PCB wiring tla ama tse latelang Kopano ea PCB ho sebetsa. Re lokela ho nahana ka botlalo ka bophara ba mohala le sebaka sa marang-rang sa marang-rang, kamano pakeng tsa terata le chip component pad, terata le SOIC, PLCC, QFP, SOT le lisebelisoa tse ling sethaleng sa moralo oa PCB. Kamano e teng pakeng tsa khokahano ea pad, bophara ba mohala le hona joale, feela ha mathata ana a sebetsanoa hantle, boto ea boleng bo holimo ea PCBA e ka sebetsoa.

1. Wiring range

Litlhoko tsa boholo ba marang-rang a marang-rang li bontšitsoe tafoleng, ho kenyelletsa le boholo ba lihlopha tse ka hare le tse ka ntle le foil ea koporo ho ea moeling oa boto le lebota la lesoba le sa entsoeng ka tšepe.

2. Bophara ba mohala le sebaka sa ho arohana ha mohala

Tabeng ea PCBA kopano sebetsa segokanyipalo lumella, tlaase segokanyipalo wiring moralo lokela ho sebelisoa ka hohle kamoo ho ka khonehang ho ntlafatsa sekoli-free le e ka tšeptjoang bokgoni ba tlhahiso. Hona joale, matla a ho sebetsa a bahlahisi ba kakaretso ke: bonyane ba bophara ba mela ke 0.127mm (5mil), ‘me sebaka se fokolang sa mela ke 0.127mm (5mil). Referense ea moralo oa wiring e sebelisoang ka tloaelo e bonts’oa tafoleng.

3. Khokahano pakeng tsa terata le pad ea karolo ea chip

Ha o kopanya lithapo le likarolo tsa chip, ha e le hantle, li ka kopanngoa neng kapa neng. Leha ho le joalo, bakeng sa likarolo tsa chip tse cheselitsoeng ke reflow welding, ho molemo ho etsa moralo ho latela melao-motheo e latelang.

a. Bakeng sa lisebelisoa tse kentsoeng ka liphahlo tse peli, tse kang li-resistors le capacitor, lithapo tse hatisitsoeng tse kopantsoeng le liphahlo tsa tsona li lokela ho huloa ka mokhoa o lekaneng ho tloha bohareng ba pad, ‘me lithapo tse hatisitsoeng tse kopantsoeng le pad li tlameha ho ba le bophara bo lekanang. Bakeng sa lithapo tsa loto tse bophara ba mela e ka tlase ho 0.3mm (12mil), tokisetso ena e ka hlokomolohuoa.

b. Bakeng sa li-pads tse kopantsoeng le mohala o pharaletseng o hatisitsoeng, ho molemo ho feta phetohong e moqotetsane e hatisitsoeng bohareng. Mohala ona o moqotetsane o hatisitsoeng o atisa ho bitsoa “tsela ea insulation”, ho seng joalo, bakeng sa 2125 (Senyesemane ke 0805) ) ‘Me li-SMD tse latelang tsa mofuta oa chip li na le bofokoli ba “standing chip” nakong ea welding. Litlhoko tse khethehileng li bontšoa setšoantšong.

4. Lithapo li hoketsoe ho lipache tsa SOIC, PLCC, QFP, SOT le lisebelisoa tse ling.

Ha o kopanya potoloho ho pad ea SOIC, PLCC, QFP, SOT le lisebelisoa tse ling, ka kakaretso ho kgothaletswa ho tsamaisa terata ho tloha lipheletsong tse peli tsa pad, joalokaha ho bontšitsoe setšoantšong.

5. Kamano e teng pakeng tsa bophara ba mela le hona joale

Ha karolelano ea maqhubu a lets’oao e batla e le kholo, kamano pakeng tsa bophara ba mohala le ea hona joale e hloka ho nahanoa. Bakeng sa li-parameter tse itseng, ka kopo sheba tafole e latelang. Ka moralo le ts’ebetsong ea PCB, oz (ounce) hangata e sebelisoa e le yuniti ea botenya ea foil ea koporo. Botenya ba koporo ea 1oz bo hlalosoa e le boima ba foil ea koporo sebakeng sa lisenthimithara tse 35, tse tsamaellanang le botenya ba ‘mele ba 50μm. Ha foil ea koporo e sebelisoa e le terata ‘me ho fetisoa hona joale e kholo, kamano pakeng tsa bophara ba foil ea koporo le matla a hona joale a ho jara e lokela ho fokotsoa ke XNUMX% ho latela lintlha tse tafoleng.