Ma waya a PCB adzakhudza zotsatira Pulogalamu ya PCB kukonza. Tiyenera kuganizira mozama kukula kwa mzere ndi kutalika kwa mzere wa mawaya, kugwirizana pakati pa waya ndi chigawo cha chip pad, waya ndi SOIC, PLCC, QFP, SOT ndi zipangizo zina mu gawo la mapangidwe a PCB. Ubale pakati pa pad kugwirizana, mzere m’lifupi ndi panopa, kokha pamene mavutowa bwino anathana ndi, akhoza apamwamba PCBA bolodi kukonzedwa.

1. Wiring range

Zofunikira za kukula kwa ma wiring osiyanasiyana monga momwe tawonetsera patebulo, kuphatikizapo kukula kwa zigawo zamkati ndi zakunja ndi zojambula zamkuwa m’mphepete mwa bolodi ndi khoma lopanda zitsulo.

2. M’lifupi mzere ndi katalikirana mzere wa mawaya

Pankhani ya PCBA msonkhano processing kachulukidwe kulola, m’munsi kachulukidwe mawaya kapangidwe ayenera kugwiritsidwa ntchito mmene ndingathere kusintha chilema wopanda ndi odalirika kupanga luso. Pakali pano, mphamvu yokonza ya opanga ambiri ndi: mzere wocheperako m’lifupi ndi 0.127mm (5mil), ndipo malo ocheperako ndi 0.127mm (5mil). Zolemba zomwe zimagwiritsidwa ntchito nthawi zambiri zikuwonetsedwa patebulo.

3. Kulumikizana pakati pa waya ndi pedi ya chigawo cha chip

Mukalumikiza mawaya ndi zigawo za chip, kwenikweni, zimatha kulumikizidwa nthawi iliyonse. Komabe, pazigawo za chip zomwe zimawotcherera ndi kuwotchereranso, ndikwabwino kupanga molingana ndi mfundo zotsatirazi.

a. Pazigawo zomwe zimayikidwa ndi mapepala awiri, monga resistors ndi capacitors, mawaya osindikizidwa ogwirizanitsidwa ndi mapepala awo ayenera kukokedwa molingana ndi pakati pa pad, ndipo mawaya osindikizidwa ogwirizanitsidwa ndi pad ayenera kukhala ndi m’lifupi mwake. Kwa mawaya otsogolera okhala ndi mzere wocheperapo 0.3mm (12mil), makonzedwe awa akhoza kunyalanyazidwa.

b. Kwa mapepala olumikizidwa ndi waya wosindikizidwa, ndikwabwino kudutsa pakusintha kwa waya wopapatiza pakati. Waya wopapatiza wosindikizidwa nthawi zambiri amatchedwa “njira ya insulation”, apo ayi, chifukwa cha 2125 (Chingerezi ndi 0805) ) Ndipo ma SMD amtundu wa chip wotsatira amakhala ndi zolakwika za “standing chip” panthawi yowotcherera. Zofunikira zenizeni zikuwonetsedwa pachithunzichi.

4. Mawaya amalumikizidwa ndi mapepala a SOIC, PLCC, QFP, SOT ndi zida zina

Mukalumikiza dera ndi pad ya SOIC, PLCC, QFP, SOT ndi zida zina, nthawi zambiri zimalimbikitsidwa kutsogolera waya kuchokera kumalekezero onse a pad, monga momwe tawonetsera pachithunzichi.

5. Ubale pakati pa mzere wa mzere ndi wamakono

Pamene chizindikiro chapakati chamakono chili chachikulu, mgwirizano pakati pa mzere wa mzere ndi wamakono uyenera kuganiziridwa. Kuti mudziwe zambiri, chonde onani tebulo ili pansipa. Pakupanga ndi kukonza kwa PCB, oz (ounce) nthawi zambiri amagwiritsidwa ntchito ngati gawo la makulidwe a zojambulazo zamkuwa. 1oz makulidwe amkuwa amatanthauzidwa ngati kulemera kwa zojambulazo zamkuwa m’dera la inchi imodzi, zomwe zimafanana ndi makulidwe akuthupi a 35μm. Pamene chojambula chamkuwa chikugwiritsidwa ntchito ngati waya ndipo mphamvu yaikulu ikudutsa, mgwirizano pakati pa m’lifupi mwa zojambulazo zamkuwa ndi mphamvu zonyamulira zamakono ziyenera kuchepetsedwa ndi 50% ponena za deta yomwe ili patebulo.