Iingcingo zePCB ziyakuchaphazela okulandelayo I-PCB Assembly ukuqhubekeka. Sifanele siqwalasele ngokupheleleyo ububanzi bomgca kunye nesithuba somgca we-wiring, ukudibanisa phakathi kocingo kunye ne-chip component pad, i-wire kunye ne-SOIC, i-PLCC, i-QFP, i-SOT kunye nezinye izixhobo kwi-PCB yokuyila isigaba. Ubudlelwane phakathi kodibaniso lwepad, ububanzi bomgca kunye nangoku, kuphela xa ezi ngxaki zijongiwe kakuhle, ibhodi ye-PCBA ekumgangatho ophezulu inokuqwalaselwa.

1. Uluhlu lweengcingo

Iimfuno zobungakanani boluhlu lwee-wiring njengoko kuboniswe kwitheyibhile, kubandakanywa ubungakanani bemigangatho yangaphakathi nangaphandle kunye ne-foil yobhedu ukuya kumda webhodi kunye nodonga lwengxuma olungeyona isinyithi.

2. Ububanzi bomgca kunye nesithuba somgca we-wiring

Kwimeko PCBA indibano processing ingxinano evumela, uxinaniso olusezantsi uyilo lweingcingo kufuneka isetyenziswe kangangoko ukuze kuphuculwe-free-free kunye nokuvelisa amandla athembekileyo. Okwangoku, umthamo wokusetyenzwa wabavelisi ngokubanzi: ubuncinci bobubanzi bomgca yi-0.127mm (5mil), kunye nesithuba esisezantsi semigca yi-0.127mm (5mil). Ireferensi yoyilo loxinaniso lwengcingo esetyenziswa ngokuqhelekileyo iboniswe kwitheyibhile.

3. Uqhagamshelwano phakathi kocingo kunye nephedi yecandelo letshiphu

Xa udibanisa iingcingo kunye namacandelo e-chip, ngokomgaqo, zinokudibaniswa nakweyiphi na indawo. Nangona kunjalo, kumacandelo e-chip adityaniswe yi-welding ye-reflow, kungcono ukuyila ngokwemigaqo elandelayo.

a. Amacandelo afakwe kunye neepads ezimbini, ezifana ne-resistors kunye ne-capacitors, iingcingo eziprintiweyo ezidibaniswe kwiipads zazo kufuneka zikhethwe ngokulinganayo ukusuka kumbindi we-pad, kunye neengcingo eziprintiweyo ezixhunyiwe kwi-pad kufuneka zibe nobubanzi obufanayo. Kwiingcingo ezikhokelayo ezinobubanzi bomgca obungaphantsi kwe-0.3mm (12mil), eli lungiselelo linokungahoywa.

b. Kuba iipads eziqhagamshelwe kwintambo ebanzi eprintiweyo, kungcono ukudlula kwintambo encinci eprintiweyo yokutshintsha phakathi. Olu cingo oluncinci olushicilelweyo luhlala lubizwa ngokuba “indlela yokufaka i-insulation”, ngaphandle koko, i-2125 (isiNgesi yi-0805) ) Kwaye ezi zilandelayo ze-chip-type SMD zixhomekeke kwi-“standing chip” iziphene ngexesha le-welding. Iimfuno ezikhethekileyo ziboniswe kumzobo.

4. Iingcingo zixhunyiwe kwiipads ze-SOIC, i-PLCC, i-QFP, i-SOT kunye nezinye izixhobo

Xa udibanisa isiphaluka kwi-pad ye-SOIC, i-PLCC, i-QFP, i-SOT kunye nezinye izixhobo, ngokuqhelekileyo kucetyiswa ukuba ukhokele ucingo oluvela kwiziphelo zombini zepadi, njengoko kuboniswe kumfanekiso.

5. Ubudlelwane phakathi kobubanzi bomgca kunye nangoku

Xa i-avareji ye-avareji yesignali yangoku inkulu, ubudlelwane phakathi kobubanzi bomgca kunye nangoku kufuneka kuthathelwe ingqalelo. Ngeeparamitha ezithile, nceda ubhekisele kwitheyibhile elandelayo. Kuyilo lwePCB kunye nokusetyenzwa, i-oz (i-ounce) isoloko isetyenziswa njengeyunithi yobunzima befoyile yobhedu. 1oz ubukhulu bobhedu buchazwa njengobunzima befoyile yobhedu kwindawo yesikwere intshi enye, ehambelana nobukhulu bomzimba obuyi-35μm. Xa i-foil yobhedu isetyenziswe njengocingo kwaye i-current enkulu idluliselwe, ubudlelwane phakathi kobubanzi be-copper foil kunye nomthamo okhoyo wokuthwala kufuneka uhlanjululwe ngama-50% ngokubhekiselele kwidatha kwitheyibhile.