargwado daga tsakiyar kushin, kuma wayoyi da aka haɗa da kushin dole ne su kasance da faɗi ɗaya. Don wayoyin gubar tare da faɗin layin ƙasa da 0.3mm (mil 12), ana iya yin watsi da wannan tanadi.

b. Don pads ɗin da aka haɗa da waya mai faɗi mai faɗi, yana da kyau a wuce ta hanyar kunkuntar canjin waya da aka buga a tsakiya. Wannan kunkuntar buga waya yawanci ana kiranta “hanyar rufewa”, in ba haka ba, don 2125 (Turanci shine 0805) ) Kuma waɗannan SMDs masu nau’in guntu suna da lahani ga lahani “tsaye guntu” a lokacin walda. Ana nuna takamaiman buƙatun a cikin adadi.

4. Ana haɗa wayoyi zuwa pads na SOIC, PLCC, QFP, SOT da sauran na’urori

Lokacin haɗa da’ira zuwa kushin SOIC, PLCC, QFP, SOT da sauran na’urori, ana ba da shawarar gabaɗaya jagorantar waya daga ƙarshen kushin, kamar yadda aka nuna a cikin adadi.

5. Alakar tsakanin fadin layi da na yanzu

Lokacin da matsakaicin siginar halin yanzu ya yi girma, dangantakar tsakanin faɗin layi da na yanzu yana buƙatar la’akari. Don takamaiman sigogi, da fatan za a koma zuwa tebur mai zuwa. A cikin ƙira da sarrafa PCB, oz (oce) galibi ana amfani dashi azaman kauri na foil na jan karfe. An ayyana kauri 1oz a matsayin nauyin foil na jan karfe a cikin yanki na inci murabba’i ɗaya, wanda yayi daidai da kauri na jiki na 35μm. Lokacin da aka yi amfani da foil ɗin tagulla azaman waya kuma an wuce babban halin yanzu, dangantakar da ke tsakanin nisa na foil ɗin tagulla da ƙarfin ɗaukar halin yanzu ya kamata a lalata shi da 50% dangane da bayanan da ke cikin tebur.