PCB wiring ichakanganisa zvinotevera PCB Assembly processing. Tinofanira kunyatso funga nezvehupamhi hwemutsara uye mutsara wemitsara yewaya, kubatana pakati pewaya uye chip chikamu pad, waya uye SOIC, PLCC, QFP, SOT uye mamwe maturusi muPCB dhizaini nhanho. Ukama huri pakati pepadhi yekubatanidza, mutsara upamhi uye ikozvino, chete kana matambudziko aya akanyatsogadziriswa, anogona bhodhi repamusoro rePCBA rinogona kugadziriswa.

1. Wiring range

Ukuru hunodiwa hwehutatu hwe wiring hwakaratidzwa mutafura, kusanganisira ukuru hwemukati nekunze kwemukati uye foil yemhangura kumucheto kwebhodhi uye isina-metalized gomba rusvingo.

2. Uhupamhi hwemutsara uye mutsara wemutsara we wiring

Panyaya yePCBA musangano kugadzirisa density inobvumidza, yakaderera density wiring dhizaini inofanirwa kushandiswa zvakanyanya sezvinobvira kuvandudza-isina kukanganisa uye yakavimbika kugadzira kugona. Parizvino, kugona kugadzirisa kwevagadziri vese ndeiyi: hupamhi hwemutsara wepakati i0.127mm (5mil), uye nzvimbo shoma yemutsara i0.127mm (5mil). Inowanzo shandiswa wiring density design reference inoratidzwa mutafura.

3. Kubatana pakati petambo uye padhi ye chip chikamu

Kana uchibatanidza waya uye chip components, mumusimboti, zvinogona kubatanidzwa chero nguva. Zvisinei, kune chip components izvo zvakasungirirwa ne reflow welding, zvakanakisisa kugadzira maererano nemitemo inotevera.

a. Kune zvikamu zvakasimwa nemapadhi maviri, akadai seanopikisa uye capacitors, waya dzakadhindwa dzakabatanidzwa pamapedhi avo dzinofanirwa kudhonzwa zvakaenzana kubva pakati pepadhi, uye waya dzakadhindwa dzakabatanidzwa padhi dzinofanira kuva nehupamhi hwakafanana. Kune waya dzemutobvu dzine hupamhi hwemutsara isingasviki 0.3mm (12mil), gadziriro iyi inogona kuregererwa.

b. Kune mapedhi akabatanidzwa kune yakafara yakadhindwa waya, zviri nani kupfuura nepakati yakamanikana yakadhindwa shanduko yepakati. Iyi nhete yakadhindwa waya inowanzonzi “insulation nzira”, kana zvisina kudaro, ye2125 (Chirungu ndeye 0805) ) Uye zvinotevera chip-type SMDs dzinowanzoita “standing chip” kukanganisa panguva yekuputika. Izvo zvinodiwa chaizvo zvinoratidzwa mumufananidzo.

4. Waya dzakabatana nemapads eSOIC, PLCC, QFP, SOT nemimwe michina.

Kana uchibatanidza dunhu kune padhi yeSOIC, PLCC, QFP, SOT uye zvimwe zvishandiso, zvinowanzokurudzirwa kutungamira waya kubva kumativi ese epadhi, sezvakaratidzwa mumufananidzo.

5. Ukama huri pakati pehupamhi hwemutsara uye ikozvino

Kana chiratidzo cheavhareji chazvino chakakura, hukama pakati pehupamhi hwemutsara uye hwazvino hunoda kutariswa. Kuti uwane mamwe ma parameter, ndapota tarisa kune inotevera tafura. MuPCB dhizaini uye kugadzirisa, oz (ounce) inowanzoshandiswa seyakakora chikamu chemhangura foil. 1oz ukobvu hwemhangura hunotsanangurwa sehuremu hwefoiri yemhangura munzvimbo yeimwe sikweya inch, iyo inoenderana nehupamhi hwemuviri hwe35μm. Kana iyo foil yemhangura inoshandiswa sewaya uye yakakura ikozvino yakapfuura, hukama pakati pehupamhi hwemhangura foil uye ikozvino kutakura simba kunofanira kuderedzwa ne50% maererano nemashoko ari patafura.